-
公开(公告)号：US20170110779A1
公开(公告)日：2017-04-20
申请号：US15394868
申请日：2016-12-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunitoshi HANAOKA
CPC classification number: H01P5/18 , H01P5/184 , H01P5/187 , H02M1/00 , H03H7/38 , H04B1/04 , H05K1/0243 , H05K1/115 , H05K1/181 , H05K2201/09772 , H05K2201/1003
Abstract: An inductor component is disposed outside a multilayer substrate, and thus a directional coupler defined by an internal wiring electrode and a coil electrode within the inductor component that is mounted on a pair of land electrodes, the multilayer substrate significantly reduces or prevents interference with other high-frequency circuit elements disposed in or on the multilayer substrate. Additionally, if a plurality of inductor components having different inductor characteristics are prepared, a high-frequency module including the multilayer substrate capable of defining the directional coupler whose characteristics are able to adjusted with ease is able to be provided simply by selecting the desired inductor component from the inductor components and replacing that inductor component.
-
公开(公告)号：US09131615B2
公开(公告)日：2015-09-08
申请号：US14059777
申请日：2013-10-22
Applicant: CANON KABUSHIKI KAISHA
Inventor： Hideaki Hirasawa
CPC classification number: H05K1/11 , H05K1/0203 , H05K1/111 , H05K3/3421 , H05K3/3452 , H05K3/3468 , H05K2201/09772 , H05K2201/09781 , H05K2201/0989 , H05K2201/10522 , H05K2201/10659 , H05K2201/10689 , H05K2203/046 , Y02P70/611
Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.
Abstract translation: 印刷电路板具有第一焊盘焊盘，第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料，第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分，暴露部分设置在焊接区域和防止桥接防止焊盘之间。
-
213.发明授权Printed circuit board unit having routing unit mounted thereon and computer device having the same 有权具有安装在其上的路由单元的印刷电路板单元和具有其的计算机设备公开(公告)号：US08711575B2
公开(公告)日：2014-04-29
申请号：US13011980
申请日：2011-01-24
Applicant: Do-kyun Lee
Inventor： Do-kyun Lee
IPC: H05K1/11
CPC classification number: H05K3/222 , H05K1/113 , H05K1/181 , H05K2201/09772 , H05K2201/10159 , H05K2201/10363 , H05K2201/10522 , H05K2201/10545
Abstract: A printed circuit board unit usable with a computer device includes a main board on which a first component and a second component are mounted on an upper surface, and a routing unit mounted on at least one of the upper surface and a lower surface of the main board and including a sub-wire forming at least part of a wire to transmit a data between the first component and the second component.
Abstract translation: 可与计算机装置一起使用的印刷电路板单元包括：主板，第一部件和第二部件安装在主板上;以及布线单元，安装在主板的上表面和下表面中的至少一个上 并且包括形成至少一部分线的子线以在第一部件和第二部件之间传输数据。
-
公开(公告)号：US08681509B2
公开(公告)日：2014-03-25
申请号：US12544156
申请日：2009-08-19
Applicant: Hideaki Hirasawa
Inventor： Hideaki Hirasawa
IPC: H05K7/10
CPC classification number: H05K1/11 , H05K1/0203 , H05K1/111 , H05K3/3421 , H05K3/3452 , H05K3/3468 , H05K2201/09772 , H05K2201/09781 , H05K2201/0989 , H05K2201/10522 , H05K2201/10659 , H05K2201/10689 , H05K2203/046 , Y02P70/611
Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.
Abstract translation: 印刷电路板具有第一焊盘焊盘，第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料，第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分，暴露部分设置在焊接区域和防止桥接防止焊盘之间。
-
公开(公告)号：US20140041920A1
公开(公告)日：2014-02-13
申请号：US14059777
申请日：2013-10-22
Applicant: Canon Kabushiki Kaisha
Inventor： Hideaki Hirasawa
IPC: H05K1/11
CPC classification number: H05K1/11 , H05K1/0203 , H05K1/111 , H05K3/3421 , H05K3/3452 , H05K3/3468 , H05K2201/09772 , H05K2201/09781 , H05K2201/0989 , H05K2201/10522 , H05K2201/10659 , H05K2201/10689 , H05K2203/046 , Y02P70/611
Abstract: A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.
Abstract translation: 印刷电路板具有第一焊盘焊盘，第二焊盘焊盘和信号线图案。 第一焊盘被配置为与电子部件焊接。 第二焊盘被构造为蓄积焊料，第二焊盘位于沿着印刷电路的携带方向设置在第一焊盘的下游侧。 信号线图案包括未被抗蚀剂覆盖的暴露部分，暴露部分设置在焊接区域和防止桥接防止焊盘之间。
-
Patent Agency Ranking
公开(公告)号：US20130120993A1
公开(公告)日：2013-05-16
申请号：US13600352
申请日：2012-08-31
Applicant: Hua-Chen Fan , Te-Hen Lo , Cheng-Wei Chang
Inventor： Hua-Chen Fan , Te-Hen Lo , Cheng-Wei Chang
CPC classification number: H05K1/0296 , H05K1/189 , H05K2201/09227 , H05K2201/09772 , H05K2201/10106
Abstract: A circuit board circuit apparatus and a light source apparatus including a substrate, a circuit layer, and at least one electronic component are disclosed. The circuit layer is formed on a surface of the substrate. The circuit layer includes a first circuit and a second circuit which are coplanar-disposed. The at least one electronic component is disposed on the circuit layer and connected with the circuit layer. Each electronic component has a first contact and a second contact. At least a part of the second circuit is disposed between the at least one electronic component and the first circuit. The at least one electronic component crosses over the second circuit, so that the second circuit penetrates through the bottom of the electronic component between the first contact and the second contact.
Abstract translation: 公开了一种电路板电路装置和包括基板，电路层和至少一个电子部件的光源装置。 电路层形成在基板的表面上。 电路层包括共面布置的第一电路和第二电路。 至少一个电子部件设置在电路层上并与电路层连接。 每个电子部件具有第一接触和第二接触。 第二电路的至少一部分设置在至少一个电子部件和第一电路之间。 所述至少一个电子部件跨越所述第二电路，使得所述第二电路在所述第一触点和所述第二触点之间穿过所述电子部件的底部。
-
公开(公告)号：US20120262885A1
公开(公告)日：2012-10-18
申请号：US13358540
申请日：2012-01-26
Applicant: Yasuhiro IKEDA , Yutaka Uematsu , Satoshi Muraoka
Inventor： Yasuhiro IKEDA , Yutaka Uematsu , Satoshi Muraoka
IPC: H05K1/18
CPC classification number: H05K1/0243 , H05K1/0251 , H05K1/115 , H05K2201/09227 , H05K2201/09772 , H05K2201/10545 , H05K2201/10689
Abstract: Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.
Abstract translation: 提供了一种使用具有高包装密度的低成本电路板的信号传输电路，但是能够减少信号线之间的串扰噪声并且还减少由于短截线引起的反射噪声。 本发明的信号传输电路被配置为使得电子部件和通孔过孔的引线端子分别通过表面布线彼此连接，以便不允许从通孔过孔的中间分支。 此外，连接第一电子部件的第一布线分别布置在连接第二电子部件的相应的一对第二布线之间，并且信号通过交错传输通过第一布线和第二布线传输。
-
公开(公告)号：US07649499B2
公开(公告)日：2010-01-19
申请号：US12109521
申请日：2008-04-25
Applicant: Kunihiro Watanabe
Inventor： Kunihiro Watanabe
CPC classification number: H01Q1/526 , H01L24/48 , H01L25/162 , H01L2223/6677 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/181 , H01L2924/19106 , H01L2924/3025 , H01Q9/0485 , H01Q23/00 , H05K1/0218 , H05K1/141 , H05K3/284 , H05K2201/0715 , H05K2201/09772 , H05K2201/10242 , H05K2203/1572 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.
Abstract translation: 在高频模块中，天线装置设置在第二基板的第一主表面上，第一基板的第一主表面和第二基板的第二主表面彼此面对并且通过导电 连接构件，包括IC芯片的电子部件安装在第一基板的第一主表面上，接地电极设置在第一和第二基板上，导电连接构件连接到接地电位，因此IC芯片被包围 通过第一和第二基板的接地电极和导电连接构件。
-
公开(公告)号：US20090229871A1
公开(公告)日：2009-09-17
申请号：US12362986
申请日：2009-01-30
Applicant: Masaaki TOGASHI
Inventor： Masaaki TOGASHI
CPC classification number: H01G4/35 , H01G4/228 , H05K1/0231 , H05K2201/09772 , H05K2201/10636 , Y02P70/611
Abstract: A feedthrough capacitor has: a capacitor element body of a substantially rectangular parallelepiped shape in which a plurality of insulator layers are laminated together; a signal internal electrode arranged in the capacitor element body; a ground internal electrode arranged in the capacitor element body and opposed to the signal internal electrode; signal terminal electrodes connected to the signal internal electrode; and a ground terminal electrode connected to the ground internal electrode. The signal terminal electrodes are provided on first and second end faces, respectively, in a longitudinal direction of the capacitor element body. The ground terminal electrode is provided on at least one side face out of first to fourth side faces extending along the longitudinal direction of the capacitor element body. Furthermore, the ground terminal electrode is located nearer at least one end face out of the first end face and the second end face.
Abstract translation: 旁路电容器具有：大致长方体形状的电容器元件体，其中多个绝缘体层层叠在一起; 布置在所述电容器元件主体中的信号内部电极; 布置在电容器元件主体中并与信号内部电极相对的接地内部电极; 信号端子电极连接到信号内部电极; 以及连接到接地内部电极的接地端子电极。 信号端子电极分别设置在电容器元件主体的纵向上的第一和第二端面上。 接地端子电极设置在沿着电容器元件主体的纵向方向延伸的第一至第四侧面中的至少一个侧面上。 此外，接地端子电极位于比第一端面和第二端面更靠近的至少一个端面。
-
220.发明申请METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS 有权制造印刷电路板，印刷电路板和电子设备的方法公开(公告)号：US20090218121A1
公开(公告)日：2009-09-03
申请号：US12393642
申请日：2009-02-26
Applicant: Norihiro ISHII
Inventor： Norihiro ISHII
CPC classification number: H05K3/305 , H01L2224/32225 , H01L2924/15311 , H05K3/3436 , H05K3/3484 , H05K2201/09572 , H05K2201/09772 , H05K2201/10734 , H05K2201/10977 , H05K2203/043 , Y02P70/613 , Y10T29/4913
Abstract: A method for manufacturing a printed circuit board. The method includes: preparing a printed wiring board, the printed wiring board comprising through holes and a plurality of electrode pads; coating surfaces of the plurality of electrode pads and surfaces of the through holes on an one side of the printed wiring board with a bonding material; mounting a semiconductor package on the printed wiring board such that a plurality of bumps on a surface of the semiconductor package corresponds to the plurality of electrode pads; bonding the bumps to the electrode pads by heating the printed wiring board on which the semiconductor package is mounted; and filling a space between the semiconductor package and the printed wiring board with a filler material.
Abstract translation: 一种印刷电路板的制造方法。 该方法包括：制备印刷线路板，印刷线路板包括通孔和多个电极焊盘; 在印刷电路板的一侧用接合材料涂覆多个电极焊盘的表面和通孔的表面; 将半导体封装安装在所述印刷电路板上，使得所述半导体封装的表面上的多个凸块对应于所述多个电极焊盘; 通过加热其上安装有半导体封装的印刷线路板将凸块接合到电极焊盘; 以及用填充材料填充半导体封装和印刷线路板之间的空间。
-
-
-
-
-
-
-
-
-
Search Results
454
records
(took 0.027 seconds)
