Abstract:
A memory device (100) is proposed. The memory device includes a matrix (105) of memory cells (P h,k ,T h,k ) arranged in a plurality of rows and a plurality of columns, each memory cell including a functional element (P h,k ) with a programmable resistivity and a unidirectional conduction access element (T h,k ) connected in series, a plurality of word lines (WL h ) and a plurality of bit lines (BL k ), the memory cells of each row being connected to a corresponding word line and the memory cells of each column being connected to a corresponding bit line, means (120) for driving the bit lines to a desired voltage, means (110c,115) for selecting at least one bit line in an operative condition of the memory device, each selected bit line being connected to the means for driving and each deselected bit line being disconnected from the means for driving, and means (110r) for selecting a word line in the operative condition, each access element associated with the selected word line and the at least one selected bit line being forward biased and the other access elements being reverse biased; the memory device further includes means (Pd h ,Td h ;B k ,Bd,205,S k ,Sd;D k ,Dd,303-320) for biasing the deselected bit lines in the operative condition to prevent a leakage current of the reverse biased access elements from forward biasing the access elements associated with the selected word line and the deselected bit lines.
Abstract:
A phase-change memory device includes a plurality of data PCM cells (13), for storing data bits; data decoding circuits (14, 27, 28a), for selectively addressing sets of data PCM cells (13); and data read/program circuits (20a), for reading and programming the selected data PCM cells (13). The device further includes a plurality of parity PCM cells (25), for storing parity bits associated to data bits stored in the data PCM cells (13); parity decoding circuits (14, 27, 28b), for selectively addressing sets of parity PCM cells (25); and parity read/program circuits (20b), for reading and programming the selected parity PCM cells (25).
Abstract:
A phase change memory device with memory cells (2) formed by a phase change memory element (3) and a selection switch (4) . A reference cell (2a) formed by an own phase change memory element (3a) and an own selection switch (4a) is associated to a group (7) of memory cells to be read. An electrical quantity of the group of memory cells is compared with an analogous electrical quantity of the reference cell, thereby compensating any drift in the properties of the memory cells.
Abstract:
A phase change memory device includes a plurality of PCM cells (3), arranged in rows and columns, PCM cells (3) arranged on the same column being connected to a same bit line (10); a plurality of first selectors (12), each coupled to a respective PCM cell (3); an addressing circuit (4, 5) for selectively addressing at least one of the bit lines (10), one of the first selectors (12), and the PCM cell (3) connected to the addressed bit line (10) and to the addressed first selector (12); and a regulated voltage supply circuit (7, 14, 15), selectively connectable to the addressed bit line (10), for supplying a bit line voltage (V BL ). The bit line voltage (V BL ) is correlated to a first control voltage (V EBA ) on the addressed first selector (12), coupled to the addressed PCM cell (3).
Abstract:
The phase-change nonvolatile memory array (8) is formed by a plurality of memory cells (10, 10') extending in a first and in a second direction orthogonal to each other. A plurality of column-selection lines (11) extend parallel to the first direction. A plurality of word-selection lines (12) extend parallel to the second direction. Each memory cell (10, 10') includes a PCM storage element (15) and a selection transistor (16). A first terminal of the selection transistor is connected to a first terminal of the PCM storage element, and the control terminal of the selection transistor is connected to a respective word-selection line (12). A second terminal of the PCM storage element (15) is connected to a respective column-selection line (11), and a second terminal of the selection transistor (16) is connected to a reference-potential region (18) while reading and programming the memory cells (10, 10').
Abstract:
A nonvolatile memory device (1') is described comprising a memory array (2), a row decoder (3) and a column decoder (4) for addressing the memory cells (7) of the memory array (2), and a biasing stage (13,19) for biasing the drain terminal of the addressed memory cell (7). The biasing stage (13,19) is coupled between the column decoder (4) and the memory array (2) and comprises a biasing transistor (13) having a drain terminal connected to the column decoder (4), a source terminal connected to the drain terminal of the addressed memory cell (7), and a gate terminal receiving a driving signal of a logic type, the logic levels whereof are defined by precise and stable voltages and are generated by a first driving circuit (19) formed by a driving stage (20) and a buffer (21), cascade-connected.
Abstract:
In a nonvolatile memory device, data stored in a memory cell (21a, 21b) are associated to whether or not the memory cell is switchable between a first state and a second state. Memory cells are irreversibly programmed by applying an irreversible programming signal (I IRP ), such that the nonvolatile memory cells (21a) are made not switchable between the first state and the second state in response to the irreversible programming signal (I IRP ). Reading memory cells includes: assessing (100, 110, 120, 140, 150, 160) whether a memory cell (21a, 21b) is switchable between a first state and a second state; determining that a first irreversible logic value ("1") is associated to the memory cell (21a), if the memory cell (21a) is not switchable between the first state and the second state (130); and determining that a second irreversible logic value ("0") is associated to the memory cell (21b), if the memory cell (21b) is switchable between the first state and the second state (170).