公开(公告)号：US20230294979A1

公开(公告)日：2023-09-21

申请号：US17695889

申请日：2022-03-16

Applicant: Enplas Corporation

Inventor： Ken KITAMOTO ,  Ryoya NAKAMURA

IPC: B81C1/00

CPC classification number: B81C1/00071 ,  B81C2201/034

Abstract: A manufacturing method capable of manufacturing a laminate including a substrate having a recess and a film with a high yield is provided. The method of manufacturing a laminate of the present invention includes: preparing a substrate having a recess; disposing a film on the substrate so as to cover the recess; and obtaining a laminate by thermocompression bonding between the film and the substrate by pressing the film and the substrate with a first elastic body and a second elastic body in a state in which the substrate on which the film is disposed is disposed between the first elastic body and the second elastic body such that the film is on the first elastic body side, in which the first elastic body is harder than the second elastic body.

公开(公告)号：US20230286799A1

公开(公告)日：2023-09-14

申请号：US18019447

申请日：2021-09-23

Applicant: HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN

Inventor： Yonggang ZHU ,  Chaozhan CHEN ,  Huaying CHEN ,  Bin RAN ,  Bo LIU ,  Chuanwen LV

IPC: B81C99/00

CPC classification number: B81C99/0085 ,  B81C2201/034 ,  B33Y80/00

Abstract: Disclosed in the present disclosure is a manufacturing method for a 3D microelectrode. The manufacturing method includes the following steps: (1) manufacturing a 3D model of a 3D microelectrode; (2) pouring a flexible material into the 3D model, and performing demolding so as to form a flexible mold having a cavity, wherein the cavity of the flexible mold can be fitted to the 3D model; (3) performing silanization treatment on the flexible mold, then pouring a flexible material into the surface of the flexible mold having the cavity, and performing demolding so as to form a flexible 3D microelectrode substrate; and (4) manufacturing a conductive layer on the flexible 3D microelectrode substrate so as to form the 3D microelectrode. In the present disclosure, a 3D microelectrode having an ultrahigh microcolumn height can be manufactured by using a 3D printing technology and a two-time mold-reversing method.

公开(公告)号：US09481565B2

公开(公告)日：2016-11-01

申请号：US14759602

申请日：2013-10-23

Applicant: Epcos AG

Inventor： Wolfgang Pahl

IPC: B81B7/00 ,  B81C1/00 ,  H04R23/00 ,  B81C3/00

CPC classification number: B81B7/0058 ,  B81B7/0054 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/0023 ,  B81C1/00301 ,  B81C3/001 ,  B81C2201/034 ,  B81C2203/0154 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2924/1461 ,  H01L2924/19107 ,  H04R23/00 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.

Abstract translation: 提出了包括载体，芯片部件和MEMS部件的部件，其中机械敏感的MEMS部件安装在载体上的半壳下方。 该组分在传递模塑过程中用模塑料封装。

公开(公告)号：US09138918B2

公开(公告)日：2015-09-22

申请号：US14455745

申请日：2014-08-08

Applicant: Honeywell International Inc.

Inventor： Robert Jon Carlson

IPC: C23F1/00 ,  B29C33/38 ,  H01L21/306 ,  C23F1/02 ,  B81C99/00 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B81B7/00

CPC classification number: B29C33/3842 ,  B29C41/00 ,  B29C59/14 ,  B29C59/16 ,  B29K2909/00 ,  B29K2995/0037 ,  B81B7/00 ,  B81B2201/05 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C99/009 ,  B81C2201/0132 ,  B81C2201/0143 ,  B81C2201/034 ,  C23F1/02 ,  H01L21/30604 ,  Y10T428/24496

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract translation: 本发明涉及用作至少部分微机电特征的模具的图案化气凝胶基层。 气凝胶的密度小于MEMS制造中使用的典型材料的密度，例如多晶硅，氧化硅，单晶硅，金属，金属合金等。 因此，可以以明显高于在较致密的材料中形成结构特征的速率的速率在气凝胶层中形成结构特征。 本发明还包括一种图案化气凝胶层以产生这种基于气凝胶的模具的方法。 本发明还包括使用基于气凝胶的模具制造微机电特征的方法。 该方法包括将致密材料层直接沉积在已经形成在气凝胶层中的微机电特征的至少一部分的轮廓上。

公开(公告)号：US20150158724A1

公开(公告)日：2015-06-11

申请号：US14570652

申请日：2014-12-15

Applicant: Universiteit Twente

Inventor： Johan Willem Berenschot ,  Niels Roelof Tas

IPC: B81C1/00 ,  G01Q70/16

CPC classification number: B81C1/00111 ,  B33Y10/00 ,  B33Y80/00 ,  B81C2201/034 ,  B82Y35/00 ,  G01Q70/10 ,  G01Q70/16 ,  Y10T428/2913 ,  Y10T428/2982

Abstract: The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.

Abstract translation: 本发明涉及一种制备具有纳米级结构的3D纳米结构的方法，包括以下步骤：i）提供包括至少一个锐角凹入角的模具; ii）在锋利的凹角中构造沉积至少一种结构材料; iii）各向同性地除去结构材料; iv）沉积至少一种其他结构材料; v）清除较早沉积的结构材料; vi）形成纳米结构; 和vii）去除模具，从而提供具有纳米结构的3D纳米结构。

公开(公告)号：US20150037597A1

公开(公告)日：2015-02-05

申请号：US14259628

申请日：2014-04-23

Applicant: Ajou University Industry-Academic Cooperation Foundation

Inventor： Chang-Koo Kim ,  Sung-Woon Cho

IPC: H01J37/32 ,  C23C18/38 ,  C23F1/12 ,  C23C18/32 ,  C23C18/31 ,  C23C18/18 ,  B22F1/00 ,  C23C18/42

CPC classification number: C23F1/12 ,  B22F1/0018 ,  B22F1/0044 ,  B22F9/02 ,  B22F2001/0037 ,  B22F2304/05 ,  B81C1/00492 ,  B81C2201/0187 ,  B81C2201/034 ,  C23C18/1605 ,  C23C18/1657 ,  C23C18/1893 ,  C23C18/405 ,  C23F4/00 ,  H01J2237/0203 ,  H01J2237/3341 ,  H01L21/288 ,  Y10T29/49982

Abstract: This invention relates to a method of fabricating a three-dimensional copper nanostructure, including manufacturing a specimen configured to include a SiO2 mask; performing multi-directional slanted plasma etching to form a three-dimensional etching structure layer on the specimen; performing plating so that a multi-directional slanted plasma etched portion of the specimen is filled with a metal; removing an over-plated portion and the SiO2 mask from the metal layer; and removing a portion of a surface of the specimen other than the metal which is the three-dimensional etching structure layer. In this invention, a uniform copper nanostructure array can be obtained by subjecting a large-area specimen disposed in a Faraday cage to multi-directional slanted plasma etching using high-density plasma, forming a copper film on the etched portion of the specimen, and removing an over-plated copper film and the SiO2 mask, and the diameter of the copper nanostructure can be arbitrarily adjusted, thus attaining high applicability.

Abstract translation: 本发明涉及一种制造三维铜纳米结构的方法，包括制造被配置为包括SiO 2掩模的试样; 执行多方向倾斜等离子体蚀刻以在样本上形成三维蚀刻结构层; 进行电镀，使得样品的多方向倾斜等离子体蚀刻部分被金属填充; 从金属层去除过镀层部分和SiO 2掩模; 除去除了作为三维蚀刻结构层的金属以外的试样的表面的一部分。 在本发明中，通过对设在法拉第笼中的大面积试样进行多层倾斜等离子体蚀刻，使用高密度等离子体，在试样的蚀刻部分上形成铜膜，可以得到均匀的铜纳米结构体， 去除过镀铜膜和SiO 2掩模，并且可以任意调整铜纳米结构的直径，从而获得高适用性。

公开(公告)号：US08845911B2

公开(公告)日：2014-09-30

申请号：US13862023

申请日：2013-04-12

Applicant: Technische Universitaet Ilmenau

Inventor： Joerg Hampl ,  Frank Weise ,  Gregor Schlingloff ,  Andreas Schober ,  Uta Fernekorn

IPC: C03C15/00 ,  B81C99/00 ,  B44C1/22

CPC classification number: B44C1/227 ,  B81B2201/06 ,  B81B2203/0346 ,  B81B2207/056 ,  B81C99/0085 ,  B81C2201/034 ,  Y10T428/24281

Abstract: A method is provided for producing a microstructured molded object that is intended for culturing of biological cells. According to this method, a plastically deformable first porous film is prepared, as well as a deformable second film and a deformable sacrificial film. The first, second and sacrificial film are placed in a stack. Next, the sacrificial film is subjected to pressure to press the stack into a mold. The mold has recesses, such that deformed regions in the form of cavities are produced in the sacrificial film, the first film and the second film, and undeformed regions remain. During the pressing of the film stack into the mold, the first film and the second film are joined to each other, so that they form a composite film. At least portions of the deformed regions of the second film are etched so that sections of the second film are chemically dissolved. In these sections of the second film, sections in the deformed regions of the first film are opened up, so that the pores in these sections are again free.

Abstract translation: 提供了用于生产用于培养生物细胞的微结构模制物体的方法。 根据该方法，制备可塑性变形的第一多孔膜，以及可变形的第二膜和可变形的牺牲膜。 第一，第二和牺牲膜被放置在堆叠中。 接下来，牺牲膜经受压力以将叠层压入模具中。 模具具有凹部，使得在牺牲膜，第一膜和第二膜中产生空腔形式的变形区域，并且保留未变形的区域。 在将膜堆叠压入模具期间，第一膜和第二膜彼此接合，从而形成复合膜。 蚀刻第二膜的变形区域的至少部分，使得第二膜的部分化学溶解。 在第二膜的这些部分中，第一膜的变形区域中的部分被打开，使得这些部分中的孔再次游离。

公开(公告)号：US08778195B2

公开(公告)日：2014-07-15

申请号：US12715801

申请日：2010-03-02

Applicant: Stéfan Landis

Inventor： Stéfan Landis

IPC: B44C1/22 ,  B82Y40/00

CPC classification number: G03F7/2059 ,  B81C99/009 ,  B81C2201/0159 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017

Abstract: A method to fabricate an imprint mould in three dimensions including at least: a) forming at least one trench, of width W and depth h, in a substrate, thereby forming three surfaces including, a bottom of the at least one trench, sidewalls of the at least one trench, and a remaining surface of the substrate, called top of the substrate; b) forming alternate layers in the at least one trench, each having at least one portion perpendicular to the substrate, in a first material and in a second material which can be selectively etched relative to the first material; and c) selectively etching said portions of the layers perpendicular to the substrate.

Abstract translation: 一种在三维中制造压印模具的方法，至少包括：a）在衬底中形成宽度为W和深度为h的至少一个沟槽，从而形成三个表面，包括至少一个沟槽的底部， 所述至少一个沟槽和所述衬底的剩余表面称为所述衬底的顶部; b）在所述至少一个沟槽中形成交替层，每个沟槽具有至少一部分垂直于所述衬底的第一材料和第二材料，所述第二材料可相对于所述第一材料选择性地蚀刻; 和c）选择性地刻蚀垂直于衬底的层的所述部分。

公开(公告)号：US20140023849A1

公开(公告)日：2014-01-23

申请号：US13983637

申请日：2012-02-03

Applicant: Thomas Lisec ,  Mato Knez

Inventor： Thomas Lisec ,  Mato Knez

IPC: B29C67/00

CPC classification number: B29C67/0074 ,  B29C64/141 ,  B81C99/0085 ,  B81C2201/034 ,  C23C16/01 ,  C23C16/045 ,  C23C16/403 ,  C23C16/45525 ,  C23C16/56 ,  Y10T428/249955

Abstract: The invention relates to a method for producing a three-dimensional structure. The method according to the invention comprises the following steps: applying to or introducing into a carrier element (1; 7; 16) particles (2), a plurality of at least partially interlinked cavities being formed between the particles (2) and the particles (2) coming into contact in points of contact, and interconnecting the particles (2) in the points of contact by coating the system consisting of particles and the carrier element, the coat (4) produced during coating penetrating the cavities at least to some extent. The method according to the invention allows the production of three-dimensional structures with little effort.

Abstract translation: 本发明涉及三维结构的制造方法。 根据本发明的方法包括以下步骤：向载体元件（1; 7; 16）施加或引入颗粒（2），在颗粒（2）和颗粒之间形成多个至少部分互连的空腔 （2）以接触点接触，并且通过涂覆由颗粒和载体元件组成的系统将接触点中的颗粒（2）互连，在涂覆期间产生的涂层（4）至少渗透到空腔中 程度。 根据本发明的方法允许以很小的努力生产三维结构。

公开(公告)号：US08563226B2

公开(公告)日：2013-10-22

申请号：US12723147

申请日：2010-03-12

Applicant: Pierre Cusin ,  Clare Golfier ,  Jean-Philippe Thiebaud

Inventor： Pierre Cusin ,  Clare Golfier ,  Jean-Philippe Thiebaud

IPC: C25D1/00 ,  G03C5/00 ,  G03F7/20

CPC classification number: C25D1/10 ,  B29C33/3842 ,  B81C99/009 ,  B81C2201/034

Abstract: The invention relates to a method (3) of fabricating a mold (39, 39′) including the following steps: (a) depositing (9) an electrically conductive layer on the top (20) and bottom (22) of a wafer (21) made of silicon-based material; (b) securing (13) the wafer to a substrate (23) using an adhesive layer; (c) removing (15) one part (26) of the conductive layer from the top of the wafer (21); and (d) etching (17) the wafer as far as the bottom conductive layer (22) thereof in the shape (26) of the one part removed from the top conductive layer (22) to form at least one cavity (25) in the mold. The invention concerns the field of micromechanical parts, particularly, for timepiece movements.

Abstract translation: 本发明涉及一种制造模具（39,39'）的方法（3），包括以下步骤：（a）在晶片的顶部（20）和底部（22）上沉积（9）导电层（ 21）由硅基材料制成; （b）使用粘合剂层将晶片固定（13）到基底（23）上; （c）从所述晶片（21）的顶部去除（15）所述导电层的一部分（26）; 以及（d）将所述晶片的所述底部导电层（22）蚀刻（17）至所述一个部分的形状（26）从顶部导电层（22）去除，以形成至少一个空腔（25） 模具。 本发明涉及微机械部件领域，特别涉及时计运动。