Abstract:
A metal foil covered laminate comprising a sheet-like base formed of at least two of meta-aramid fiber, polyethylene terephthalate fiber and glass fiber and impregnated with epoxy resin including acrylonitrile/butadiene copolymer having terminal carboxyl groups and a metal foil covering on the sheet-like base.
Abstract:
High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.
Abstract:
A flame retarded copper clad laminate is provided comprising a plurality of paper substrate layers each impregnated with a halogen-containing unsaturated polyester resin containing about 1% to about 30% by weight of a basic filler, and a copper cladding adhesively bonded onto at least one side of the laminate.
Abstract:
An element comprises a support, preferably a continuous polymeric film, and fibrous material, preferably a spun glass fiber web, which is secured to the support and protrudes therefrom, the protruding fibrous material being part of a layer comprising randomly distributed fibers having solid material, especially particulate material, adhered thereto. The element can be prepared from a composition containing solid material dissolved or dispersed in a liquid medium by applying said composition to fibrous material which is partially embedded in one surface of a support and then drying to evaporate the liquid medium.
Abstract:
Flame-retardant metal-clad dielectric sheeting useful in printed circuitry manufacture comprising an electrically conductive metallic layer adhered to a compacted dimensionally stable non-woven web by a polyester diepoxide adhesive system. The diepoxide is formed by end-capping a polyester formed from neopentyl glycol and an acid selected from the group consisting of azelaic, sebasic, and adipic acids with a moderately brominated bisphenol A-epichlorohydrin epoxy. The curing agent for the diepoxide system is a polyanhydride selected from the group consisting of polyazelaic, polyadipic, and polysebasic anhydrides.
Abstract:
A coated triaxial fabric, a process for its preparation and a laminated article prepared therefrom are provided. The coated fabric comprises a triaxial fabric, such as glass or polyester fibers, having a polymeric material impregnating and coating the fabric in an amount sufficient to set the yarn courses of the fabric where they cross one another and to give such a coated fabric superior isotropic tear resistance and strength (substantially uniform in all directions) when compared to a similarly constructed coated fabric prepared from a conventional biaxial fabric or a conventional bias ply construction. The coated fabric can be bonded to substrates such as metals and polymeric films.
Abstract:
Nonwoven fabrics of enhanced resistance to shrinkage, degradation, and planar instability at elevated temperatures are prepared from a major portion of aramid fibers bonded by a minor portion of polyamide fibers.
Abstract:
Unclad and metal clad laminates are constructed by sandwiching a resin impregnated core of paper between epoxy resin impregnated woven glass fabric sheets. The paper is a water laid sheet of cellulose fibers, preferably wood cellulose or cotton linter fibers having an average length from about 0.5 to 5 mm. The laminates are used as substrates for printed circuits and printed circuit modules.
Abstract:
A laminated board formed of a core of pressed wood covered with preferably aluminum foil outer layers, adhesively bonded thereto, which is useful for a back-up board when drilling printed circuit boards which is formed by drying the pressed fiber core to a low moisture contest prior to adhesively bonding the aluminum foil thereto.