公开(公告)号：JP5789617B2

公开(公告)日：2015-10-07

申请号：JP2012551109

申请日：2011-01-31

Applicant: ネーデルランゼ オルハニサティー フォール トゥーヘパスト−ナトゥールウェテンスハッペァイク オンデルゾーク テーエンオー ,  NEDERLANDSE ORGANISATIE VOOR TOEGEPAST−NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： デ コック,マルハレータ,マリア ,  ファン デン ブランド, イェルーン ,  ファン ヘック,ヘラルドゥス ティトゥス

IPC: H01L51/50 ,  H05B33/06

CPC classification number: H05K1/0277 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01R4/70 ,  H05B33/0896 ,  H05B33/10 ,  H05K13/04 ,  H05K3/325 ,  H05K3/365 ,  G09F19/22 ,  G09F9/00 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R12/7076 ,  H01R4/04 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  H05K3/321 ,  Y02E10/50 ,  Y10T29/4913

公开(公告)号：JP2015159240A

公开(公告)日：2015-09-03

申请号：JP2014034209

申请日：2014-02-25

Applicant: 矢崎総業株式会社

Inventor： 花▲崎▼ 恒

IPC: H01B7/08 ,  H01H85/11 ,  H05K3/10 ,  H05K1/16 ,  H05K1/02

CPC classification number: H05K1/0263 ,  H01B7/0838 ,  H05K1/0265 ,  H05K1/028 ,  H05K1/0293 ,  H05K1/181 ,  H05K3/102 ,  H05K3/1275 ,  H05K1/0393 ,  H05K2201/0305 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10181 ,  H05K2203/107 ,  H05K3/101 ,  H05K3/125

Abstract: 【課題】電流容量の異なる複数の導体を有したフレキシブルフラット回路体の幅寸法を短縮することのできるフレキシブルフラット回路体を提供すること。 【解決手段】一対の絶縁シート21,22により複数の導体31,32,33を離間状態に挟持して被覆したフレキシブルフラット回路体20であって、前記複数の導体31,32,33の内、少なくとも電流容量が異なる導体同士は、厚さ及び幅の内、少なくとも厚さを変えて作成したことを特徴とする。 【選択図】図1

Abstract translation: 要解决的问题：提供一种能够缩短具有不同电流容量的多个导体的柔性扁平电路体的宽度的柔性平坦电路体。解决方案：柔性平面电路体20包括一对绝缘片21,22 以分离的状态夹持并覆盖多个导体31,32,33。 至少电流容量在多个导体31,32,33中不同的导体是通过至少改变厚度和宽度之间的厚度而产生的。

公开(公告)号：JP2013518388A

公开(公告)日：2013-05-20

申请号：JP2012551109

申请日：2011-01-31

Applicant: ネーデルランゼ オルハニサティー フォール トゥーヘパスト−ナトゥールウェテンスハッペァイク オンデルゾーク テーエンオーNederlandse Organisatie Voor Toegepast−Natuurwetenschappelijk Onderzoek Tno

Inventor： コック，マルハレータ，マリア デ ,  デン ブランド， イェルーン ファン ,  ヘック，ヘラルドゥス ティトゥス ファン

IPC: H05B33/06 ,  H01L51/50

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: 複数のタイル（１）と担体（４０）との集合体であって、前記タイル（１）は電気物理トランスデューサ（１０）および該トランスデューサへの電気コネクタ（２４、２８）をもつ箔（２０）を有する。 前記タイルは前記担体に機械的かつ電気的に結合され、前記タイルは魚の鱗パターンに従って重なる。

公开(公告)号：JP4628503B2

公开(公告)日：2011-02-09

申请号：JP50552198

申请日：1997-08-08

Applicant: ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング

Inventor： グローテ ヴァルター ,  メッシンガー ユルゲン

IPC: H01R12/24 ,  H05K1/02 ,  H01B3/30 ,  H01B5/14 ,  H01R12/08 ,  H01R12/77 ,  H01R13/66 ,  H02B1/20 ,  H02G5/00 ,  H02G15/007 ,  H05K1/00

CPC classification number: H05K1/028 ,  H02G5/005 ,  H05K1/0271 ,  H05K1/0281 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/09109 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: The invention relates to a flexible strip conductor connection, by means of which electrical connections between an electrical device (2) and an external component (1) can be made, wherein the strip conductors (8) are located in or on a flexible foil (3), which is clamped on the electrical device (2) as well as the external component (1). In a predetermined area in the course of the strip conductors (8), the flexible foil (3) has a loop (6), which can be filled with an elastic material perpendicularly in relation to the foil plane, or the strip conductors (8) in the plane of the foil respectively have a loop-shaped deviation (9) perpendicularly to the course of strip conductor.

公开(公告)号：JP2008193073A

公开(公告)日：2008-08-21

申请号：JP2008011805

申请日：2008-01-22

Applicant: Hon Hai Precision Industry Co Ltd ,  鴻海精密工業股▲ふん▼有限公司

Inventor： RIN YUKYOKU ,  TAI CHAN-FEI ,  GO SEITATSU ,  CHAO CHIH-HANG

IPC: H05K1/02

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of designing the printed circuit board. SOLUTION: The printed circuit board includes an insulating layer. On the surface of the insulating layer, at least signal lines parallel to each another are wired, and in the insulating layer, an insulating cloth is arranged and the insulating cloth is composed of first fiber lines parallel to each other and second fiber lines perpendicular to the first fiber lines. In the insulating cloth, a rectangular area is formed by a center line of two neighboring first fiber lines and a center line of two neighboring second fiber lines. The orthographic projection of the signal line onto the insulating cloth is not parallel to the first fiber line, the second fiber line, or the diagonal line of the rectangular area. Consequently, part of the signal line passes through the first fiber line and the second fiber line and the other part passes through the rectangular area, and therefore, it is possible to prevent the resistance of the signal line from varying considerably and improve the quality of signal transmission. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供印刷电路板和设计印刷电路板的方法。

解决方案：印刷电路板包括绝缘层。 在绝缘层的表面上，至少彼此平行的信号线被布线，并且在绝缘层中布置绝缘布，并且绝缘布由彼此平行的第一光纤线和垂直于 第一条光纤线。 在绝缘布中，通过两个相邻的第一光纤线的中心线和两个相邻的第二光纤线的中心线形成矩形区域。 信号线在绝缘布上的正投影不平行于第一光纤线，第二光纤线或矩形区域的对角线。 因此，信号线的一部分通过第一光纤线路，第二光纤线路和另一部分通过矩形区域，因此可以防止信号线路的电阻显着变化并提高其质量 信号传输。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：US12101888B2

公开(公告)日：2024-09-24

申请号：US17770384

申请日：2020-09-07

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Hideo Takahashi ,  Shinichi Takase ,  Hiroki Shimoda ,  Tsutomu Kitajima ,  Yoshiro Adachi ,  Yuuki Oohashi ,  Manabu Sudou

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/189 ,  H05K1/11 ,  H05K2201/09281 ,  H05K2201/09427 ,  H05K2201/10916

Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.

公开(公告)号：US20240274543A1

公开(公告)日：2024-08-15

申请号：US18406222

申请日：2024-01-08

Applicant: InnoLux Corporation

Inventor： Yan-Tang DAI ,  Tzu-Min YAN

IPC: H01L23/538 ,  H05K1/02 ,  H05K3/02 ,  H05K3/06 ,  H10K59/82

CPC classification number: H01L23/5386 ,  H05K1/0298 ,  H05K3/027 ,  H05K3/064 ,  H10K59/82 ,  H01L25/0756 ,  H05K2201/09281 ,  H05K2201/10098 ,  H05K2203/107 ,  H10K59/95

Abstract: The disclosure discloses a manufacturing method of an electronic device, which comprises the following steps: providing a first substrate, providing a second substrate, bonding the first substrate and the second substrate through an adhesive layer, forming a conductive layer on the side surfaces of the first substrate, the second substrate and the adhesive layer, performing a first patterning process on a first region of the conductive layer, and performing a second patterning process on a second region of the conductive layer, the first region at least partially overlaps the adhesive layer, and the second region overlaps the side surfaces of the first substrate and the second substrate, and the first patterning process is different from the second patterning process.

公开(公告)号：US20180035536A1

公开(公告)日：2018-02-01

申请号：US15622412

申请日：2017-06-14

Applicant: FUJITSU LIMITED

Inventor： Takayoshi Matsumura ,  Shunji Baba ,  TAKASHI KANDA ,  NORITSUGU OZAKI ,  Hidehiko Kira

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0283 ,  H05K1/0271 ,  H05K1/092 ,  H05K1/181 ,  H05K1/189 ,  H05K3/245 ,  H05K2201/0314 ,  H05K2201/0338 ,  H05K2201/09045 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10015 ,  H05K2201/10098 ,  H05K2201/10522

Abstract: A wiring board includes a base having extensibility and a wiring formed on the base. The wiring includes a wiring portion and a conductor portion. The wiring portion is formed on the base and extends in a first direction crossing (for example, perpendicular to) a longitudinal direction of the base. The conductor portion is formed on the wiring portion and extends in the first direction. Even when the wiring board is extended along a main extension axis in parallel with the longitudinal direction of the base, change of the resistance of the wiring is prevented. Thus, the wiring board represents stable characteristics.

公开(公告)号：US20170325332A1

公开(公告)日：2017-11-09

申请号：US15146364

申请日：2016-05-04

Applicant: Northrop Grumman Systems Corporation

Inventor： Anthony L. Long ,  Alexander Parra, II

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/144 ,  H05K1/0237 ,  H05K1/0243 ,  H05K1/0253 ,  H05K1/11 ,  H05K1/118 ,  H05K1/141 ,  H05K1/181 ,  H05K3/361 ,  H05K2201/09072 ,  H05K2201/09281 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2201/10886

Abstract: An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.

公开(公告)号：US20170261799A1

公开(公告)日：2017-09-14

申请号：US15604877

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： CHONG-GUK LEE ,  JOO-YEON WON ,  SE-HUI JANG ,  SU-Ml MOON ,  DONG-WOOK LEE

IPC: G02F1/1345 ,  H01L23/498 ,  H01L27/12 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.