公开(公告)号：EP1954111B1

公开(公告)日：2011-12-14

申请号：EP06821809.8

申请日：2006-10-03

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： MURATA, Takaki ,  SUGIMOTO, Yasutaka

IPC: H05K3/00 ,  H01L21/48 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/49822 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/308 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A process for producing a multilayer ceramic substrate, in which with respect to a multilayer ceramic substrate prepared by non-shrinking process, there can be avoided flawing of a wiring conductor formed on a surface of the multilayer ceramic substrate. On at least one major surface of a laminate composed of, superimposed one upon another, multiple ceramic green sheets (11) for substrate containing a ceramic material powder, shrinkage inhibiting green sheets (21,25) containing an inorganic material powder not sintered at firing temperature for the ceramic green sheets (11) for substrate are disposed so as to, along at least portion of the periphery of the major surface, realize exposure of the portion or the vicinity thereof, thereby obtaining a composite laminate. The composite laminate is fired under such conditions that the ceramic material powder is sintered but the inorganic material powder is not sintered. Thereafter, the shrinkage inhibiting green sheets (21,25) are removed. In multilayer ceramic substrate (10t), protrusions (12x,12y) are produced along at least portion of the periphery of major surface (11t).

公开(公告)号：EP2387068A2

公开(公告)日：2011-11-16

申请号：EP11177078.0

申请日：2007-03-22

Applicant: CeramTec GmbH

Inventor： Kluge, Dr. Claus Peter

IPC: H01L23/15 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L25/16 ,  H05K1/02 ,  H01L23/552

CPC classification number: F21V29/70 ,  F21K9/23 ,  F21V29/71 ,  F21V29/713 ,  F21V29/75 ,  F21V29/763 ,  F21V29/86 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  F28F2215/10 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/552 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L25/162 ,  H01L33/642 ,  H01L33/648 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/09045 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00011

Abstract: Die Erfindung betrifft einen Trägerkörper (1, 2) für elektrische oder elektronische Bauelemente (6a, 6b, 6c, 6d) oder Schaltungen, wobei der Trägerkörper (1, 2) elektrisch nicht oder nahezu nicht leitend ist, der Trägerkörper (1, 2) einstückig mit Wärme ab- oder zuführenden Kühlelementen (7) versehen ist, der Trägerkörper (1, 2) eine Platine ist und auf der Oberfläche des Trägerkörpers (1, 2) versinterte Metallisierungsbereiche (41) aufgebracht sind.
Erfindungsgemäß wird vorgeschlagen, dass der Trägerkörper (1, 2) und/oder das Kühlelement (7) aus einem Kompositmaterial besteht und das Kompositmaterial elektrisch nicht oder nahezu nicht leitende Matrixmaterialien mit Wärme leitenden Zuschlagstoffen enthält.

Abstract translation: 本发明涉及一种承载体（1,2），用于电气或电子元件（6A，6B，6C，6D）或电路，其中，所述承载体（1，2）被电不或基本上不导电的，所述支撑体（1，2） 一体地设置关闭或与冷却元件（7），承载体供给热量（1,2）是一个电路板和承载体的表面上的（1，2）烧结的金属化区域（41）被应用。 根据本发明，提出的是，承载体（1，2）和/或冷却元件（7）由复合材料和非导电性的或基本上不包含基体材料的热传导性添加剂的复合材料制成。

公开(公告)号：EP2236017A1

公开(公告)日：2010-10-06

申请号：EP08868524.3

申请日：2008-12-29

Applicant: Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO

Inventor： MEINDERS, Erwin Rinaldo ,  GELINCK, Gerwin Hermanus

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4638 ,  H05K1/0393 ,  H05K3/4069 ,  H05K3/4635 ,  H05K2201/051 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2203/0108 ,  H05K2203/0228 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T156/1039

Abstract: The invention relates to a method of aligning a flexible foil sheet having a general first foil sheet length direction to form stacked foil sheet layers on a reel having a reel diameter. The method comprises providing multiple alignment markers in the foil sheet, distanced conform the reel diameter and each having an mark length direction transverse to the first foil sheet length direction, to form protrusions and corresponding recesses on opposite faces of the foil sheet; winding the foil sheet on the reel in the first foil sheet length direction of the foil sheet; and co-aligning the alignment markers to have protrusions of one mark matching with a recess of another mark, so as to block relative movement of the stacked foil sheet layers in the first foil sheet length direction. Preferably, the foil sheet layers are provided with device functionality to form a stacked foil sheet layered device.

公开(公告)号：EP2220917A1

公开(公告)日：2010-08-25

申请号：EP08854746.8

申请日：2008-11-07

Applicant: S.D. Warren Services Company

Inventor： BLENKHORN, Gary P.

IPC: H05K3/12

CPC classification number: H05K3/1258 ,  H05K3/0023 ,  H05K3/1275 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Methods are disclosed for manufacturing electronic devices (e.g., transistors, and etc.), solar arrays, optical display arrays, portions of such devices and arrays, and the like. The method involves preparing substrate pre-forms comprising a pattern of raised and recessed areas. Utilizing a scrape coating and/or a tip printing process, various electronic and solar arrays are manufactured.

公开(公告)号：EP1722613A4

公开(公告)日：2010-06-16

申请号：EP05710333

申请日：2005-02-17

Applicant: SANKYO KASEI KK

Inventor： YUMOTO TETSUO

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/42

CPC classification number: G01R31/28 ,  H05K1/0284 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09854 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49165 ,  Y10T29/49176

公开(公告)号：EP1978558A1

公开(公告)日：2008-10-08

申请号：EP08154036.1

申请日：2008-04-03

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Shiraishi, Akinori ,  Murayama, Kei ,  Sunohara, Masahiro ,  Koizumi, Naoyuki ,  Higashi, Mitsutoshi

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate (101) includes a storage portion (101C) which is defined by a base for mounting a light emitting element (102) and a wall portion standing up on and from the base. A package (100) is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion (101C) is connected to a cover (103) to thereby seal a light emitting element. A seal structure (130; 330; 430) is composed of an uneven portion (140; 340) formed on the lower surface side surface of the base (101A), a close contact layer (150) formed on the surface of the uneven portion (140; 340), a power supply layer (160) formed on the close contact layer (150), and an electrode layer (170) formed on the surface of the power supply layer (160). The uneven portion(140; 340) includes a first recessed portion (180) formed at a position spaced in the radial direction from the outer periphery of a through electrode (107) or from the inner wall of a through hole (120), and a second recessed portion (190) formed at a position spaced further outwardly from the first recessed portion (180).

Abstract translation: 基板（101）包括由用于安装发光元件（102）的底座和从底座上站立的壁部分限定的存储部分（101C）。 包装体（100）被构造为使得形成为围绕存储部（101C）的周边的壁部的上端连接到盖（103），从而密封发光元件。 密封结构（130; 330; 430）由形成在基座（101A）的下表面侧表面上的不平坦部分（140; 340），形成在不平坦部分的表面上的紧密接触层 （140; 340），形成在紧密接触层（150）上的电源层（160）和形成在电源层（160）的表面上的电极层（170）。 不平坦部分（140,340）包括形成在与穿通电极（107）的外周沿径向间隔开的位置或从通孔（120）的内壁隔开的位置的第一凹部（180），以及 形成在与所述第一凹部（180）进一步向外间隔开的位置的第二凹部（190）。

公开(公告)号：EP1408277B1

公开(公告)日：2008-10-01

申请号：EP03291634.8

申请日：2003-07-02

Applicant: AUTOMOTIVE LIGHTING REAR LAMPS FRANCE

Inventor： Buisson, Alain

IPC: F21V19/00

CPC classification number: H05K3/202 ,  F21S43/195 ,  H01R33/09 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10113

公开(公告)号：EP1954111A1

公开(公告)日：2008-08-06

申请号：EP06821809.8

申请日：2006-10-03

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： MURATA, Takaki ,  SUGIMOTO, Yasutaka

IPC: H05K3/46

CPC classification number: H05K3/0052 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/49822 ,  H01L2924/09701 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2203/308 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: To provide a method for manufacturing a multilayer ceramic board that can prevent a wiring conductor formed on the face of a multilayer ceramic board fabricated with non-contraction process from being damaged.
On at least one principal face of a layered body, made up of a plurality of board ceramic green sheets 11 including ceramic material powder, contraction prevention green sheets 21 and 25 including inorganic material powder which is not sintered at the baking temperature of the board ceramic green sheet 11 are disposed such that along at least a part of the outer circumference of the principal face the part and the nearby portion thereof are exposed to form a compound layered body, the compound layered body is baked under a condition in which the ceramic material powder is sintered, and the inorganic material powder is not sintered, following which the contraction prevention green sheets 21 and 25 are removed. With a multilayer ceramic board 10t, protruding portions 12x and 12y are formed along at least a part of the outer circumference of a principal face 11t.

Abstract translation: 提供一种可以防止形成在由非收缩工艺制造的多层陶瓷板的表面上形成的布线导体损坏的多层陶瓷板的制造方法。 在由包含陶瓷材料粉末的多个板状陶瓷生片11构成的层叠体的至少一个主面上，包含在基板陶瓷的烘烤温度下未烧结的无机材料粉末的收缩防止生片21,25 生片11被设置为使得沿着主面的外周的至少一部分暴露其部分和附近部分以形成复合层状体，在陶瓷材料的条件下烘烤该复合层叠体 粉末烧结，无机材料粉末不烧结，除去收缩防止生片21和25。 利用多层陶瓷板10t，沿着主面11t的外周的至少一部分形成突出部12x，12y。

公开(公告)号：EP1927118A2

公开(公告)日：2008-06-04

申请号：EP06815217.2

申请日：2006-09-22

Applicant: Radial Electronics, Inc.

Inventor： QUILICI, James E.

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/20 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0292 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

Abstract: Disclosed is an apparatus and method for a magnetic component. The magnetic component 400 includes a substrate 402 having a feature 406 and a first conductive pattern 408 disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material 416 is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material 410, where the substrate material has a second conductive pattern 414. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeabilit material.

公开(公告)号：EP1912286A1

公开(公告)日：2008-04-16

申请号：EP06757212.3

申请日：2006-06-09

Applicant: Sumitomo Electric Industries, Ltd.

Inventor： IDOMOTO, Yuichi, c/o SUMITOMO ELEC. IND., LTD. ,  OKUDA, Yasuhiro, c/o SUMITOMO ELEC. IND., LTD.

IPC: H01R11/01 ,  H01R43/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/119 ,  H01R12/7076 ,  H05K3/0058 ,  H05K3/368 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T428/24802

Abstract: In a composite porous resin base material (1), a porous resin film (2) is provided with a functional section (3) whereupon an electrode (4) and/or a circuit is formed. On the periphery surrounding the functional section (3), a step (5) having a height different from that of the functional section (3) is formed, and a frame plate (6) is arranged on a plane of the step (5). Provided is the composite porous resin base material which has a structure wherein the frame plate having rigidity is attached to the porous resin base material whereupon the electrode and/or a circuit is formed without deteriorating characteristics such as elasticity and conductivity of the porous resin base material.

Abstract translation: 在复合多孔树脂基材（1）中，多孔树脂膜（2）设置有功能部（3），由此形成电极（4）和/或电路。 在功能部（3）周围的周边形成有与功能部（3）的高度不同的台阶（5），并且在台阶（5）的平面上配置框架板（6） 。 提供一种复合多孔树脂基材，其具有刚性的框架板附着在多孔树脂基材上，由此形成电极和/或电路，而不会破坏多孔树脂基材的弹性和导电性等特性 。