公开(公告)号：US20110091697A1

公开(公告)日：2011-04-21

申请号：US12580256

申请日：2009-10-16

Applicant: Tzyy-Jang Tseng ,  Shu-Sheng Chiang

Inventor： Tzyy-Jang Tseng ,  Shu-Sheng Chiang

IPC: B32B15/00 ,  B05D5/12

CPC classification number: H05K3/422 ,  B32B7/06 ,  B32B27/06 ,  B32B27/36 ,  B32B2255/00 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2264/105 ,  B32B2307/204 ,  B32B2307/40 ,  B32B2307/748 ,  B32B2457/08 ,  H05K3/0035 ,  H05K3/185 ,  H05K3/285 ,  H05K3/4007 ,  H05K3/421 ,  H05K2201/0236 ,  H05K2201/0367 ,  H05K2203/0191 ,  H05K2203/0565 ,  H05K2203/1415 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method for fabricating a solder pad structure. A circuit board having thereon at least one copper pad is provided. A solder resist is formed on the circuit board and covers the copper pad. A solder resist opening, which exposes a portion of the copper pad, is formed in the solder resist by laser. The laser also creates a laser activated layer on sidewalls of the solder resist opening. A chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer.

Abstract translation: 一种制造焊盘结构的方法。 其上设置有至少一个铜焊盘的电路板。 在电路板上形成阻焊剂并覆盖铜焊盘。 通过激光在阻焊剂中形成露出铜焊盘的一部分的阻焊剂开口。 激光器还在阻焊剂开口的侧壁上产生激光激活层。 然后从暴露的铜垫生长化学铜层，同时从激光活化层生长化学铜层。

公开(公告)号：US07772118B2

公开(公告)日：2010-08-10

申请号：US12061768

申请日：2008-04-03

Applicant: Takaharu Yamano

Inventor： Takaharu Yamano

IPC: H01L21/44 ,  H01L23/52 ,  H01L23/48 ,  H01L29/40 ,  H01L21/768

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/007 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4605 ,  H05K3/4661 ,  H05K2201/0236 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0723 ,  H05K2203/0733 ,  H05K2203/1105 ,  H05K2203/1383 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A disclosed substrate is composed of a base member having a through-hole, a penetrating via provided in the through-hole, and a wiring connected to the penetrating via. The penetrating via includes a penetrating part having two ends on both sides of the base member, which is provided in the through-hole, a first protrusion protruding from the base member, which is formed on a first end of the penetrating part so as to be connected to the wiring, and a second protrusion protruding from the base member, which is formed on a second end of the penetrating part. The first protrusion and second protrusion are wider than a diameter of the through-hole.

Abstract translation: 所公开的基板由具有通孔的基部构件，设置在通孔中的贯通孔以及与贯通孔连接的配线构成。 贯通孔包括贯通部，该贯通部在基部构件的两侧设置有设置在贯通孔中的两端，从基体突出的第一突起，该第一突起形成在贯通部的第一端上，从而 连接到布线，以及形成在穿透部的第二端上的从基部构件突出的第二突起。 第一突起和第二突起比通孔的直径宽。

公开(公告)号：US07504191B2

公开(公告)日：2009-03-17

申请号：US10768859

申请日：2004-01-30

Applicant: Masaki Kondo ,  Takashi Kanda

Inventor： Masaki Kondo ,  Takashi Kanda

IPC: G03F7/00 ,  G03F7/004

CPC classification number: G03F7/40 ,  G03F7/0043 ,  G03F7/0382 ,  G03F7/0392 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2203/0514

Abstract: A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.

Abstract translation: 提供感光性树脂组合物和使用该感光性树脂组合物形成树脂图案的方法。 作为催化剂前体，感光性树脂组合物含有适用于化学镀金属的金属沉积催化活性的催化金属元素。 形成树脂图案的方法使用含有作为催化剂前体的具有适用于化学镀金属的金属沉积催化活性的催化金属元素的感光性树脂组合物。 通过使用本发明的方法，可以在通过本发明的感光性树脂组合物的曝光和显影形成的树脂图案上选择性地形成导电膜。

公开(公告)号：US20090004465A1

公开(公告)日：2009-01-01

申请号：US11813839

申请日：2006-01-13

Applicant: Takeyoshi Kano ,  Koichi Kawamura

Inventor： Takeyoshi Kano ,  Koichi Kawamura

IPC: B32B15/08 ,  B32B5/00 ,  B05D5/12 ,  B05D3/00 ,  C25D5/34

CPC classification number: C23C18/28 ,  C23C18/30 ,  H05K1/0237 ,  H05K3/387 ,  H05K2201/0236 ,  Y10T428/265 ,  Y10T428/31678

Abstract: The present invention provides a metal film formed by applying an electroless plating catalyst or its precursor to a polymer layer on a base plate having a surface roughness of 500 nm or less and then carrying out electroless plating, the polymer layer containing a polymer which has a functional group capable of interacting with the electroless plating catalyst or its precursor and is chemically bonded directly to the base plate, wherein the adhesion strength between the base plate and the metal film is 0.2 kN/m or more.

Abstract translation: 本发明提供一种金属膜，该金属膜是通过将化学镀催化剂或其前体施加到表面粗糙度为500nm以下的基板上的聚合物层上，然后进行无电解电镀而形成的，该聚合物层含有具有 能够与化学镀催化剂或其前体相互作用并与基板直接化学键合的官能团，其中基板和金属膜之间的粘合强度为0.2kN / m以上。

公开(公告)号：US20080173097A1

公开(公告)日：2008-07-24

申请号：US11867117

申请日：2007-10-04

Applicant: Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

Inventor： Michael Bauer ,  Angela Kessler ,  Wolfgang Schober ,  Alfred Haimerl ,  Joachim Mahler

IPC: G01L7/00 ,  G03F7/00

CPC classification number: G01L19/0069 ,  G01L19/146 ,  G01L19/147 ,  H01L23/49877 ,  H01L23/5389 ,  H01L31/0203 ,  H01L2224/16245 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H05K1/0373 ,  H05K1/185 ,  H05K3/105 ,  H05K3/185 ,  H05K2201/0133 ,  H05K2201/0236 ,  H05K2203/107

Abstract: A semiconductor sensor component including a housing with a cavity and a sensor chip and a method for producing the same are described herein. The housing includes an opening to the surroundings of the housing and the sensor chip includes a sensor region which faces the opening. The sensor chip is embedded in the cavity of the housing into a rubber-elastic layer with its rear side and its edge sides, where the rubber-elastic layer includes cleavable included organometallic or inorganic metallic complexes. The metals of the complexes lie in a freely accessible manner on the top side of the rubber-elastic layer and form metallic nuclei for wiring lines which electrically connect the sensor region of the sensor chip to contact pads in the cavity of the cavity housing.

Abstract translation: 这里描述了包括具有空腔的壳体和传感器芯片的半导体传感器部件及其制造方法。 壳体包括到壳体的周围的开口，并且传感器芯片包括面向开口的传感器区域。 传感器芯片嵌入壳体的空腔中，其背面和边缘侧面为橡胶弹性层，其中橡胶弹性层包括可切割的有机金属或无机金属络合物。 复合物的金属在橡胶弹性层的顶侧可自由接近的方式形成金属核，用于将传感器芯片的传感器区域与腔室的空腔中的接触垫电连接的布线。

公开(公告)号：US07334326B1

公开(公告)日：2008-02-26

申请号：US11078833

申请日：2005-03-11

Applicant: Ronald Patrick Huemoeller ,  Sukitano Rusli

Inventor： Ronald Patrick Huemoeller ,  Sukitano Rusli

IPC: H01K3/10

CPC classification number: H05K1/162 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/185 ,  H05K3/4069 ,  H05K2201/0187 ,  H05K2201/0236 ,  H05K2201/0347 ,  H05K2201/09036 ,  H05K2203/107 ,  Y10T29/417 ,  Y10T29/49082 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.

Abstract translation: 制造具有嵌入式无源元件的集成电路基板的方法为芯片和一个或多个无源部件提供了降低的成本和紧凑的封装。 衬底的绝缘层被压花或激光烧蚀以产生用于插入形成被动部件的主体的糊状物的孔。 电阻膏用于形成电阻器，并且使用电介质浆料来形成电容器。 电容器板可以通过使用掺杂的衬底材料沉积在孔的底部，并且仅激活孔的底壁，使得能够电镀底壁而不在孔的侧壁上沉积导电材料。 可以通过使用不相交的结构和导电糊技术将通孔形成到底板。 与无源部件的连接可以由在衬底上形成导电图案的导电糊填充通道制成。

公开(公告)号：US07320936B2

公开(公告)日：2008-01-22

申请号：US11156544

申请日：2005-06-21

Applicant: Magall Brunet ,  Andrew Mark Connell ,  Paul McCloskey ,  Terence O'Donnell ,  Stephen O'Reilly ,  Sean Cian O'Mathuna

Inventor： Magall Brunet ,  Andrew Mark Connell ,  Paul McCloskey ,  Terence O'Donnell ,  Stephen O'Reilly ,  Sean Cian O'Mathuna

IPC: H01L21/44

CPC classification number: C23C26/00 ,  C23C18/1865 ,  C23C18/1879 ,  C25D1/12 ,  C25D15/00 ,  G11B5/3143 ,  H01F17/0006 ,  H01F27/2804 ,  H05K1/0219 ,  H05K1/0233 ,  H05K3/181 ,  H05K2201/0236 ,  H05K2201/083 ,  H05K2201/09809 ,  H05K2203/0723 ,  H05K2203/135

Abstract: An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.

Abstract translation: 绝缘层（5）和导电种子层（6）以简单的方法施加到基板（1）上。 在用于电泳沉积到基底上的浴中提供了氯化钯的光致抗蚀剂。 光致抗蚀剂是绝缘体，氯化钯是催化剂。 该层用UV加热以固化。 该层被等离子体蚀刻以暴露更多的氯化钯，其作为导电种子层的电极电镀的催化剂。 然后将更厚的导电层（7）电镀到种子层上。 对于连续的绝缘和/或导电层可以重复这些步骤。

公开(公告)号：US20070014975A1

公开(公告)日：2007-01-18

申请号：US11485428

申请日：2006-07-13

Applicant: Hiroshi Ota

Inventor： Hiroshi Ota

IPC: B05D5/12 ,  B05D7/00 ,  H05K3/00 ,  B32B3/00

CPC classification number: H05K3/185 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1667 ,  C23C18/204 ,  C25D5/022 ,  H05K3/107 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/0108 ,  H05K2203/107 ,  Y10T428/24917

Abstract: The method of manufacturing a wiring substrate comprises the steps of: performing a pattern exposure of a resin layer containing photocatalyst particles, in a shape of a desired wiring pattern so that the photocatalyst particles are exposed at a surface of the resin layer; performing irradiation of radiation to the resin layer having the exposed photocatalyst particles while the resin layer having the exposed photocatalyst particles is immersed in an aqueous solution of a metallic salt so that a photochemical reduction and precipitating of a metal film onto the exposed photocatalyst particles are performed; and forming a conducting layer on the metal film.

Abstract translation: 制造布线基板的方法包括以下步骤：以所需的布线图案的形式进行含有光催化剂颗粒的树脂层的图案曝光，使得光催化剂颗粒在树脂层的表面露出; 对具有暴露的光催化剂颗粒的树脂层进行辐射照射，同时将具有暴露的光催化剂颗粒的树脂层浸入金属盐的水溶液中，使得金属膜的光化学还原和沉淀到曝光的光催化剂颗粒上 ; 并在金属膜上形成导电层。

公开(公告)号：US20060027448A1

公开(公告)日：2006-02-09

申请号：US11192457

申请日：2005-07-28

Applicant: Matthias Helmstetter ,  Guido Hirzmann ,  Andreas Heil ,  Michael Schneider

Inventor： Matthias Helmstetter ,  Guido Hirzmann ,  Andreas Heil ,  Michael Schneider

IPC: H01H9/00

CPC classification number: B60Q5/003 ,  B60Q1/0082 ,  B60R21/2037 ,  B60R21/21658 ,  B62D1/046 ,  H05K1/0284 ,  H05K1/0373 ,  H05K3/185 ,  H05K3/381 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2201/10053 ,  H05K2203/095 ,  H05K2203/107

Abstract: A Gas bag module for use in a vehicle occupant restraint device has a plastic generator support. On the generator support a printed circuit is formed by metal deposition. For activating an electrical function element, the printed circuit cooperates with a switching element that is arranged on a section of the generator support.

公开(公告)号：US20050130397A1

公开(公告)日：2005-06-16

申请号：US10975499

申请日：2004-10-29

Applicant: Philip Bentley ,  James Fox ,  Alan Hudd ,  Martyn Robinson

Inventor： Philip Bentley ,  James Fox ,  Alan Hudd ,  Martyn Robinson

IPC: C23C18/28 ,  H01L21/20 ,  H05K3/18 ,  H05K3/38

CPC classification number: H05K3/182 ,  C23C18/1608 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/206 ,  C23C18/2066 ,  C23C18/28 ,  C23C18/30 ,  H01L2924/3025 ,  H05K3/387 ,  H05K2201/0236 ,  H05K2203/013 ,  H05K2203/0709 ,  H01L2924/00

Abstract: Disclosed is a method of forming, on the surface of a substrate, a first layer which is suitable for activating a second solid-layer-forming chemical reaction thereon, the method comprising the steps of bringing into contact with the substrate a first liquid which forms a first solid layer thereon, the first liquid comprising an activator for the second solid-layer-forming chemical reaction, characterised in that the first liquid is selected so that the first solid layer adheres to the substrate and is permeable to a second liquid that comprises one or more reagents for the second solid-layer-forming chemical reaction. A second solid layer can then be formed on the substrate by bringing into contact with the first solid layer a second liquid comprising one or more reagents for the second solid-layer-forming reaction.

Abstract translation: 公开了一种在基板的表面上形成适于在其上激活第二固体层形成化学反应的第一层的方法，所述方法包括以下步骤：与基板接触形成第一液体的步骤 其上的第一固体层，所述第一液体包含用于第二固体层形成化学反应的活化剂，其特征在于，所述第一液体被选择为使得所述第一固体层粘附到所述基底并且可渗透第二液体，所述第二液体包含 用于第二固体层形成化学反应的一种或多种试剂。 然后可以通过与第一固体层接触包含用于第二固体层形成反应的一种或多种试剂的第二液体在基底上形成第二固体层。