FIELD EMISSION CATHODE ELECTRON SOURCE AND ARRAY THEREOF

    公开(公告)号:US20200219693A1

    公开(公告)日:2020-07-09

    申请号:US16648665

    申请日:2019-02-25

    Inventor: Weier LU Yang XIA

    Abstract: A field emission cathode electron source and an array thereof provided by embodiments of the present disclosure include a substrate, and a cathode, a cathode tip and a gate disposed on the same side of the substrate. The cathode, the cathode tip and the gate are disposed on an upper surface of the substrate, and the cathode tip is connected to the cathode, and the gate is located on, a side of the cathode tip away from the cathode and an electron emission end of the cathode tip is directed toward a side of the substrate close to the gate. The cathode tips are arranged on the substrate in parallel with the substrate. Compared with the three dimensional stacked structure in the prior art, the present disclosure has a higher stability and reliability and is suitable for a large-scale integration.

    METHOD FOR OXIDIZING A SILICON CARBIDE BASED ON MICROWAVE PLASMA AT AN AC VOLTAGE

    公开(公告)号:US20200152451A1

    公开(公告)日:2020-05-14

    申请号:US16287902

    申请日:2019-02-27

    Abstract: A method for oxidizing a silicon carbide based on microwave plasma at an AC voltage, including: step one, providing a silicon carbide substrate, and placing the silicon carbide substrate in a microwave plasma generating device; step two, introducing oxygen-containing gas to generate oxygen plasma at an AC voltage; step three, controlling movements of oxygen ions and electrons in the oxygen plasma by the AC voltage to generate an oxide layer having a predetermined thickness on the silicon carbide substrate, wherein when a voltage of the silicon carbide substrate is negative, the oxygen ions move close to an interface and perform an oxidation reaction with the silicon carbide, and when the voltage of the silicon carbide substrate is positive, the electrons move close to the interface and perform a reduction reaction with the silicon carbide, removing carbon residue; step four, stopping the introduction of oxygen-containing gas and the reaction completely.

    NANOMETER SEMICONDUCTOR DEVICES HAVING HIGH-QUALITY EPITAXIAL LAYER

    公开(公告)号:US20200027995A1

    公开(公告)日:2020-01-23

    申请号:US16586703

    申请日:2019-09-27

    Inventor: Huilong Zhu

    Abstract: There are provided a nanometer semiconductor device with a high-quality epitaxial layer and a method of manufacturing the same. According to an embodiment, the semiconductor device may include: a substrate; at least one nanowire spaced apart from the substrate; at least one semiconductor layer, each formed around a periphery of respective one of the at least one nanowire to at least partially surround the corresponding nanowire, wherein the semiconductor layer(s) formed around the respective nanowire(s) are separated from each other; an isolation layer formed on the substrate, exposing the at least one semiconductor layer; and a gate stack formed on the isolation layer and intersecting the at least one semiconductor layer, wherein the gate stack includes a gate dielectric layer at least partially surrounding a periphery of respective one of the at least one semiconductor layer and a gate conductor layer.

    NANOMETER SEMICONDUCTOR DEVICES HAVING HIGH-QUALITY EPITAXIAL LAYER

    公开(公告)号:US20200027994A1

    公开(公告)日:2020-01-23

    申请号:US16586697

    申请日:2019-09-27

    Inventor: Huilong Zhu

    Abstract: There are provided a nanometer semiconductor device with a high-quality epitaxial layer and a method of manufacturing the same. According to an embodiment, the semiconductor device may include: a substrate; at least one nanowire spaced apart from the substrate; at least one semiconductor layer, each formed around a periphery of respective one of the at least one nanowire to at least partially surround the corresponding nanowire, wherein the semiconductor layer(s) formed around the respective nanowire(s) are separated from each other; an isolation layer formed on the substrate, exposing the at least one semiconductor layer; and a gate stack formed on the isolation layer and intersecting the at least one semiconductor layer, wherein the gate stack includes a gate dielectric layer at least partially surrounding a periphery of respective one of the at least one semiconductor layer and a gate conductor layer.

    MICROWAVE PLASMA GENERATING DEVICE FOR PLASMA OXIDATION OF SIC

    公开(公告)号:US20190362945A1

    公开(公告)日:2019-11-28

    申请号:US16224435

    申请日:2018-12-18

    Abstract: A microwave plasma generating device for plasma oxidation of SiC, comprising an outer cavity and a plurality of micro-hole/micro-nano-structured double-coupling resonant cavities disposed in the outer cavity. Each resonant cavity includes a cylindrical cavity. A micro-hole array formed by a plurality of micro-holes is uniformly distributed on a peripheral wall of the cylindrical cavity, a diameter of each of the micro-holes is an odd multiple of wavelength, and an inner wall of the cylindrical cavity has a metal micro-nano structure, the metal micro-nano structure has a periodic dimension of λ/n, where λ is wavelength of an incident wave, and n is refractive index of material of the resonant cavity. The outer cavity is provided with an gas inlet for conveying an oxygen-containing gas into the outer cavity, and the oxygen-containing gas forms an oxygen plasma around the resonant cavities for oxidizing SiC; a stage is disposed under the resonant cavities.

    3-D semiconductor device and method for manufacturing the same

    公开(公告)号:US10373968B2

    公开(公告)日:2019-08-06

    申请号:US15306179

    申请日:2014-07-10

    Inventor: Zongliang Huo

    Abstract: A 3-D semiconductor device comprising a plurality of memory cells and a plurality of selection transistors, each of said plurality of memory cells comprises: a channel layer, distributed along a direction perpendicular to the substrate surface; a plurality of inter-layer insulating layers and a plurality of gate stack structures, alternately laminating along the sidewall of the channel layer; a plurality of floating gates, located between the plurality of inter-layer insulating layers and the sidewall of the channel layer; a plurality of drains, located at the top of the channel layer; and a plurality of sources, located in the said substrate between two adjacent memory cells of the said plurality of memory cells.

    SEMICONDUCTOR ARRANGEMENT HAVING CONTINUOUS SPACERS AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20190189523A1

    公开(公告)日:2019-06-20

    申请号:US16327973

    申请日:2016-12-21

    Abstract: A semiconductor arrangement includes: a substrate; a plurality of fins formed on the substrate and extending in a first direction; a plurality of gate stacks formed on the substrate and extending in a second direction crossing the first direction and dummy gates composed of dielectric and extending in the second direction, wherein each of the gate stacks intersects at least one of the fins; and spacers formed on sidewalls of the gate stacks and sidewalls of the dummy gates, wherein spacers of at least a first one and a second one among the gate stacks and the dummy gates which are aligned in the second direction extend integrally, and at least some of the fins have ends abutting the dummy gates and substantially aligned with inner walls of corresponding ones of the spacers.

    Manufacturing method for a nonvolatile resistive switching memory device

    公开(公告)号:US10312439B2

    公开(公告)日:2019-06-04

    申请号:US15546218

    申请日:2015-05-14

    Abstract: A nonvolatile resistive switching memory includes an inert metal electrode, a resistive switching functional layer, and an easily oxidizable metal electrode. A graphene intercalation layer with nanopores, interposed between the easily oxidizable metal electrode and the resistive switching functional layer, is capable of controlling the metal ions, which are formed by the oxidation of the easily oxidizable metal electrode during the programming of the device, and only enter into the resistive switching functional layer through the position of the nanopores. Further, the graphene intercalation layer with nanopores is capable of blocking the diffusion of the metal ions, making the metal ions, which are formed after the oxidation of the easily oxidizable metal electrode, enter into the resistive switching functional layer only through the position of the nanopores during the programming of the device, thereby controlling the growing position of conductive filament.

    MRAM, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE MRAM

    公开(公告)号:US20190157345A1

    公开(公告)日:2019-05-23

    申请号:US16177999

    申请日:2018-11-01

    Abstract: A Magnetic Random Access Memory (MRAM), a method of manufacturing the same, and an electronic device including the same are provided. The MRAM includes a substrate, an array of memory cells arranged in rows and columns, bit lines, and word lines. The memory cells each include a vertical switch device and a magnetic tunnel junction on the switch device and electrically connected to a first terminal of the switch device. An active region of the switch device at least partially includes a single-crystalline semiconductor material. Each of the memory cell columns is disposed on a corresponding bit line, and a second terminal of each of the respective switch devices in the memory cell column is electrically connected to the corresponding bit line. Each of the word lines is electrically connected to a control terminal of the respective switch devices of the respective memory cells in a corresponding memory cell row.

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