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    PACKAGED ELECTRONIC DEVICE COMPRISING INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS
    11.
    发明申请
    PACKAGED ELECTRONIC DEVICE COMPRISING INTEGRATED ELECTRONIC CIRCUITS HAVING TRANSCEIVING ANTENNAS 审中-公开
    包含收发天线的集成电子电路的包装电子设备

    公开(公告)号：WO2013128348A2

    公开(公告)日：2013-09-06

    申请号：PCT/IB2013/051422

    申请日：2013-02-21

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： PAGANI, Alberto

    CPC classification number: H01Q1/2283 ,  H01L21/56 ,  H01L23/13 ,  H01L23/48 ,  H01L23/481 ,  H01L23/66 ,  H01L24/24 ,  H01L25/03 ,  H01L25/065 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24145 ,  H01L2224/73259 ,  H01L2225/06524 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1011 ,  H01L2225/1047 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/00

    Abstract: A base (2) carries a first chip (3) and a second chip (4) oriented differently with respect to the base and packaged in a package (6). Each chip integrates an antenna and a magnetic via (13). A magnetic coupling path connects the chips, forming a magnetic circuit that enables transfer of signals and power between the chips (3, 4) even if the magnetic path is interrupted, and is formed by a first stretch (5c) coupled between the first magnetic-coupling element (13) of the first chip and the first magnetic-coupling element (12) of the second chip, and a second stretch (5f) coupled between the second magnetic-coupling element (12) of the first chip and the second magnetic-coupling element (13) of the second chip. The first stretch has a parallel portion (5c1, 5c3) extending parallel to the faces (2a, 2b) of the base. The first and second stretches have respective transverse portions (5i1, 5i2) extending on the main surfaces of the second chip, transverse to the parallel portion.

    Abstract translation: 基座（2）承载相对于基座不同定向并封装在封装（6）中的第一芯片（3）和第二芯片（4）。 每个芯片集成天线和磁通（13）。 磁耦合路径连接芯片，形成磁路，即使磁路被中断也能够在芯片（3,4）之间传递信号和电力，并且通过耦合在第一磁性体之间的第一拉伸（5c）形成 第一芯片的耦合元件（13）和第二芯片的第一磁耦合元件（12）以及耦合在第一芯片的第二磁耦合元件（12）和第二芯片之间的第二拉伸（5f） 第二芯片的磁耦合元件（13）。 第一拉伸具有平行于基部的表面（2a，2b）延伸的平行部分（5c1,5c3）。 第一和第二延伸部具有横向于平行部分的在第二芯片的主表面上延伸的相应横向部分（5i1,5i2）。

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING HUMIDITY AND/OR ENVIRONMENTAL ACIDITY/BASICITY AND/OR CORROSION
    12.
    发明申请
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING HUMIDITY AND/OR ENVIRONMENTAL ACIDITY/BASICITY AND/OR CORROSION 审中-公开
    用于监测湿度和/或环境酸度/基本和/或腐蚀的集成电子设备

    公开(公告)号：WO2014155348A1

    公开(公告)日：2014-10-02

    申请号：PCT/IB2014/060249

    申请日：2014-03-28

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： PAGANI, Alberto ,  MURARI, Bruno

    IPC: G01N27/22

    CPC classification number: G01N27/223 ,  G01N17/04

    Abstract: An integrated electronic device 1 for detecting at least one parameter related to humidity and/or presence of water and/or acidity/basicity of an environment surrounding the device is described. Such device 1 comprises a separation layer 14 from the surrounding environment, comprising at least one portion of insulating material 14, and further comprises a first conductive member 11 and a second conductive member 12, made of an electrically conductive material, arranged inside the separation layer 14, with respect to the surrounding environment, and separated from the surrounding environment by the separation layer 14. The device 1 also comprises a measurement module 15, having two measurement terminals 151, 152, electrically connected with the first 11 and the second 12 conductive members, respectively; the measurement module 15 is configured to provide an electric potential difference between the first 11 and the second 12 conductive members. The device 1 further comprises electrode means 13, configured to act as an electrode, arranged outside of the separation layer 14, with respect to the first 11 and the second 12 conductive members; the electrode means 13 are arranged so as to form, with the first 11 and the second 12 conductive members, an electromagnetic circuit having an electromagnetic circuit overall impedance variable based upon the exposure to environmental conditions with a variable level of humidity and/or acidity/basicity. The measurement module 15 is configured to measure the electromagnetic circuit overall impedance, which is present between the measurement terminals 151, 152, and to determine the at least one parameter to be detected, based on the overall impedance measured.

    Abstract translation: 描述了用于检测与湿度和/或水的存在和/或设备周围环境的酸度/碱度相关的至少一个参数的集成电子设备1。 这种装置1包括与周围环境的分离层14，其包括绝缘材料14的至少一部分，并且还包括布置在分离层内部的由导电材料制成的第一导电构件11和第二导电构件12 14，相对于周围环境，并且通过分离层14与周围环境分离。装置1还包括测量模块15，其具有两个测量端子151,152，与第一11和第二导电12电连接 成员分别; 测量模块15被配置为提供第一11和第二导电构件12之间的电位差。 装置1还包括电极装置13，其被配置为相对于第一11和第二导电构件作为布置在分离层14外侧的电极; 电极装置13被布置成与第一11和第二12导电构件形成电磁电路，该电磁电路具有基于暴露于具有可变湿度和/或酸度/湿度的环境条件的总体阻抗变化， 碱性。 测量模块15被配置为基于测量的总阻抗来测量存在于测量端子151,152之间的电磁回路总阻抗，并且确定要检测的至少一个参数。

    A PACKAGE, MADE OF BUILDING MATERIAL, FOR A PARAMETER MONITORING DEVICE, WITHIN A SOLID STRUCTURE, AND RELATIVE DEVICE
    14.
    发明申请
    A PACKAGE, MADE OF BUILDING MATERIAL, FOR A PARAMETER MONITORING DEVICE, WITHIN A SOLID STRUCTURE, AND RELATIVE DEVICE 审中-公开
    用于参数监测装置的建筑材料制品，固体结构中的相关装置

    公开(公告)号：WO2013174946A1

    公开(公告)日：2013-11-28

    申请号：PCT/EP2013/060669

    申请日：2013-05-23

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： PAGANI, Alberto ,  MURARI, Bruno ,  ZIGLIOLI, Federico Giovanni ,  RONCHI, Marco ,  RICOTTI, Giulio

    IPC: G01D11/24 ,  G01M5/00

    CPC classification number: G01D11/245 ,  B28B23/0031 ,  G01K17/00 ,  G01L1/18 ,  G01M5/00 ,  G01N33/383

    Abstract: A package (15) for devices (100) insertable into a solid structure (300) for detecting and monitoring one or more local parameters is described. The package (15) is made of a building material formed of particles of micrometric or sub-micrometric dimensions. A device (100) for detecting and monitoring one or more local parameters within a solid structure is further described. The device (100) comprises an integrated detection module (1), having at least one integrated sensor (10), and a package (15), having the above-mentioned characteristics, so arranged as to coat at least one portion of the device (100), comprising the integrated detection module (1). A method for manufacturing the device (100), and a system (200) for monitoring parameters in a solid structure (300), comprising such a device (100), are also described.

    Abstract translation: 描述了可插入到用于检测和监视一个或多个局部参数的实体结构（300）中的装置（100）的封装（15）。 包装（15）由由微米或亚微米尺寸的颗粒形成的建筑材料制成。 进一步描述用于检测和监视固体结构内的一个或多个局部参数的装置（100）。 装置（100）包括具有至少一个集成传感器（10）的集成检测模块（1）和具有上述特征的封装（15），其被布置成涂覆该装置的至少一部分 （100），包括所述集成检测模块（1）。 还描述了用于制造装置的方法（100），以及用于监视包括这种装置（100）的实体结构（300）中的参数的系统（200）。

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PRESSURE WITHIN A SOLID STRUCTURE
    15.
    发明申请
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PRESSURE WITHIN A SOLID STRUCTURE 审中-公开
    用于在固体结构中监测压力的集成电子设备

    公开(公告)号：WO2014155326A2

    公开(公告)日：2014-10-02

    申请号：PCT/IB2014/060203

    申请日：2014-03-27

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： PAGANI, Alberto

    IPC: G01L25/00

    CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

    Abstract: The invention relates to an integrated electronic device (400; 400a; 500, 500'; 600, 600'; 700, 700') on a semiconductor material chip for detecting the pressure related to a force (F) applied in a predetermined direction (d) within a solid structure. The device comprises: - an integrated element (51) defined by an operating surface of the chip (52) that is substantially orthogonal to the direction (d) of application of the force; first (53) and second (54) conductive elements accommodated within the substrate element (51) and configured to face the operating surface; a measure module (55) accommodated within the substrate element and comprising first (56) and second (57) measurement terminals which are electrically connected to the first (53) and second (54) conductive elements, respectively; a detecting element (58) arranged in the predetermined direction (d) such that the operating surface (52) is sandwiched between the first (53) and second (54) conductive elements and this detecting element ( 58 ); - an insulating layer (59) suitable to coat at least the operating surface in order to galvanically insulate the first (53) and second (54) conductive elements. The device comprises a layer of dielectric material (510, 510') which is at least sandwiched between the detecting element (58) and the insulating layer (59). The layer of dielectric material is elastically deformable following the application of the force (F) in the predetermined direction to change an electromagnetic coupling between the detecting element (58) and the above-mentioned first (53) and second (54) conductive elements.

    Abstract translation: 本发明涉及一种半导体材料芯片上的集成电子设备（400; 400a; 500,500'; 600,600'; 700,700'），用于检测与沿预定方向施加的力（F）相关的压力 d）在固体结构内。 该装置包括：由芯片（52）的操作表面限定的与施加力的方向（d）基本正交的集成元件（51）; 第一（53）和第二（54）导电元件，其容纳在所述衬底元件（51）内并被配置为面对所述操作表面; 测量模块（55），其容纳在所述衬底元件内并且包括分别电连接到所述第一（53）和第二（54）导电元件的第一测量端子（56）和第二测量端子（57） 沿预定方向（d）布置的检测元件（58），使得操作表面（52）夹在第一（53）和第二（54）导电元件和该检测元件（58）之间; - 绝缘层（59），其适于至少涂覆所述操作表面以使所述第一（53）和第二（54）导电元件电绝缘。 该装置包括至少夹在检测元件（58）和绝缘层（59）之间的电介质材料层（510,510'）。 介电材料层可以沿预定方向施加力（F）而弹性变形，以改变检测元件（58）和上述第一（53）和第二（54）导电元件之间的电磁耦合。

    NETWORK OF ELECTRONIC DEVICES ASSEMBLED ON A FLEXIBLE SUPPORT AND COMMUNICATION METHOD
    16.
    发明申请
    NETWORK OF ELECTRONIC DEVICES ASSEMBLED ON A FLEXIBLE SUPPORT AND COMMUNICATION METHOD 审中-公开
    电子设备网络组装在灵活的支持和通信方法上

    公开(公告)号：WO2013178529A2

    公开(公告)日：2013-12-05

    申请号：PCT/EP2013/060635

    申请日：2013-05-23

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： PAGANI, Alberto

    IPC: H01Q1/22 ,  H01L23/64 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H04B5/00 ,  H02J5/00 ,  G06K19/077

    CPC classification number: H04B5/0075 ,  A61B5/6804 ,  A61B2562/164 ,  H01F38/14 ,  H01L23/5387 ,  H01L23/645 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3025 ,  H01Q1/2225 ,  H01Q1/273 ,  H01Q1/526 ,  H01Q7/00 ,  H02J7/025 ,  H02J17/00 ,  H02J50/10 ,  H02J50/12 ,  H02J50/40 ,  H02J50/70 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0081 ,  H01L2924/00

    Abstract: The network (100) of electronic devices is formed on a flexible substrate (15; 101) by a plurality of electronic devices (1; 104) assembled on the flexible substrate. The electronic devices have an embedded antenna for mutual coupling (4; 111) of a wireless type. Each electronic device (1; 104) is formed by a chip or a complex system integrating a transceiver circuit (3) connected to the embedded antenna (4; 11) and a functional part (12; 112) connected to the transceiver circuit and including at least one element chosen in the group comprising: a sensor, an actuator, an interface, an electrode, a memory, a control unit, a power-supply unit, a converter, an adapter, a digital circuit, an analog circuit, an RF circuit, a microelectromechanical system, an electrode, a well, a cell, a container for liquids. The flexible support may be a substrate (15) of plastic material that incorporates the electronic devices or a garment having smart buttons that house the electronic devices.

    Abstract translation: 电子设备的网络（100）通过组装在柔性基板上的多个电子设备（1; 104）形成在柔性基板（15; 101）上。 电子设备具有用于无线类型的互连（4; 111）的嵌入式天线。 每个电子设备（1; 104）由集成连接到嵌入式天线（4; 11）的收发器电路（3）和连接到收发器电路的功能部件（12; 112）的芯片或复合系统形成，并且包括 在组中选择的至少一个元件包括：传感器，致动器，接口，电极，存储器，控制单元，电源单元，转换器，适配器，数字电路，模拟电路， RF电路，微机电系统，电极，阱，电池，液体容器。 柔性支撑件可以是包含电子装置的塑料材料的基底（15）或具有容纳电子装置的智能按钮的衣服。

    RETINAL PROSTHESIS
    17.
    发明授权
    RETINAL PROSTHESIS 有权
    视网膜移植

    公开(公告)号：EP2658490B1

    公开(公告)日：2015-02-11

    申请号：EP11817247.7

    申请日：2011-12-30

    Applicant: STMicroelectronics S.r.l.

    Inventor： PAGANI, Alberto

    IPC: A61F2/14 ,  A61F9/08 ,  A61N1/05 ,  A61N1/36

    CPC classification number: A61F2/14 ,  A61F2/148 ,  A61F9/08 ,  A61F2250/0002 ,  A61N1/0543 ,  A61N1/36 ,  A61N1/36046

    Abstract: A retinal prosthesis including an electronic stimulation unit housed inside an eye and including: a plurality of electrodes that contact a portion of a retina of the eye; an electronic control circuit, which is electrically connected to the electrodes and supplies to the electrodes electrical stimulation signals designed to stimulate the portion of retina; and a local antenna connected to the electronic control circuit. The retinal prosthesis further includes an electromagnetic expansion housed inside the eye and formed by a first expansion antenna and a second expansion antenna electrically connected together, the first expansion antenna being magnetically or electromagnetically coupled to an external antenna, the second expansion antenna being magnetically or electromagnetically couple to the local antenna, the electromagnetic expansion moreover receiving an electromagnetic supply signal transmitted by the external antenna and generating a corresponding replica signal.

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE
    19.
    发明公开
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE 有权
    用于监测PARAMENETERN集成电子设备以坚固的结构和监控系统使用这种VORRICHUNG

    公开(公告)号：EP2656057A1

    公开(公告)日：2013-10-30

    申请号：EP11771170.5

    申请日：2011-10-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： PAGANI, Alberto ,  MURARI, Bruno

    IPC: G01N27/20 ,  G01N33/38 ,  G01L1/18

    CPC classification number: G01N27/00 ,  G01L1/26 ,  G01M5/0083

    Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

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