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公开(公告)号：WO2013027856A3
公开(公告)日：2013-06-20
申请号：PCT/JP2012071922
申请日：2012-08-22
Applicant: YAZAKI CORP , TAKAGI YUSUKE
Inventor： TAKAGI YUSUKE
CPC classification number: H05K1/183 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/182 , H05K2201/09472 , H05K2201/09745 , H05K2201/09972 , H05K2201/10439 , H05K2203/0169 , H05K2203/0323
Abstract: A wiring board comprises a base substrate (10) that is a metal core (31) substrate, and including an opening (15) in which an interior component (80) that is an electric component or an electronic component is to be mounted, and a terminal placement section (21 - 23) on which a terminal (81 - 83) of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
Abstract translation: 布线基板包括作为金属芯（31）基板的基底基板（10），并且包括其中要安装作为电气部件或电子部件的内部部件（80）的开口（15），以及 端子放置部分（21-23），其内部部件的端子（81-83）将被安装在其上，端子放置部分围绕基底基板的开口形成，并且从基部的表面向内凹进 衬底，使得内部部件的一部分被放置在开口内。
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公开(公告)号：WO2013027856A2
公开(公告)日：2013-02-28
申请号：PCT/JP2012/071922
申请日：2012-08-22
Applicant: YAZAKI CORPORATION , TAKAGI, Yusuke
Inventor： TAKAGI, Yusuke
IPC: H05K1/18
CPC classification number: H05K1/183 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/182 , H05K2201/09472 , H05K2201/09745 , H05K2201/09972 , H05K2201/10439 , H05K2203/0169 , H05K2203/0323
Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
Abstract translation: 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。
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公开(公告)号：US09936578B2
公开(公告)日：2018-04-03
申请号：US14517002
申请日：2014-10-17
Applicant: RF Micro Devices, Inc.
Inventor： Thong Dang , Mohsen Haji-Rahim , Mark Charles Held
CPC classification number: H05K1/111 , H01L23/3135 , H01L23/3171 , H01L23/552 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/97 , H01L2224/24051 , H01L2224/24226 , H01L2224/245 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/73267 , H01L2224/8201 , H01L2224/82031 , H01L2224/82101 , H01L2224/82136 , H01L2224/92244 , H01L2224/97 , H01L2924/1421 , H01L2924/1434 , H01L2924/1443 , H01L2924/1461 , H01L2924/15159 , H01L2924/15787 , H01L2924/19105 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0715 , H05K2201/10439 , Y10T29/49016 , Y10T29/49117 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82 , H01L2924/014 , H01L2924/00
Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.
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14.发明授权Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board 有权制造陶瓷电子部件，陶瓷电子部件和配线基板的方法公开(公告)号：US09007161B2
公开(公告)日：2015-04-14
申请号：US14339506
申请日：2014-07-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
IPC: H05K1/18 , H01C1/14 , H01C7/00 , H01C7/02 , H01G2/06 , H01G4/228 , H01F27/28 , H01G4/008 , H01G4/12 , H01L41/083 , H05K3/32
CPC classification number: H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。
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公开(公告)号：US20140369014A1
公开(公告)日：2014-12-18
申请号：US14363208
申请日：2012-08-22
Applicant: Yusuke Takagi
Inventor： Yusuke Takagi
CPC classification number: H05K1/183 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/182 , H05K2201/09472 , H05K2201/09745 , H05K2201/09972 , H05K2201/10439 , H05K2203/0169 , H05K2203/0323
Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
Abstract translation: 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。
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Patent Agency Ranking
16.发明申请METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT, CERAMIC ELECTRONIC COMPONENT, AND WIRING BOARD 有权制造陶瓷电子元件，陶瓷电子元器件和接线板的方法公开(公告)号：US20140332260A1
公开(公告)日：2014-11-13
申请号：US14339506
申请日：2014-07-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Koji SATO , Yukio SANADA , Yasuhiro NISHISAKA
CPC classification number: H05K1/183 , H01C1/14 , H01C7/008 , H01C7/02 , H01F27/2804 , H01F2027/2809 , H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/228 , H01L41/083 , H05K1/186 , H05K3/321 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10439 , H05K2201/10636 , Y02P70/611 , Y10T29/49085 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.
Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。
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公开(公告)号：US20240334609A1
公开(公告)日：2024-10-03
申请号：US18609434
申请日：2024-03-19
Applicant: TDK Corporation
Inventor： Toshiyuki ABE , Kazutoshi TSUYUTANI , Naoyuki ISHIKAWA
CPC classification number: H05K1/182 , H05K1/0237 , H05K1/111 , H05K1/115 , H05K2201/10439
Abstract: Disclosed herein is an apparatus that includes a multilayer substrate including a plurality of conductive layers and a plurality of insulating layers alternately stacked, and an electronic component having a first signal pad. The plurality of conductive layers include a first internal conductive layer having a first signal pattern, and a second internal conductive layer having a second signal pattern. The plurality of insulating layers include a first insulating layer positioned between the first and second internal conductive layers. The electronic component is embedded in the first insulating layer such that the first signal pad is connected to the first signal pattern. The first and second signal patterns are connected to each other by a first via conductor penetrating through the first insulating layer. The distance between the electronic component and the first via conductor is greater than a diameter of the first via conductor.
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公开(公告)号：US20180317318A1
公开(公告)日：2018-11-01
申请号：US15950479
申请日：2018-04-11
Applicant: Seiko Epson Corporation
Inventor： Yohei YAMADA , Tomoyuki KAMAKURA
CPC classification number: H05K1/0283 , G01B7/20 , H05K1/111 , H05K1/181 , H05K1/189 , H05K3/284 , H05K2201/0133 , H05K2201/0191 , H05K2201/09281 , H05K2201/09736 , H05K2201/10151 , H05K2201/10439 , H05K2201/2009 , H05K2203/1316 , H05K2203/1322
Abstract: A stretchable circuit board includes a stretchable substrate, a stretchable conducting film placed on one surface of the stretchable substrate and elongated in a first direction, an electric element placed on the one surface of the stretchable substrate, and a covering portion that covers a part of the stretchable conducting film and at least a part of the electric element, wherein, when an area of a first section as a section along an outer circumference of the covering portion in the stretchable conducting film is referred to as a first area and an area of a second section as a section of the stretchable conducting film orthogonal to the first direction in a location apart from the outer circumference of the covering portion toward outside is referred to as a second area, the first area is larger than the second area.
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公开(公告)号：US09730317B2
公开(公告)日：2017-08-08
申请号：US14219054
申请日：2014-03-19
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Hyeong-Cheol Ahn
CPC classification number: H05K1/028 , H05K1/189 , H05K2201/10439
Abstract: A display device includes a display panel including a curved surface bent along a first direction, a circuit board coupled to the display panel, the circuit board being bent along the first direction in correspondence to the curved surface of the display panel, and an integrated circuit (IC) chip on the circuit board, a short side of the IC chip extending along the first direction.
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公开(公告)号：US20150083478A1
公开(公告)日：2015-03-26
申请号：US14484537
申请日：2014-09-12
Applicant: DAI-ICHI SEIKO CO., LTD.
Inventor： Takayoshi ENDO , Kenya ANDO
CPC classification number: H05K1/181 , H01R4/02 , H01R12/707 , H01R12/724 , H01R43/0256 , H01R43/16 , H05K3/303 , H05K2201/10439 , H05K2201/10613 , Y10T29/49149 , Y10T29/49204
Abstract: The electric part to be soldered to a metal pad mounted on a printed circuit board, includes a first surface facing the metal pad, a second surface extending from the first surface in a direction away from the metal pad, and a third surface outwardly extending from the second surface, the second surface and the third surface defining a space in which solder is stored.
Abstract translation: 要焊接到安装在印刷电路板上的金属焊盘的电气部件包括面向金属焊盘的第一表面，从远离金属焊盘的方向从第一表面延伸的第二表面，以及从第一表面向外延伸的第三表面 第二表面，第二表面和第三表面限定存储焊料的空间。
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