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公开(公告)号：SG184257A1
公开(公告)日：2012-11-29
申请号：SG2012071130
申请日：2011-03-03
Applicant: TORAY INDUSTRIES
Inventor： MAEDA AKIHIRO , ONO EIJI , SAWAMURA YASUSHI
Abstract: METAL SUPPORT FLEXIBLE BOARD, METAL SUPPORT CARRIER TAPE FOR TAPE AUTOMATED BONDING USING SAME, METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR MOUNTING LED, AND COPPER FOIL-LAMINATED METAL SUPPORT FLEXIBLE CIRCUIT BOARD FOR FORMING CIRCUITAbstractDisclosed is a metal support flexible wiring board which has excellent wire bonding properties and low curling properties while maintaining excellent insulating properties and punching properties, and therefore can be subjected to a reel-to-reel process and facilitates packaging scheme and heat dissipation scheme. Specifically disclosed is a metal support flexible board comprising (1) an adhesive layer and (2) a support layer, wherein the support (2) is composed of a metal foil, and the adhesive layer (1) contains (A) a polyamide resin containing a dimer acid residue and (B) a phenol resin.
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公开(公告)号：DE69732004D1
公开(公告)日：2005-01-27
申请号：DE69732004
申请日：1997-02-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L23/495 , H01L23/498 , H01L21/60
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：DE69222670D1
公开(公告)日：1997-11-20
申请号：DE69222670
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4 min -dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：CA2061801A1
公开(公告)日：1992-08-27
申请号：CA2061801
申请日：1992-02-25
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95 by weight, based on the total epoxy resin composition, of a filler.
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公开(公告)号：AT432531T
公开(公告)日：2009-06-15
申请号：AT04009915
申请日：1997-02-19
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: H01L21/60 , C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L23/495 , H01L23/498
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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Patent Agency Ranking
公开(公告)号：HK1008913A1
公开(公告)日：1999-07-30
申请号：HK98109639
申请日：1998-08-03
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , KIGOSHI SHOJI , HATANO TAKU , KONISHI YUKITSUNA , ANDO YOSHIO
IPC: C08G59/24 , C08L55/00 , C08L77/00 , C09J7/02 , C09J163/00 , H01L23/495 , H01L23/498 , H01L , C08G , C09J
Abstract: An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110 DEG C after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130 DEG C and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170 DEG C after having been cured, a storage elastic modulus E' of 20 to 100 MPa at 150 DEG C and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130 DEG C and 85 % RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.
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公开(公告)号：DE69113666T2
公开(公告)日：1996-05-09
申请号：DE69113666
申请日：1991-04-04
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , SAWAMURA YASUSHI , TANAKA MASAYUKI , KAYABA KEIJI , TESHIBA TOSHIHIRO
Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition.
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公开(公告)号：DE69023019T2
公开(公告)日：1996-04-18
申请号：DE69023019
申请日：1990-02-20
Applicant: TORAY INDUSTRIES
Inventor： KAYABA KEIJI , SAWAMURA YASUSHI , TANAKA MASAYUKI
IPC: H01L23/29
Abstract: A semiconductor-encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a filler and (D) a silane coupling agent having a secondary amino group. This composition has an excellent moldability and reliability, and a good solder dipping stability.
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公开(公告)号：DE69113666D1
公开(公告)日：1995-11-16
申请号：DE69113666
申请日：1991-04-04
Applicant: TORAY INDUSTRIES
Inventor： HONDA SHIRO , SAWAMURA YASUSHI , TANAKA MASAYUKI , KAYABA KEIJI , TESHIBA TOSHIHIRO
Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises (i) an epoxy resin (A) comprising at least one of a bifunctional epoxy resin (a1) having a biphenol skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler comprising fused silica (C) consisting of 97 to 50 wt% of crushed fused silica (C1) of a mean particle diameter not more than 10 mu m and 3 to 50 wt% of spherical fused silica (C2) of a mean particle diameter not more than 4 mu m, wherein the mean particle diameter of the spherical fused silica is smaller than the mean particle diameter of the crushed fused silica, and the amount of the filler is 75 to 90 wt% of the total weight of the composition.
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公开(公告)号：JPH0567707A
公开(公告)日：1993-03-19
申请号：JP3931092
申请日：1992-02-26
Applicant: TORAY INDUSTRIES
Inventor： SAWAMURA YASUSHI , TESHIBA TOSHIHIRO , TANAKA MASAYUKI
Abstract: PURPOSE:To improve reliability on moisture resistance after a thermal cycle by containing epoxy resin, curing agent and fillers and using a biphenyl compound as an essential component in the curing agent. CONSTITUTION:A cresol novolak type epoxy resin, etc., having two or more of epoxy groups in one molecule are employed as epoxy resin. A phenol novolak resin, etc., using a biphenyl compound shown in formula are employed as curing agent. The biphenyl compound contained in the curing agent is comprised in the curing agent at the rate of 5-90wt.%. Amorphous silica, crystalline silica, etc., are used as fillers. The loads of the fillers are brought to 70-95wt.% of the whole epoxy resin composition. Each three kind of components are melted and kneaded, cooled and ground by a banbury mixer, etc., to prepare an epoxy resin composition, and a semiconductor element is sealed. Accordingly, the reliability of a semiconductor can be improved.
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