公开(公告)号：CN108389840A

公开(公告)日：2018-08-10

申请号：CN201810084515.2

申请日：2018-01-29

Applicant: 株式会社捷太格特

Inventor： 谷直树

IPC: H01L23/367

CPC classification number: H01L23/36 ,  H01L23/488 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L29/4238 ,  H01L2224/13013 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/14517 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/30051 ,  H01L2224/30151 ,  H01L2224/30156 ,  H01L2224/30517 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/81825 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/3511 ,  H02K9/22 ,  H02K11/33 ,  H05K1/0201 ,  H05K2201/10439 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L23/3677 ,  H01L23/3672

Abstract: 本发明涉及半导体装置。横向半导体芯片的电极面与基板通过多个第一接合部接合，上述多个第一接合部接合至少包括将形成在电极面的多个电极与基板接合而成的多个接合部。横向半导体芯片的非电极面与散热片通过将它们相互接合的第二接合部接合。在从法线方向观察基板的主面的俯视时，在将多个第一接合部的集合体的概略形状的轮廓内的区域设为第一接合区域，将第二接合部的轮廓内的区域设为第二接合区域的情况下，第一接合区域与第二接合区域的位置、形状以及大小一致。

公开(公告)号：CN104466463B

公开(公告)日：2018-02-09

申请号：CN201410455667.0

申请日：2014-09-09

Applicant: 第一精工株式会社

Inventor： 远藤隆吉 ,  安藤贤弥

IPC: H01R12/55 ,  H01R43/16

CPC classification number: H05K1/181 ,  H01R4/02 ,  H01R12/707 ,  H01R12/724 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/303 ,  H05K2201/10439 ,  H05K2201/10613 ,  Y10T29/49149 ,  Y10T29/49204

Abstract: 要焊接至安装在印刷电路板上的金属垫的电子部件，包括：面向所述金属垫的第一表面；在远离金属垫的方向上从第一表面延伸的第二表面；以及从第二表面向外延伸的第三表面，第二表面和第三表面限定存储焊料的空间。

公开(公告)号：CN106028628A

公开(公告)日：2016-10-12

申请号：CN201610607536.9

申请日：2016-07-28

Applicant: 广东欧珀移动通信有限公司

Inventor： 黄占肯

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H05K1/18 ,  H05K2201/10439

Abstract: 本发明公开了一种电路板和具有其的移动终端。所述电路板包括主板、至少一个电器元件和散热层，所述主板上设有至少一个焊盘；至少一个所述电器元件与相应的所述焊盘焊接；所述散热层铺设在所述主板的至少部分表面上，所述散热层上设有避让缺口，至少一个所述焊盘位于所述避让缺口内。根据本发明的电路板，具有良好的散热能力，可以确保电路板的工作环境稳定，延长电器元件的使用寿命，从而保证移动终端工作运行的稳定性和可靠性，保证移动终端的品质。

公开(公告)号：CN104466463A

公开(公告)日：2015-03-25

申请号：CN201410455667.0

申请日：2014-09-09

Applicant: 第一精工株式会社

Inventor： 远藤隆吉 ,  安藤贤弥

IPC: H01R12/55 ,  H01R43/16

CPC classification number: H05K1/181 ,  H01R4/02 ,  H01R12/707 ,  H01R12/724 ,  H01R43/0256 ,  H01R43/16 ,  H05K3/303 ,  H05K2201/10439 ,  H05K2201/10613 ,  Y10T29/49149 ,  Y10T29/49204 ,  H01R12/55

Abstract: 要焊接至安装在印刷电路板上的金属垫的电子部件，包括：面向所述金属垫的第一表面；在远离金属垫的方向上从第一表面延伸的第二表面；以及从第二表面向外延伸的第三表面，第二表面和第三表面限定存储焊料的空间。

公开(公告)号：CN103843468A

公开(公告)日：2014-06-04

申请号：CN201280036195.4

申请日：2012-08-22

Applicant: 矢崎总业株式会社

Inventor： 高木祐介

IPC: H05K1/18 ,  H05K1/05 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2201/10439 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: 一种布线板，包括一衬底基板(10)，该衬底基板作为金属芯(31)基板，并且包括开口(15)，作为电气部件或电子部件的内部部件(80)将安装在该开口中；以及端子放置部(21-23)，所述内部部件的端子(81.83）将安装在该端子放置部上，该端子放置部环绕所述衬底基板的开口形成，并且从所述衬底基板的表面向内凹进，使得所述内部部件的一部分将被布置在所述开口内。

公开(公告)号：US08959757B2

公开(公告)日：2015-02-24

申请号：US13339817

申请日：2011-12-29

Applicant: Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K3/30

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: In one embodiment, a shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract translation: 在一个实施例中，屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。

公开(公告)号：EP2749155A2

公开(公告)日：2014-07-02

申请号：EP12762411.2

申请日：2012-08-22

Applicant: Yazaki Corporation

Inventor： TAKAGI, Yusuke

IPC: H05K1/18 ,  H05K1/05 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/182 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K2201/10439 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.

公开(公告)号：US20180218959A1

公开(公告)日：2018-08-02

申请号：US15877538

申请日：2018-01-23

Applicant: JTEKT CORPORATION

Inventor： Naoki TANI

IPC: H01L23/36 ,  H01L29/423 ,  H05K1/02 ,  H01L23/488 ,  H01L23/538

CPC classification number: H01L23/36 ,  H01L23/488 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L29/4238 ,  H01L2224/13013 ,  H01L2224/131 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14156 ,  H01L2224/14517 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/30051 ,  H01L2224/30151 ,  H01L2224/30156 ,  H01L2224/30517 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/33051 ,  H01L2224/33181 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/81825 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2924/3511 ,  H02K9/22 ,  H02K11/33 ,  H05K1/0201 ,  H05K2201/10439 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electrode surface of a horizontal semiconductor chip and a substrate are joined together through a plurality of first joint portions including a plurality of joint portions at which a plurality of electrodes formed on the electrode surface are joined to the substrate. A no-electrode surface of the horizontal semiconductor chip and a heatsink are joined together through a second joint portion at which the no-electrode surface and the heatsink are joined together. In a plan view from a direction normal to a principal surface of the substrate, when a region inside the outline of the rough shape of an aggregate of the first joint portions is a first joint region and a region inside the outline of the second joint portion is a second joint region, the first joint region and the second joint region are the same in position, shape, and size.

公开(公告)号：US08819932B2

公开(公告)日：2014-09-02

申请号：US13184607

申请日：2011-07-18

Applicant: Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

Inventor： Koji Sato ,  Yukio Sanada ,  Yasuhiro Nishisaka

IPC: H05K3/02

CPC classification number: H05K1/183 ,  H01C1/14 ,  H01C7/008 ,  H01C7/02 ,  H01F27/2804 ,  H01F2027/2809 ,  H01G2/06 ,  H01G4/008 ,  H01G4/1227 ,  H01G4/228 ,  H01L41/083 ,  H05K1/186 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10439 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49085 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Abstract translation: 陶瓷电子部件的制造方法即使在陶瓷电子部件嵌入布线基板中也能够防止特性的变化。 制备含有聚合度在约1000至约1500范围内的有机粘合剂的陶瓷生片。 在每个陶瓷生片的表面上形成第一导电糊层。 层叠陶瓷生片以形成原料陶瓷层叠体。 在原料陶瓷层叠体的表面上形成第二导电糊层。 形成有第二导电膏层的原料陶瓷层叠体被烧制。

公开(公告)号：US20100288535A1

公开(公告)日：2010-11-18

申请号：US12546502

申请日：2009-08-24

Applicant: Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

Inventor： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, in which a cooling member connecting with an inner circuit layer of a printed circuit board is provided on one side of an electronic component, so that the heat radiation performance thereof can be improved and the thickness thereof can be decreased, and a method of manufacturing the same.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，其中在电子部件的一侧设置有与印刷电路板的内部电路层连接的冷却部件，从而能够提高其散热性能， 其厚度可以减小，及其制造方法。