Abstract:
A process for manufacturing a MEMS micromirror device from a monolithic body (104) of semiconductor material. Initially, a buried cavity (106) is formed in the monolithic body and delimits at the bottom a suspended membrane (105) arranged between the buried cavity (106) and a main surface (104A) of the monolithic body (104). Then, the suspended membrane (105) is defined to form a supporting frame (115) and a mobile mass (114) rotatable about an axis (C) and carried by the supporting frame (115). The mobile mass forms an oscillating mass (107), supporting arms (109), spring portions (111), and mobile electrodes (112) combfingered to fixed electrodes (113). A reflecting region (145) is formed on top of the oscillating mass (107).
Abstract:
A MEMS device including: a fixed structure (10); a mobile structure (12), which comprises a reflecting element (90); a first deformable structure (22) and a second deformable structure (24), which are arranged between the fixed structure and the mobile structure. Each one of the first and second deformable structures comprises a respective number of main piezoelectric elements (40). The main piezoelectric elements (40', 40") of the first and second deformable structures can be electrically controlled for causing oscillations of the mobile structure about a first axis (A 1 ) and a second axis (A 2 ), respectively. The first deformable structure further comprises a respective number of secondary piezoelectric elements (42'), which can be electrically controlled so as to vary a first resonance frequency of the mobile structure about the first axis.
Abstract:
A microelectromechanical mirror device (20) has, in a die (1') of semiconductor material: a fixed structure (4) defining a cavity (3); a tiltable structure (2) carrying a reflecting region (2'), elastically suspended above the cavity (3) and having a main extension in a horizontal plane (xy); at least one first pair of driving arms (12a, 12b), carrying respective piezoelectric structures (13) which can be biased to generate a driving force such as to cause a rotation of the tiltable structure (2) about a rotation axis (X) parallel to a first horizontal axis (x) of the horizontal plane; elastic suspension elements (6a, 6b), which elastically couple the tiltable structure (2) to the fixed structure (4) at the rotation axis (X) and are rigid to movements out of the horizontal plane (xy) and compliant to torsion about the rotation axis (X). In particular, the driving arms (12a, 12b) of the first pair are magnetically coupled to the tiltable structure (2) so as to cause its rotation about the rotation axis (X) by magnetic interaction, following biasing of the respective piezoelectric structures (13) .
Abstract:
A microelectromechanical mirror device (20) has, in a die (1') of semiconductor material: a fixed structure (4) defining a cavity (3); a tiltable structure (2) carrying a reflecting region (2'), elastically suspended above the cavity (3) and having a main extension in a horizontal plane (xy); at least one first pair of driving arms (12a, 12b), carrying respective piezoelectric structures (13) which can be biased to generate a driving force such as to cause a rotation of the tiltable structure (2) about a rotation axis (X) parallel to a first horizontal axis (x) of the horizontal plane; elastic suspension elements (6a, 6b), which elastically couple the tiltable structure (2) to the fixed structure (4) at the rotation axis (X) and are rigid to movements out of the horizontal plane (xy) and compliant to torsion about the rotation axis (X). In particular, the driving arms (12a, 12b) of the first pair are magnetically coupled to the tiltable structure (2) so as to cause its rotation about the rotation axis (X) by magnetic interaction, following biasing of the respective piezoelectric structures (13) .
Abstract:
The MEMS actuator (100) is formed by: a substrate (105); a mobile mass (120) that is suspended over the substrate in a first direction (Z) and extends mainly in a plane that defines a second direction (Y) and a third direction (X) perpendicular to the first direction; elastic elements (123A, 123B) arranged between the substrate and the mobile mass and having a first compliance, in a direction parallel to the first direction, lower than a second compliance, in a direction parallel to the second direction; and piezoelectric actuation structures (130A-130D, 135) having a portion fixed with respect to the substrate and a portion configured to deform in the first direction in the presence of an actuation voltage. The MEMS actuator is further formed by movement-transformation structures (126A-126D) coupled to the piezoelectric actuation structures and having an elastic movement-conversion structure (160) arranged between a piezoelectric actuation structure and the mobile mass. The elastic movement-conversion structure is compliant in a plane (YZ) formed by the first and the second directions and has a first principal axis of inertia (Ii) and a second principal axis of inertia (I 2 ) transverse to the first and the second directions.
Abstract:
MEMS device (20) comprising: a semiconductor body (21) with a cavity (23) and forming an anchor portion (24'); a tiltable structure (22) elastically suspended on the cavity (23); a first and a second support arm (25A, 25B) to support the tiltable structure (22); a first and a second piezoelectric actuation structure (30A1, 30A2) biasable to deform mechanically, generating a rotation of the tiltable structure (22) around a rotation axis (A). The piezoelectric actuation structures (30A1, 30A2) carry a first (41A1) and, respectively, a second piezoelectric displacement sensor (41A2) of the MEMS device (20). When the tiltable structure (22) rotates around the rotation axis (A), the displacement sensors (41A1, 41A2) are subject to respective mechanical deformations and generate respective sensing signals in phase opposition to each other, indicative of the rotation of the tiltable structure (22). The sensing signals are configured to be acquired in a differential manner.
Abstract:
Disclosed herein is an optical module including a substrate, with an optical detector, laser emitter, and support structure being carried by the substrate. An optical layer includes a fixed portion carried by the support structure, a movable portion (16) affixed between opposite sides of the fixed portion by a spring structure, and a lens system (17a, 17b) carried by the movable portion (16). The movable portion (16) has at least one opening defined therein across which the lens system (17a, 17b) extends, with at least one supporting portion extending across the at least one opening to support the lens system (17a, 17b). The optical layer further includes a MEMS actuator for in-plane movement of the movable portion (16) with respect to the fixed portion. In an embodiment, the moving portion (16) includes a shuttle (20), with the lenses (17a, 17b) affixed within openings thereof. Flexures (22a-22d) formed using MEMS technology extend in a squared off S-pattern from the corners of the shuttle (20) to anchor points (23a-23d) that are affixed to the fixed portion. Conductive combs (25a, 25b) extend from the sides of the shuttle (20), and are interdigitated with conductive combs (26a, 26b) that extend from comb drive actuators (24a, 24b) that are respectively affixed to the fixed portion. The shuttle (20) is moved back and forth in the x-direction via electrostatic actuation to thereby scan the laser pulses emitted by the laser emitter across the scene to permit detection of reflections therefrom.
Abstract:
The MEMS micromirror device (20) is formed in a package (24) including a containment body (22) and a lid (26) transparent to a light radiation. The package forms a cavity (23) housing a tiltable platform (21) having a reflecting surface (21A). A metastructure (30-32) is formed on the lid (26) and/or on the reflecting surface (21A) and comprises a plurality of diffractive optical elements (35).
Abstract:
The MEMS actuator (150) is formed by a substrate (50'), which surrounds a cavity (100); by a deformable structure (105) suspended on the cavity; by an actuation structure (65) formed by a first piezoelectric region (61) of a first piezoelectric material, supported by the deformable structure and configured to cause a deformation of the deformable structure; and by a detection structure (90) formed by a second piezoelectric region (80) of a second piezoelectric material, supported by the deformable structure and configured to detect the deformation of the deformable structure.