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    Substrate for display element and its manufacturing method
    202.
    发明专利
    Substrate for display element and its manufacturing method 审中-公开
    显示元件基板及其制造方法

    公开(公告)号：JP2008107510A

    公开(公告)日：2008-05-08

    申请号：JP2006289439

    申请日：2006-10-25

    Applicant: Nitto Denko Corp ,  日東電工株式会社

    Inventor： MURASHIGE TAKESHI ,  SAKATA YOSHIMASA ,  NAGATSUKA TATSUKI

    IPC: G09F9/30 ,  G02F1/1333

    CPC classification number: G02F1/133305 ,  B32B17/064 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0166 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/266 ,  Y10T428/31525

    Abstract: PROBLEM TO BE SOLVED: To provide a substrate for a display element, the substrate excellent in gas barrier property, flexibility, heat resistance and transparency, and excellent in dimensional stability, operation property and secondary processing property. SOLUTION: The substrate for a display element comprises an inorganic glass and a resin layer disposed on each side of the inorganic glass. It is preferable that: the ratio d rsum /d g of the total thickness d rsum of the resin layers to the thickness d g of the inorganic glass ranges from 0.5 to 2.0; the resin layers on both sides of the inorganic glass are made of the same material having the same thickness; the thickness of each resin layer is equal to the thickness of the inorganic glass; and the average coefficient of linear expansion of the substrate for a display element at 170°C is not greater than 20 ppm°C -1 . COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种显示元件用基板，阻气性，柔软性，耐热性，透明性优异，尺寸稳定性，操作性和二次加工性优异的基板。 解决方案：用于显示元件的基板包括无机玻璃和设置在无机玻璃的每一侧上的树脂层。 优选的是，树脂层的总厚度d SB SB值与厚度d 的比d rsum / d 无机玻璃的g 为0.5〜2.0; 无机玻璃两侧的树脂层由具有相同厚度的相同材料制成; 每个树脂层的厚度等于无机玻璃的厚度; 并且显示元件的基板在170℃下的平均线膨胀系数不大于20ppm℃ -1 。 版权所有（C）2008，JPO＆INPIT

    Process for producing via for circuit assembly
    203.
    发明专利
    Process for producing via for circuit assembly 审中-公开
    通过电路组装生产的方法

    公开(公告)号：JP2007251207A

    公开(公告)日：2007-09-27

    申请号：JP2007159588

    申请日：2007-06-15

    Applicant: Ppg Ind Ohio Inc ,  ピーピージー インダストリーズ オハイオ, インコーポレイテッド

    Inventor： WANG ALAN E ,  OLSON KEVIN C

    IPC: H05K1/05 ,  H05K3/00 ,  H05K3/06 ,  H05K3/44 ,  H05K3/46

    CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2203/135 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49167 ,  Y10T428/12361 ,  Y10T428/24322

    Abstract: PROBLEM TO BE SOLVED: To provide a multi layer circuit panel structure offering a high density and compound interconnection that overcomes defects of an advanced technique circuit assembly. SOLUTION: A method of producing a via for a circuit assembly includes: (a) process to apply a curable coating composition on a substrate to form uncured coating thereon, in which part of or all the substrate is electrically conductive, (b) process to apply resist on the uncured coating, (c) process to image the resist at a predetermined position, (d) process to develop the resist to expose a predetermined area of the uncured coating, (e) process to remove the exposed area of the uncured coating, and (f) process to heat the coated substrate of the process (e) with sufficient temperature and time for curing the coating. Process to produce the circuit assembly will be disclosed as well. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供提供高密度和复合互连的多层电路板结构，其克服了先进技术电路组件的缺陷。 制造电路组件用通孔的方法包括：（a）将可固化涂料组合物涂布在基材上以在其上形成未固化涂层的方法，其中部分或全部基材是导电的，（b ）处理以在未固化涂层上施加抗蚀剂，（c）在预定位置成像抗蚀剂的工艺，（d）处理以显影抗蚀剂以暴露未固化涂层的预定区域，（e）处理以除去曝光区域 的未固化涂层，以及（f）以足够的温度和时间加热涂覆的方法（e）的涂覆基材以使涂层固化的方法。 还将公开生产电路组件的工艺。 版权所有（C）2007，JPO＆INPIT

    Chemical etching method
    205.
    发明专利
    Chemical etching method 失效
    化学蚀刻方法

    公开(公告)号：JPS58204176A

    公开(公告)日：1983-11-28

    申请号：JP8770582

    申请日：1982-05-24

    Applicant: Kangiyou Denki Kiki Kk

    Inventor： SUDOU MITSUO ,  MIURA HITOSHI

    IPC: C23F1/00 ,  C23F1/02 ,  G03F7/40 ,  H01L21/306 ,  H05K3/06

    CPC classification number: H05K3/061 ,  C23F1/02 ,  G03F7/40 ,  H05K2201/0166 ,  H05K2203/0369 ,  H05K2203/0597

    Abstract: PURPOSE: To perform etching with less side etching and with high accuracy in the stage of etching the conductor layer on an insulation substrate at the pattern conforming to the pattern of a resist film, by adhering the resist film on the side etched part and again etching the same.
    CONSTITUTION: An etching resistant mask layer 13 of a prescribed pattern is formed of a material of rubber or polyester on the surface of the conductive material 12 on an insulation substrate 11. The material 12 as a material to be etched is etched to about a fraction of the thickness thereof by the 1st etching. The substrate is then dipped in an adhesive agent soln. consisting of an aq. soln. glycol and an org. acid such as maleic acid to put the soln. 31 of the adhesive agent in the grooves 30 formed by the etching; thereafter, the soln. is dried thereby forming a thin film 32 of the adhesive agent and covering the side face of the grooves 30 with the mask layer 13 in the side etched part. The thin film 32 of the adhesive agent in the part not covered with the layer 13 is evaporated and the conductive material is subjected to the next etching, whereby the etching is accomplished with less side etching.
    COPYRIGHT: (C)1983,JPO&Japio

    Abstract translation: 目的：通过将抗蚀剂膜粘附在侧面蚀刻部分上并再次蚀刻，在与蚀刻膜图案相符的图案的绝缘基板上蚀刻导体层的阶段，以较少的侧蚀刻和高精度进行蚀刻 一样。 构成：在绝缘基板11上的导电材料12的表面上，由橡胶或聚酯的材料形成规定图案的抗蚀刻掩模层13.作为被蚀刻材料的材料12被蚀刻到约一部分 的厚度。 然后将基材浸入粘合剂溶液中。 由一个水池组成 索恩 乙二醇和组织。 酸如马来酸放入溶胶中。 31是通过蚀刻形成的槽30中的粘合剂; 此后，soln。 被干燥，从而形成粘合剂的薄膜32，并且在侧蚀刻部分中用掩模层13覆盖凹槽30的侧面。 未被层13覆盖的部分中的粘合剂的薄膜32被蒸发，并且对导电材料进行下一次蚀刻，由此通过较少的侧面蚀刻来实现蚀刻。

    光硬化性熱硬化性樹脂組成物
    208.
    发明申请
    光硬化性熱硬化性樹脂組成物 审中-公开
    可光/热固化树脂组合物

    公开(公告)号：WO2012173242A1

    公开(公告)日：2012-12-20

    申请号：PCT/JP2012/065404

    申请日：2012-06-15

    Applicant: 太陽インキ製造株式会社 ,  伊藤 信人 ,  有馬 聖夫

    Inventor： 伊藤　信人 ,  有馬　聖夫

    IPC: G03F7/033 ,  C08F293/00 ,  G03F7/004 ,  G03F7/038 ,  H05K3/28

    CPC classification number: G03F7/0384 ,  B32B27/38 ,  B32B27/42 ,  C08F287/00 ,  C08L61/14 ,  C08L63/10 ,  G03F7/038 ,  G03F7/0388 ,  H05K3/287 ,  H05K2201/0166

    Abstract: 　優れた冷熱衝撃耐性を有し、また半導体パッケージ用ソルダーレジストとして重要なＰＣＴ耐性、ＨＡＳＴ耐性、無電解金メッキ耐性に優れた硬化被膜を形成できるアルカリ現像可能な光硬化性熱硬化性樹脂組成物を提供する。（Ａ）感光性カルボキシル基含有樹脂、（Ｂ）光重合開始剤、（Ｃ）ブロック共重合体、および、（Ｄ）熱硬化性成分を含有することを特徴とするアルカリ現像可能な光硬化性熱硬化性樹脂組成物である。

    Abstract translation: 本发明提供一种能够形成耐热冲击性优异的固化涂膜和对于半导体封装的阻焊剂，即PCT电阻，耐HAST电阻和无电镀金电镀性能的重要性能的碱显影性光固化/热固性树脂组合物。 该碱显影性光固化/热固性树脂组合物的特征在于含有（A）含感光性羧基的树脂，（B）光聚合引发剂，（C）嵌段共聚物和（D）热固性成分。

    PASSIVE ELECTRICAL DEVICES AND METHODS OF FABRICATING PASSIVE ELECTRICAL DEVICES
    210.
    发明申请
    PASSIVE ELECTRICAL DEVICES AND METHODS OF FABRICATING PASSIVE ELECTRICAL DEVICES 审中-公开
    被动电气设备和制造被动电气设备的方法

    公开(公告)号：WO2010081073A2

    公开(公告)日：2010-07-15

    申请号：PCT/US2010020620

    申请日：2010-01-11

    Applicant: OAK MITSUI TECHNOLOGIES LLC ,  PRAMANIK PRANABES ,  KAGEYAMA YUJI ,  KUWAKO FUJIO ,  HWANG JIN HYUNG

    Inventor： PRAMANIK PRANABES ,  KAGEYAMA YUJI ,  KUWAKO FUJIO ,  HWANG JIN HYUNG

    IPC: H01G4/33 ,  H01G4/30

    CPC classification number: H01G4/18 ,  H01G4/203 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09309 ,  Y10T156/10

    Abstract: A thin laminate passive electrical device (40, 70, 90, 100), such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device (40, 70, 90, 100) includes two conductors (32, 34), for example, copper foil conductors, separated by a dielectric having a first layer (36) of a first material having a softening point temperature greater than a first temperature and a first layer (38) of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C or higher. By providing a first layer (36) having a higher softening point material, shorting across the conductors (32, 34), that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.

    Abstract translation: 提供了诸如电容器的薄层压无源电器件（40,70,90,100）以及制造薄层压无源电器件的方法。 无源电器件（40,40,90,100）包括两个导线（32,34），例如铜箔导体，铜箔导体由具有软化温度较高的第一材料的第一层（36）的电介质隔开， 比第一温度和具有低于第一温度的软化点温度的第二材料的第一层（38）。 第一温度可以为至少150℃以上。 通过提供具有较高软化点材料的第一层（36），防止可以通过制造工艺促进的导体（32,34）之间的短路。 还公开了制造无源电器件的方法。

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