Abstract:
This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins (5a,5b) to be inserted in holes (2) of the supporting plates (1) and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some (5a) of the contact pins are provided with protruding portions (10) defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.
Abstract:
PROBLEM TO BE SOLVED: To provide a method of fabricating a vertically mountable integrated circuit (IC) package.SOLUTION: An integrated circuit is mounted on a printed circuit board (PCB) 36 and electrically coupled to a bond pad on the PCB 36. The bond pad is coupled with a via that is embedded in the PCB 36. The IC, the bond pad, the via, and a portion of the PCB 36 are singulated in order to create a vertically mountable IC package. The via is cut through cross-sectionally during singulation so as to expose a portion of the via and thereby provide a mountable area for the IC package. The IC package is encapsulated or housed in a dielectric material. In addition, the via is treated with a preservative or other suitable electroless metal plating deposition that prevents oxidation and promotes solderability.
Abstract:
Two flat packages (110,111) are arranged to achieve a mirrored footprint when mounted or opposite sides of a printed circuit board by employing guides (100), which are positioned within a mounting aperture the printed circuit board. The flat packages include leads (120,121) which end from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.
Abstract:
A semiconductor device includes vertical placement part (12a, 12b, 12c, 12d) for mounting the semiconductor device on a surface of a circuit board (11) in a vertical position, and a connection part (14) for making electrical connections between the circuit board (11) and a semiconductor element (13). A stage (15) is provided on which the semiconductor element (13) is placed. The stage has supporting members causing the semiconductor device to vertically stand on the circuit board. Wiring boards (17, 18), stacked on a side of the stage (15) on which the semiconductor element (13) is placed, have windows (22) in which the semiconductor element (13) is located. The vertical placement part (12a, 12b, 12c, 12d) includes wiring lines extending between edges of the circuit boards facing the circuit board and peripheries of the windows. The wiring lines have ends located in the vicinity of the edges of the circuit boards and have a shape enabling the semiconductor device to be mounted on the circuit board.
Abstract:
A semiconductor package (30) comprises leads (34) which protrude from the bottom of a package body (32), and supports (36) which are formed at both ends of the package body (32) to mount the package on a printed circuit board (PCB). The supports (36) are made of the same material as the package body (32). In the package body (32), a slot (38) is formed to receive the leads (34). The supports (36) are staggered to mount the packages close to each other. Thus, there is no additional process step for forming holes in the PCB to mount the supports of the semiconductor package, and the mounting process of the package becomes simpler. The supports (36) protruding from the package body mount the package on the PCB firmly. The slot (38) receives the leads and protect the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package.
Abstract:
A radial lead type electronic component (4) includes a couple of plate-type lead terminals (1,2,3) projecting from a protective resin member (9) in the same direction. These lead terminals (1,2,3) are provided with inclined edges (1d,1e;2d,2e), which make the body portions (1c-3c) gradually narrowed toward leg portions (1a-3a), in leg-side edges of body portions. Among inclined edges, inclinations ϑ ₁ of the outer ones with respect to the leg-projecting direction are greater than inclinations ϑ ₂ of the inner ones with respect to the same direction.
Abstract:
This package for integrated devices, to be fixed on supporting plates, in particular on printed circuits, comprises contact pins (5a,5b) to be inserted in holes (2) of the supporting plates (1) and to be soldered thereto. To prevent overturning of the package, which may lead to short circuits among the components, at least some (5a) of the contact pins are provided with protruding portions (10) defining abutments cooperating with the supporting plate to limit the inclination of the package with respect to the plate.
Abstract:
A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.