公开(公告)号：US09089714B2

公开(公告)日：2015-07-28

申请号：US12549831

申请日：2009-08-28

Applicant: David Robinson

Inventor： David Robinson

IPC: A61N1/05 ,  A61N1/375 ,  H05K3/10 ,  A61N1/36 ,  A61N1/372

CPC classification number: A61N1/375 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.

Abstract translation: 一种包括可植入电子模块和组织界面的主动植入式医疗装置（AIMD）。 电子模块和组织界面中的至少一个包括具有一个或多个与基底缝合的导电丝的一个或多个生物相容的导电股线的非导电，生物相容性和针刺的基底。 如本文所使用的，将导电丝缝合到基部是指通过使用手或机针刺将缝线，刺绣或以其他方式将灯丝固定到基座。

公开(公告)号：US08935851B2

公开(公告)日：2015-01-20

申请号：US13519144

申请日：2011-01-12

Applicant: Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

Inventor： Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

IPC: H01K3/10 ,  B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  H05K3/02 ,  H05K3/46 ,  H05K1/02 ,  H05K1/03 ,  H05K3/42

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  B32B2305/076 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4632 ,  H05K2201/0187 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.

Abstract translation: 制造电路板的方法包括：在芯材中形成第一通孔; 在所述第一通孔的内壁上形成第一导电膜; 在芯材的两个表面和第一通孔中形成绝缘层; 在第一通孔中的绝缘层中形成第二通孔; 在所述第二通孔的内壁上形成第二导电膜; 以及在形成在所述芯材的两个表面上的所述绝缘层的表面上形成与所述第二导电膜电连接的信号电路层。

公开(公告)号：US20140284076A1

公开(公告)日：2014-09-25

申请号：US14297715

申请日：2014-06-06

Applicant: INTEGRAL TECHNOLOGIES, INC.

Inventor： THOMAS AISENBREY

IPC: H01M2/30 ,  H01B7/02 ,  H01B3/30

CPC classification number: H01M2/30 ,  B29C45/0001 ,  B29C45/0013 ,  B29C48/022 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2031/3456 ,  B29L2031/3468 ,  B29L2031/36 ,  G06K19/07749 ,  H01B3/30 ,  H01B3/308 ,  H01B7/02 ,  H01B13/0036 ,  H01M2/00 ,  H01M10/6551 ,  H01Q1/1271 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49108

Abstract: Electrical terminals are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, aluminum fiber, or the like.

Abstract translation: 电端子由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或其组合的重量百分数为导电负载树脂基材料重量的约20％至50％。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀的等，或由金属如不锈钢，镍，铜，银，也可以是金属镀，或者 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维，铝纤维等。

公开(公告)号：US20140111684A1

公开(公告)日：2014-04-24

申请号：US13655215

申请日：2012-10-18

Applicant: APPLE INC.

Inventor： Sean S. Corbin ,  Taylor H. Gilbert ,  Rodney A. Gomez Angulo ,  Yi Jiang ,  Conor P. Lenahan ,  Qingxiang Li ,  Stephen R. McClure ,  Robert W. Schlub ,  Salih Yarga ,  Jiang Zhu

IPC: H01Q1/24 ,  H04R1/02 ,  H04N5/225 ,  H05K1/14

CPC classification number: H01Q1/243 ,  H01Q1/38 ,  H04N5/2257 ,  H05K1/0215 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/10409

Abstract: An electronic device may have a conductive housing with an antenna window. Antenna structures may be mounted adjacent to the antenna window. The antenna structures may have a dielectric carrier. Patterned metal antenna traces may be formed on the surface of the dielectric carrier. A proximity sensor may be formed from a flexible printed circuit mounted on the dielectric carrier. The flexible printed circuit may have a tail that contains a transmission line for feeding the antenna structures. The transmission line may include a positive signal conductor that is maintained at a desired distance from the conductive housing using a polymer sheet. A portion of the antenna structures may protrude between a microphone and a camera module. Plastic camera module housing structures may have an inner surface coated with a shielding metal. A U-shaped conductive fabric layer may be used as a grounding structure.

Abstract translation: 电子设备可以具有带有天线窗口的导电壳体。 天线结构可以安装在天线窗口附近。 天线结构可以具有电介质载体。 图案化的金属天线迹线可以形成在电介质载体的表面上。 接近传感器可以由安装在电介质载体上的柔性印刷电路形成。 柔性印刷电路可以具有包含用于馈送天线结构的传输线的尾部。 传输线可以包括使用聚合物片材从导电壳体保持在期望距离的正信号导体。 天线结构的一部分可以在麦克风和相机模块之间突出。 塑料相机模块外壳结构可以具有涂覆有屏蔽金属的内表面。 可以使用U形导电织物层作为接地结构。

公开(公告)号：US08505474B2

公开(公告)日：2013-08-13

申请号：US12668930

申请日：2008-07-30

Applicant: Tae Jin Kang ,  Byung Duck Kim ,  Young Seung Chi ,  Jung Sim Roh

Inventor： Tae Jin Kang ,  Byung Duck Kim ,  Young Seung Chi ,  Jung Sim Roh

IPC: D05B3/00 ,  D02G3/36

CPC classification number: D02G3/12 ,  A41D27/00 ,  D02G3/28 ,  D02G3/441 ,  D05C7/06 ,  D10B2331/04 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029

Abstract: The present invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit using thereof which may be applicable to smart textiles. More particularly, this invention relates to an electrically conductive metal composite embroidery yarn and embroidered circuit for smart textiles which can be used as power supply and signal transmission lines. The present invention provides an embroidered circuit which consists of a metal composite embroidery yarn and a dielectric fabric substrate, wherein the electrically conductive metal composite embroidery yarn is embroidered on the dielectric fabric substrate to form a circuit.

Abstract translation: 本发明涉及可应用于智能纺织品的导电金属复合刺绣线及其使用的绣花电路。 更具体地，本发明涉及可用作电源和信号传输线的智能纺织品的导电金属复合刺绣线和绣花电路。 本发明提供了一种由金属复合刺绣纱线和电介质织物基材组成的绣花线路，其中将导电金属复合刺绣纱线绣在电介质织物基底上以形成电路。

公开(公告)号：US20130027963A1

公开(公告)日：2013-01-31

申请号：US13640499

申请日：2011-04-11

Applicant: Maarten Marinus Johannes Wilhelmus Van Herpen ,  Paulus Antonius Emil Jochijms ,  Oscar Hendrikus Willemsen

Inventor： Maarten Marinus Johannes Wilhelmus Van Herpen ,  Paulus Antonius Emil Jochijms ,  Oscar Hendrikus Willemsen

IPC: F21V21/00 ,  B23K31/02 ,  F21V8/00

CPC classification number: G09F13/22 ,  G09F9/33 ,  G09F21/02 ,  G09F2021/023 ,  H01L25/0753 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281

Abstract: The invention provides a textile product (1) having a lighting function. The textile product (1) comprises (a) a coated textile structure (2) comprising a textile (200) with a first textile coating (211) at a first side (210) and optionally a second textile coating (222) at a second side (220) of the textile (200); (b) a lighting unit (300) comprising a substrate (310) with a substrate surface (311) and a light source (330) comprised by the substrate surface (311), wherein the lighting unit (300) is arranged within the coated textile structure (2), wherein the lighting unit (300) is arranged to provide light (331) through the first textile coating (211), wherein the substrate surface (311) further comprises an electrically conductive connector part (340), and wherein the connector part (340) is arranged to supply electrical power to the light source (330) when electrically connected to an electrical power source (500).

Abstract translation: 本发明提供一种具有照明功能的纺织品（1）。 纺织产品（1）包括（a）涂层织物结构（2），其包括在第一侧（210）处具有第一纺织品涂层（211）的织物（200）和可选地在第二侧面处的第二织物涂层（222） （200）的侧面（220）; （b）照明单元（300），其包括具有基板表面（311）的基板（310）和由所述基板表面（311）包括的光源（330），其中所述照明单元（300）布置在所述涂覆 纺织结构（2），其中所述照明单元（300）布置成通过所述第一织物涂层（211）提供光（331），其中所述基底表面（311）还包括导电连接器部分（340），并且其中 连接器部分（340）被布置成当电连接到电源（500）时向光源（330）提供电力。

公开(公告)号：US20120279765A1

公开(公告)日：2012-11-08

申请号：US13519144

申请日：2011-01-12

Applicant: Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

Inventor： Sohei Samejima ,  Hajime Takeya ,  Hiroyuki Osuga

IPC: H05K1/05 ,  H05K3/02

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B25/14 ,  B32B27/04 ,  B32B2305/076 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4632 ,  H05K2201/0187 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0358 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film.

Abstract translation: 制造电路板的方法包括：在芯材中形成第一通孔; 在所述第一通孔的内壁上形成第一导电膜; 在芯材的两个表面和第一通孔中形成绝缘层; 在第一通孔中的绝缘层中形成第二通孔; 在所述第二通孔的内壁上形成第二导电膜; 以及在形成在所述芯材的两个表面上的所述绝缘层的表面上形成与所述第二导电膜电连接的信号电路层。

公开(公告)号：US08148647B2

公开(公告)日：2012-04-03

申请号：US11832376

申请日：2007-08-01

Applicant: Souhei Samejima ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

Inventor： Souhei Samejima ,  Sadao Sato ,  Hiroyuki Osuga ,  Shigeru Utsumi ,  Teruhiko Kumada

IPC: H05K1/11

CPC classification number: H05K3/4641 ,  H05K1/056 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09809 ,  Y10T29/49155

Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.

Abstract translation: 本发明的目的是提供一种具有优异的散热性能和优异的可靠性的印刷电路板及其制造方法。 印刷电路板包括：在每个覆盖设置有第一通孔（1a）的金属板（1）的表面和第一通孔（1a）的内壁之后，预浸料（2a）和（2b）固化; 玻璃衣服（3a）和（3b）夹在预浸料（2a）和（2b）之间，以及预浸料坯（4a）和（4b）分别固化的预浸料坯（4a）和（4b） 以及分别设置在预浸料坯（6a）和（6b）的两个表面上的布线层（7a）和（7c）和（7b）和（7d）的第二通孔（8）。 预浸料（2a）和（2b）和预浸料（4a）和（4b）的特征在于它们含有无机填料。 此外，预浸料（2a）和（2b）和预浸料（4a）和（4b）可以含有弹性体。

公开(公告)号：US20120069486A1

公开(公告)日：2012-03-22

申请号：US13321943

申请日：2009-06-08

Applicant: James Lee ,  Hong hsu Huang

Inventor： James Lee ,  Hong hsu Huang

IPC: H01G4/00

CPC classification number: G06F3/044 ,  G01D5/2405 ,  G06F2203/04111 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151

Abstract: A fabric connector for sensing object proximity is provided. The fabric connector comprises a sensing layer (23), an insulating layer (22) and a yarn (26). The sensing layer has at least one connection region (233a, 233b, 233c, 233d) and a disconnection region. The at least one connection region (233a, 233b, 233c, 233d) has a capacitance value and is formed with conductive fabric. The insulation layer (22) which is formed with insulating fabric is disposed below the sensing layer (23). The yarn (26) is formed with conductive material and is configured to electrically connect to the at least one connection region (233a, 233b, 233c, 233d) of the sensing layer (23) and a sensor (25). The sensor (25) senses a variation in the capacitance value of the at least one connection region (233a, 233b, 233c, 233d) in accordance with object proximity.

Abstract translation: 提供了用于感测物体接近度的织物连接器。 织物连接器包括感测层（23），绝缘层（22）和纱线（26）。 感测层具有至少一个连接区域（233a，233b，233c，233d）和断开区域。 所述至少一个连接区域（233a，233b，233c，233d）具有电容值并且由导电织物形成。 由绝缘织物形成的绝缘层（22）设置在感测层（23）的下方。 纱线（26）由导电材料形成，并且构造成电连接到感测层（23）的至少一个连接区域（233a，233b，233c，233d）和传感器（25）。 传感器（25）根据物体的接近度感测至少一个连接区域（233a，233b，233c，233d）的电容值的变化。

公开(公告)号：US08093147B2

公开(公告)日：2012-01-10

申请号：US12814305

申请日：2010-06-11

Applicant: Akio Kawabata ,  Shintaro Sato

Inventor： Akio Kawabata ,  Shintaro Sato

IPC: H01L21/44

CPC classification number: D01F9/127 ,  B82Y10/00 ,  B82Y30/00 ,  H01L21/76885 ,  H01L23/373 ,  H01L23/485 ,  H01L23/5226 ,  H01L23/53276 ,  H01L24/13 ,  H01L2221/1094 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/14 ,  H05K3/4007 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  Y10S977/742 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An aggregate structure of carbon fibers, organized by a plurality of carbon fibers, includes, an aggregate of the carbon fibers aligned in a lengthwise direction, in which a density of the carbon fibers at one side end is different from a density of the carbon fibers at the other side end.

Abstract translation: 通过多个碳纤维组织的碳纤维的聚集体结构包括沿长度方向排列的碳纤维的聚集体，其中一侧的碳纤维的密度与碳纤维的密度不同 在另一边。