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公开(公告)号:CN1823459A
公开(公告)日:2006-08-23
申请号:CN200480020029.0
申请日:2004-05-31
Applicant: 住友电装株式会社
CPC classification number: H05K1/144 , H01R9/2458 , H01R12/523 , H01R12/585 , H05K3/308 , H05K2201/1059 , H05K2201/10757 , Y10S439/949
Abstract: 各印刷电路板沿铅直方向排列,以致上部印刷电路板的外部周边部分向外伸出在下部印刷电路板的外部周边部分以外,而伸出的外部周边部分被包含在印刷电路板托持壳体(12)之中,同时被配置在其水平台阶状部分(12b)上。在压入配合接线柱(20)第二垂直部分(23)处的压入配合电气接触部分(25)在下部印刷电路板周边边缘处的导电接线柱孔眼形成压入配合接触。另一方面,第一垂直部分(2)沿着印刷电路板托持壳体(12)的铅直外部表面(12a)伸展,而压入配合电气接触部分(24)与上部印刷电路板周边边缘处的导电接线柱孔眼形成压入配合接触。压入配合接线柱(20)的水平部分(22)沿着印刷电路板托持壳体(12)的水平台阶状部分(12b)处的下部表面伸展并由从下壳(13)伸出的支承部分从下面支承。
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公开(公告)号:CN1806301A
公开(公告)日:2006-07-19
申请号:CN200480016711.2
申请日:2004-06-29
Applicant: 松下电器产业株式会社
CPC classification number: H05B6/666 , H01F5/02 , H01F27/06 , H01F27/40 , H01F2027/065 , H05K1/18 , H05K3/301 , H05K3/3447 , H05K2201/1003 , H05K2201/10424 , H05K2201/10515 , H05K2201/10651 , H05K2201/10757
Abstract: 本发明公开了一种变压器单元(1),该变压器单元包含变压器,该变压器包括至少缠绕有初级绕组和次级绕组的线圈架(2)、插入该线圈架中心的芯部以及保持在线圈架(2)和/或变压器的外周区域中的电子部件(3),该单元位于印刷电路板(4)上,电子部件(3)的导引终端(3a)由焊料(5)焊接于印刷电路板(4),并且导引终端(3a)夹在形成于线圈架(2)的狭缝(2b)中并且固定地安装于此。在该结构中,在终端(3a)中形成有弯折部分(3b),该部分防止线圈架(2)在夹住导引终端(3a)的同时沿导引终端(3a)的纵向方向滑动。
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公开(公告)号:CN1262156C
公开(公告)日:2006-06-28
申请号:CN200310100772.4
申请日:2003-10-09
CPC classification number: H05K7/142 , H01R12/52 , H01R43/0256 , H01R43/0263 , H05K3/3426 , H05K3/3447 , H05K3/368 , H05K2201/10757 , H05K2201/10924 , Y10T29/49121 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49139 , Y10T29/49144 , Y10T29/49149 , Y10T29/49151 , Y10T29/49153 , Y10T29/49789 , Y10T29/5142 , Y10T29/515 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
Abstract: 本发明提供一种印刷电路板的连接方法。在导线框的导线部前端形成接线端子,通过将该接线端子与在第一印刷电路板上形成的焊盘相紧固而将导线框安装于第一印刷电路板。从第一印刷电路板安装的导线框将框架部及连接杆部切除使导线部分离,导线部的前端部向第一印刷电路板的上方延伸而形成。在将向上方延伸的导线部插入穿过第二印刷电路板的贯通孔后,通过将导线部与贯通孔的紧固而实现所述第一印刷电路板与所述第二印刷电路板之间的电连接。由此能够简易且高精度地连接叠层的印刷电路板。
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公开(公告)号:CN1251319C
公开(公告)日:2006-04-12
申请号:CN03148644.4
申请日:1995-11-13
Applicant: 佛姆法克特股份有限公司
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: 本发明提供一种微电子组件的插入物的制造方法,其包含:在第一导电材料的薄片中生成一具第一分接头及第二分接头的中间连接元件,该第一分接头和第二分接头位于薄片的平面内;折弯该两分接头,使两分接头中的一个以第一方向自薄片的一个表面延伸出来,两分接头中的另一个以第二方向自薄片的一相对表面延伸出来;以一具较第一导电材料屈服强度高的第二导电材料外覆该两分接头。
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公开(公告)号:CN1215648C
公开(公告)日:2005-08-17
申请号:CN01135440.2
申请日:2001-09-26
Applicant: 松下电器产业株式会社
CPC classification number: H01R12/57 , H01P1/00 , H01P1/2053 , H01R12/52 , H01R12/718 , H01R12/721 , H05K3/3405 , H05K3/3426 , H05K3/368 , H05K2201/10386 , H05K2201/10757 , H05K2201/10772 , Y02P70/613
Abstract: 本发明的电路器件具有形成有电路的基板及将所述基板安装到第2电路基板上用的端子,其特征在于,所述基板的长度为10mm-80mm,所述基板与所述第2电路基板的热膨胀系数之差为0.2×10-5/℃以上,所述端子由有弹性的材料构成,并且所述端子由第1接合部、第2接合部及设于所述第1和第2接合部之间的弹性部所构成,所述端子使所述基板与所述第2电路基板间隔0.3mm-5mm。利用本发明的结构,能防止因加热循环等引起的电路基板与耦合基板间的导通恶化,提供能获得长期稳定特性的电路器件。
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公开(公告)号:CN1201161C
公开(公告)日:2005-05-11
申请号:CN99813790.1
申请日:1999-12-02
Applicant: 佛姆法克特股份有限公司
IPC: G01R31/316 , G01R31/28 , G01R31/02 , G01R1/073
CPC classification number: B23K20/004 , B23K2101/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
Abstract: 提供了一种用于接触一具有突起的接触元件的电子元件的探测卡。具体说,本发明可用于接触一具有弹性接触元件、如弹簧的半导体晶片。将一探测卡设计成具有与晶片上的接触元件相配合的端子。在一较佳实施例中,端子是柱销。在一较佳实施例中,端子包括一适合于反复接触的接触材料。在一尤为优选的实施例中,将一间隔变换器制成在其一侧具有接触柱销,并在其相对侧具有端子。一具有弹簧接触件的插入器将该间隔变换器的相对侧上的一接触件连接于一探测卡上相应的端子,该端子进而连接于一可以与一诸如传统测试器之类的测试装置相连的端子。
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公开(公告)号:CN1208368A
公开(公告)日:1999-02-17
申请号:CN96195559.7
申请日:1996-05-24
Applicant: 福姆法克特公司
IPC: B23K31/02
CPC classification number: H05K3/4015 , B23K20/004 , B23K2101/40 , C23C18/1605 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06711 , G01R1/06727 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/66 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/11003 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2224/48744 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599
Abstract: 首先可将一些互连元件(752)和/或一些互连元件(752)的接点结构(770)制备在牺牲基片(702)上,以便随后固定到电子零件(784)上。这样,在制备过程中电子零件(784)就不会“处于危险”之中。该牺牲基片(702)在互连元件(752)之间建立了一预定的间隔关系,这些互连元件可以是以较软的细长件(752)为芯并有一较硬(弹性材料)涂层(754)的复合互连元件(752)。互连元件(752)可以制备在接点结构(770)上,也可首先固定到电子零件(784)和这接点结构(770)上,这接点结构是与互连元件(752)的自由端相连接的。本发明还介绍了做成悬臂式的接点结构(770)。
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公开(公告)号:CN1171167A
公开(公告)日:1998-01-21
申请号:CN95197034.8
申请日:1995-11-13
Applicant: 佛姆法克特股份有限公司
IPC: H01L23/12
CPC classification number: H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
Abstract: 展现良好机械特性的电子组件的复合中间连接元件,是通过将一软材料(诸如金)定型成一具有弹簧形状(包括悬臂梁、S形、U型)的细长元件(芯子),且在该定形的细长元件上外覆一硬材料(诸如镍及其合金),以赋予所需弹簧(弹性)特性而形成的。一具有优越性质(例如,导电性和/或软焊性)材料的最后的外覆可施加于复合中间连接元件。此细长元件可以由一线、或由一薄片(例如,金属箔)所组成。最终的中间连接元件可以安装在各种电子组件上。
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公开(公告)号:CN108990309A
公开(公告)日:2018-12-11
申请号:CN201810537582.5
申请日:2018-05-30
Applicant: 罗伯特·博世有限公司
CPC classification number: H05K1/181 , G01D11/30 , H01R12/57 , H01R12/592 , H05K1/111 , H05K3/3421 , H05K3/3426 , H05K3/3494 , H05K2201/10151 , H05K2201/10454 , H05K2201/10628 , H05K2201/10757 , H05K3/34 , H05K1/11 , H05K1/18
Abstract: 本发明涉及一种连接装置,具有电子构件和电路板,电子构件具有带有支托面的壳体和至少一个接触元件,电路板具有布置在第一表面处的至少一个焊面,其中,接触元件具有平行于壳体的支托面延伸的第一接触面,以及一种用于制造电子构件和电路板之间的钎焊连接部的方法。在这里,焊面包括经由收缩部彼此连接的第一区段和第二区段,其中,接触元件包括与第一接触面具有预设角度的第二接触面,其中,在第一接触面和第二接触面之间构造有经倒圆的过渡区域,过渡区域布置在焊面的收缩部的区域中,并且其中,第二接触面通过钎焊连接部与焊面的第二区段连接,并且壳体的支托面具有与电路板的第一表面的角度,角度对应于第一接触面和第二接触面之间的角度。
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公开(公告)号:CN104112720B
公开(公告)日:2018-04-13
申请号:CN201410077986.2
申请日:2014-03-05
Applicant: 英飞凌科技股份有限公司
Inventor: A.卡尔莱蒂
IPC: H01L23/367 , H01L23/14 , H01L21/50 , H01L21/58 , H01L21/60
CPC classification number: H01L23/34 , H01L23/36 , H01L23/4006 , H01L23/42 , H01L24/92 , H01L2924/0002 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H05K1/0203 , H05K3/3426 , H05K3/3447 , H05K2201/10757 , H05K2201/10765 , H05K2201/2036 , H01L2924/00
Abstract: 提供了功率半导体组件和模块。提供了用于组装功率半导体的方法和装置。一种设备包括印刷电路板、散热器和半导体芯片封装。所述半导体芯片封装位于所述印刷电路板和所述散热器之间。所述半导体芯片封装的发热表面被定向使得所述发热表面面向所述散热器。
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