公开(公告)号：US20150351244A1

公开(公告)日：2015-12-03

申请号：US14700320

申请日：2015-04-30

Applicant: FUJITSU LIMITED

Inventor： Keiichi Yamamoto ,  Takashi Fukuda

IPC: H05K1/18

CPC classification number: H05K3/321 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/10628

Abstract: A printed board unit includes: a base material; an electrode formed on the base material; a resist film formed on the base material, the resist film has an opening to expose the electrode; a recess part formed on an inner wall of the resist film; an electronic component including a lead terminal electrically coupled to the electrode; and a bonding material which bonds the lead terminal to the electrode in the opening, a portion of the bonding material being mounted on the lead terminal at an inner side of the opening opposite to the recess part.

Abstract translation: 印刷电路板单元包括：基材; 形成在基材上的电极; 形成在基材上的抗蚀剂膜，抗蚀剂膜具有露出电极的开口; 形成在抗蚀膜的内壁上的凹部; 电子部件，包括电连接到所述电极的引线端子; 以及接合材料，其将引线端子与开口中的电极接合，接合材料的一部分在与凹部相对的开口的内侧安装在引线端子上。

公开(公告)号：US08885356B2

公开(公告)日：2014-11-11

申请号：US13278514

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00 ,  H01L25/065 ,  H01L23/50 ,  H01L23/498 ,  H01L23/13 ,  H05K1/14 ,  H05K7/02 ,  H01L23/00 ,  H01L23/31

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US08359729B2

公开(公告)日：2013-01-29

申请号：US12600483

申请日：2008-05-13

Applicant: Jean-François Martinent ,  Laurence Robles ,  François Roussel

Inventor： Jean-François Martinent ,  Laurence Robles ,  François Roussel

IPC: H02P11/00

CPC classification number: H01Q1/2225 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H05K1/00 ,  H05K1/038 ,  H05K3/328 ,  H05K2201/029 ,  H05K2201/10628 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.

Abstract translation: 一种用于制造具有连接到接触垫的应答器天线的装置的方法。 提供具有端子连接的天线与基板接触。 接触垫放置在基板上并连接到天线的端子部分。 通过在焊盘和端子部之间引入能量通过焊接产生连接。 这些垫被放置成提供面向天线端子连接部分的表面。 该部分布置在基板上，并且焊接能量直接施加到焊盘。 本发明还涉及获得的装置。

公开(公告)号：US20120155042A1

公开(公告)日：2012-06-21

申请号：US13278514

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H05K7/00

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.

Abstract translation: 微电子组件包括介电元件，第一和第二微电子元件，信号引线和一个或多个跳线。 电介质元件具有相对的第一和第二表面，并且第一和第二孔在表面之间延伸。 多个导电元件位于其上。 信号引线连接到一个或多个微电子元件，并且延伸通过第一或第二孔中的一个或多个到介电元件上的一些导电元件。 一个或多个跳线引线延伸穿过第一孔并且连接到第一微电子元件的触点。 一个或多个跨接线跨越第二孔并且连接到电介质元件上的导电元件。

公开(公告)号：US20120153435A1

公开(公告)日：2012-06-21

申请号：US13278506

申请日：2011-10-21

Applicant: Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC: H01L29/02 ,  H01L23/538

CPC classification number: H05K1/11 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10507 ,  H05K2201/10628 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A microelectronic assembly includes a dielectric element having at least one aperture and electrically conductive elements thereon including terminals exposed at the second surface of the dielectric element; a first microelectronic element having a rear surface and a front surface facing the dielectric element, the first microelectronic element having a plurality of contacts exposed at the front surface thereof; a second microelectronic element having a rear surface and a front surface facing the rear surface of the first microelectronic element, the second microelectronic element having a plurality of contacts exposed at the front surface and projecting beyond an edge of the first microelectronic element; and an electrically conductive plane attached to the dielectric element and at least partially positioned between the first and second apertures, the electrically conductive plane being electrically connected with one or more of the contacts of at least one of the first or second microelectronic elements.

Abstract translation: 微电子组件包括具有至少一个孔的电介质元件和其上的导电元件，其中包括在电介质元件的第二表面处暴露的端子; 第一微电子元件，其具有后表面和面向介电元件的前表面，所述第一微电子元件具有在其前表面处暴露的多个触点; 第二微电子元件，其具有背表面和面向第一微电子元件的后表面的前表面，第二微电子元件具有暴露在前表面处并突出超过第一微电子元件的边缘的多个触点; 以及连接到电介质元件并且至少部分地定位在第一和第二孔之间的导电平面，导电平面与第一或第二微电子元件中的至少一个的一个或多个触点电连接。

公开(公告)号：US08057248B1

公开(公告)日：2011-11-15

申请号：US12979687

申请日：2010-12-28

Applicant: Neil S. Sherman

Inventor： Neil S. Sherman

IPC: H01R13/62

CPC classification number: H01R12/714 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/639 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector for mounting to a circuit board for comprising a connector device with a body, a plurality of alignment members, and one or more contact elements, wherein the alignment members extend through a plurality of alignment holes of the printed circuit board from the first surface and past the second surface of the circuit board and wherein the contact elements engage one more contact pads on the first surface of the circuit board, and a separate retention device having a supporting element and a plurality of fixed sockets is positioned along the second surface of the printed circuit board to receive the alignment members of the connector device therein so that the circuit board is positioned between the body of the connector device and the retention device to temporarily or permanently retain the contact elements of the connector device in contact with the contact pads of the circuit board.

Abstract translation: 一种用于安装到电路板的连接器，包括具有本体的连接器装置，多个对准构件和一个或多个接触元件，其中对准构件从第一表面延伸穿过印刷电路板的多个对准孔 并且经过电路板的第二表面，并且其中接触元件与电路板的第一表面上的多个接触焊盘接合，并且具有支撑元件和多个固定插座的单独保持装置沿着第二表面 所述印刷电路板用于接收所述连接器装置的对准部件，使得所述电路板位于所述连接器装置的主体和所述保持装置之间，以暂时或永久性地将所述连接器装置的接触元件与所述接触垫接触 的电路板。

公开(公告)号：US20100147958A1

公开(公告)日：2010-06-17

申请号：US12600483

申请日：2008-05-13

Applicant: Jean-Francois Martinent ,  Laurence Robles ,  François Roussel

Inventor： Jean-Francois Martinent ,  Laurence Robles ,  François Roussel

IPC: H01Q1/22 ,  G06K19/077 ,  H01P11/00 ,  H05K3/00 ,  H01Q23/00

CPC classification number: H01Q1/2225 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H05K1/00 ,  H05K1/038 ,  H05K3/328 ,  H05K2201/029 ,  H05K2201/10628 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.

Abstract translation: 一种用于制造具有连接到接触垫的应答器天线的装置的方法。 提供具有端子连接的天线与基板接触。 接触垫放置在基板上并连接到天线的端子部分。 通过在焊盘和端子部之间引入能量通过焊接产生连接。 这些垫被放置成提供面向天线端子连接部分的表面。 该部分布置在基板上，并且焊接能量直接施加到焊盘。 本发明还涉及获得的装置。

公开(公告)号：US07630210B2

公开(公告)日：2009-12-08

申请号：US11604710

申请日：2006-11-28

Applicant: Mark W. Gailus ,  Leon M. Khilchenko

Inventor： Mark W. Gailus ,  Leon M. Khilchenko

IPC: H05K7/00

CPC classification number: H05K3/321 ,  H01L2924/0002 ,  H05K2201/10628 ,  H05K2201/10795 ,  H05K2201/10984 ,  H01L2924/00

Abstract: A contact tail for an electronic component useful for attachment of components using conductive adhesive, which may be lead (Pb)-free. The contact tail is stamped, providing a relatively low manufacturing cost and high precision. The contact tail has a distal portion with a large surface area per unit length. The distal portion shapes conductive adhesive into a joint, holding the adhesive adjacent the lead for a more secure joint. Additionally, the distal portion holds adhesive to the contact tail before a joint is formed, facilitating the use of an adhesive transfer process to dispense adhesive. To further aid in the transfer of adhesive, the contact tail may be formed with concave portions, which increase the volume of adhesive adhering to the contact tail. By adhering an increased but controlled amount of adhesive to the contact tail, arrays of contact tails may be simply and reliably attached to printed circuit boards and other substrates.

Abstract translation: 用于电子部件的接触尾部，其可用于使用导电粘合剂附接部件，其可以是无铅（Pb）。 接触尾部被冲压，提供相对低的制造成本和高精度。 接触尾部具有每单位长度具有大的表面积的远端部分。 远端部分将导电粘合剂形成接头，将粘合剂保持在邻近引线的位置，用于更牢固的接头。 此外，远端部分在形成接头之前将粘合剂保持在接触尾部，便于使用粘合剂转移过程来分配粘合剂。 为了进一步有助于粘合剂的转移，接触尾部可以形成有凹部，其增加粘附到接触尾部的粘合剂的体积。 通过将增加但可控制的粘合剂量粘附到接触尾部，接触尾部的阵列可以简单且可靠地附接到印刷电路板和其它基底。

公开(公告)号：US20090277677A1

公开(公告)日：2009-11-12

申请号：US12429988

申请日：2009-04-24

Applicant: Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

Inventor： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

IPC: H05K1/18 ,  H05K13/00

CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K3/1241 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/0173 ,  H05K2203/1469 ,  Y10T29/49117

Abstract: A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.

Abstract translation: 用于原型电路的系统，以及创建生产电路，而不使用焊料。 待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中 。 元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。 迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

公开(公告)号：US20090237936A1

公开(公告)日：2009-09-24

申请号：US12110344

申请日：2008-04-27

Applicant: CHIN-LONG KU

Inventor： CHIN-LONG KU

IPC: F21S4/00 ,  F21V21/00

CPC classification number: F21S2/005 ,  F21V21/005 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10628 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An LED unit includes a plurality of LEDs, each of which includes a base, an LED die mounted on the base, a pair of leads penetrating the base to electrically connect with the LED die, a plurality of legs extending radially from a periphery of the base, a plurality of cutouts defined in the base and an encapsulant enveloping the LED die. The pair of leads of each LED are joined to corresponding leads of adjacent LEDs to realize electrical connections of the LEDs, while the legs of each LED are fitted into corresponding cutouts of the bases of adjacent LEDs to realize mechanical connections of the LEDs.

Abstract translation: LED单元包括多个LED，每个LED包括基座，安装在基座上的LED管芯，穿过基座的一对引线以与LED管芯电连接;多个引脚， 基座，限定在基座中的多个切口和封装LED管芯的密封剂。 每个LED的一对引线被连接到相邻LED的相应引线，以实现LED的电连接，而每个LED的腿被装配到相邻LED的基座的相应切口中，以实现LED的机械连接。