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公开(公告)号:AT336738T
公开(公告)日:2006-09-15
申请号:AT01935209
申请日:2001-05-10
Applicant: XEROX CORP
Inventor: CHUA CHRISTOPHER L , LEMMI FRANCESCO , VAN SCHUYLENBERGH KOENRAAD F , LU JENG PING , FORK DAVID K , PEETERS ERIC , SUN DECAI , SMITH DONALD L , ROMANO LINDA T
IPC: H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02 , G03C5/56 , G03C5/58 , H01L33/00 , H01L21/027 , G03F7/00
Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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公开(公告)号:DE60117216T2
公开(公告)日:2006-07-27
申请号:DE60117216
申请日:2001-12-04
Applicant: XEROX CORP
Inventor: SUN DECAI , ROSA MICHEL A , YEH CHINGWEN
Abstract: A micro-optical-electrical-mechanical laser scanner is configured from a silicon-on-insulator substrate having a silicon substrate layer, a buried oxide layer, and a single crystal silicon device layer. A first device layer portion having a micro-mirror (34) fabricated therefrom. A laser (36) is connected to a second device layer portion, and a hinge (24) connects the first device layer portion and the second device layer portion. The hinge is formed with a bimorph material, wherein the bimorph material creates built-in stresses in the hinge. The bimorph hinge moves the released micro-mirror out of the horizontal plane to a position for either directly or indirectly reflecting laser light emitted from the laser.
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公开(公告)号:DE60101134T2
公开(公告)日:2004-04-15
申请号:DE60101134
申请日:2001-11-21
Applicant: XEROX CORP
Inventor: ROSA MICHAEL A , SUN DECAI
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公开(公告)号:BR0204637A
公开(公告)日:2003-09-16
申请号:BR0204637
申请日:2002-11-12
Applicant: XEROX CORP
Inventor: SUN DECAI , ROSA MICHEL A
IPC: G02B3/00 , H01S5/00 , H01S5/022 , H01S5/026 , H01S5/183 , H01S5/40 , H01S5/42 , H04N1/192 , G11B7/125
Abstract: A highly compact laser scanner with no moving parts includes a vertical cavity surface emitting laser (VCSEL). A microlens is mounted directly to the light emitting surface of the VCSEL via flip chip bonding. The VCSEL array may be one or two dimensional. The laser array may be used in a variety of applications including free space optical communications.
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公开(公告)号:DE69804561D1
公开(公告)日:2002-05-08
申请号:DE69804561
申请日:1998-09-16
Applicant: XEROX CORP
Inventor: SUN DECAI
Abstract: The present invention provides an independently addressable, high density, edge emitting laser array structure (100) formed by a lateral wet oxidation process. The aperture (180,182,184,186) of the laser structure is formed by selective layer intermixing and lateral wet oxidation from adjacent grooves (168,170,172,174,176) etched in the laser structure.
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公开(公告)号:AU6132201A
公开(公告)日:2001-11-26
申请号:AU6132201
申请日:2001-05-10
Applicant: XEROX CORP
Inventor: CHUA CHRISTOPHER L , LEMMI FRANCESCO , SCHUYLENBERGH KOENRAAD F VAN , LU JENG PING , FORK DAVID K , PEETERS ERIC , SUN DECAI , SMITH DONALD L , ROMANO LINDA T
IPC: H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02 , G03C5/56 , G03C5/58 , H01L33/00 , H01L21/027
Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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公开(公告)号:MY156922A
公开(公告)日:2016-04-15
申请号:MYPI20012305
申请日:2001-05-16
Applicant: XEROX CORP
Inventor: CHUA CHRISTOPHER L , LEMMI FRANCESCO , SCHUYLENBERGH KOENRAAD F VAN , LU JENG PING , FORK DAVID K , PEETERS ERIC , SUN DECAI , SMITH DONALD L , ROMANO LINDA T
IPC: H01F27/29 , H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , H01F17/00 , H01F17/02 , H01L21/02 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01R9/03 , H05K7/02
Abstract: AN OUT-OF-PLANE MICRO-STRUCTURE WHICH CAN BE USED FOR ON-CHIP INTEGRATION OF HIGH-Q INDUCTORS AND TRANSFORMERS PLACES THE MAGNETIC FIELD DIRECTION PARALLEL TO THE SUBSTRATE PLANE WITHOUT REQUIRING HIGH ASPECT RATIO PROCESSING. THE PHOTOLITHOGRAPHICALLY PATTERNED COIL STRUCTURE INCLUDES AN ELASTIC MEMBER HAVING AN INTRINSIC STRESS PROFILE. THE INTRINSIC STRESS PROFILE BIASES A FREE PORTION AWAY FROM THE SUBSTRATE FORMING A LOOP WINDING (105). AN ANCHOR PORTION (101) REMAINS FIXED TO THE SUBSTRATE. THE FREE PORTION END BECOMES A SECOND ANCHOR PORTION (103) WHICH MAY BE CONNECTED TO THE SUBSTRATE VIA SOLDERING OR PLATING. A SERIES OF INDIVIDUAL COIL STRUCTURES CAN BE JOINED VIA THEIR ANCHOR PORTIONS TO FORM INDUCTORS AND TRANSFORMERS.
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公开(公告)号:DE60129914D1
公开(公告)日:2007-09-27
申请号:DE60129914
申请日:2001-11-28
Applicant: XEROX CORP
Inventor: SUN DECAI , ROSA MICHEL A
Abstract: Provided is a ribbon structure which may be used as part of a micro-assembly including a micro-device formed on or in a device layer of a single crystal silicon substrate. The ribbon structure is also formed in the device layer, where the ribbon structure is thinned to a thickness less than the thickness of the micro-device. The ribbon structure has an electrical conductive material deposited on its surface. When implemented as part of the micro-assembly, a first end of the micro-device and a first end of a ribbon structure are interconnected, wherein the ribbon structure and out-of-plane device are formed as a single piece.
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公开(公告)号:DE60122343T2
公开(公告)日:2006-12-14
申请号:DE60122343
申请日:2001-05-10
Applicant: XEROX CORP
Inventor: CHUA L , LEMMI FRANCESCO , VAN SCHUYLENBERGH F , LU PING , FORK K , PEETERS ERIC , SUN DECAI , SMITH L , ROMANO T
IPC: G03C5/56 , H01F41/04 , G01R1/067 , G01R3/00 , G03C5/00 , G03C5/58 , G03F7/00 , H01F17/00 , H01F17/02 , H01F27/29 , H01L21/02 , H01L21/027 , H01L21/60 , H01L21/768 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/522 , H01L33/00 , H01R9/03 , H05K7/02
Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
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公开(公告)号:DE69828760T2
公开(公告)日:2005-12-29
申请号:DE69828760
申请日:1998-10-23
Applicant: XEROX CORP
Inventor: SUN DECAI , FLOYD PHILIP D
Abstract: The present invention relates to a vertical cavity surface emitting laser with an accurately defined and controlled aperture (134) which directs the current path within the laser. Specifically, the oxide regions (106) surrounding the aperture are formed by a pre-oxidation layer disordering process which controls the regions within which oxidation can occur. The present invention allows for the manufacture of highly compact lasers with reproducible optical and electrical characteristics.
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