公开(公告)号：EP3410471A1

公开(公告)日：2018-12-05

申请号：EP17744322.3

申请日：2017-01-26

Applicant: KYOCERA Corporation

Inventor： KITAMURA, Toshihiko

IPC: H01L23/02 ,  H01L23/04 ,  H01L23/12 ,  H01L31/02 ,  H01S5/022

CPC classification number: H05K1/0245 ,  H01L23/02 ,  H01L23/04 ,  H01L23/12 ,  H01L31/02 ,  H01L2224/48091 ,  H01S5/022 ,  H01S5/02212 ,  H01S5/02276 ,  H05K1/024 ,  H05K1/0306 ,  H05K3/1216 ,  H05K2201/068 ,  H05K2201/09154 ,  H05K2201/093 ,  H05K2201/10121 ,  H05K2201/10287 ,  H05K2201/10424 ,  H05K2203/1131 ,  H01L2924/00014

Abstract: A wiring board includes a signal conductor wiring positioned on a first face of a first dielectric layer, and a ground conductor wiring positioned on a second face thereof. A region of the ground conductor wiring where a first end portion of the signal conductor wiring is positioned in plan view is cut away inwardly from a first side of the second face opposing a first side of the first face.

公开(公告)号：EP2451018B1

公开(公告)日：2018-08-08

申请号：EP10794009.0

申请日：2010-06-18

Applicant: Yazaki Corporation

Inventor： NOMURA, Shoichi ,  NAKAMURA, Goro

IPC: H01R13/52 ,  H01R12/61 ,  H05K3/36

CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

Abstract: A flexible flat cable connecting structure and a flexible flat cable connecting method are provided so that a connector can be connected by pitch conversion without complicating the structure of the connector and metal molds for forming mold parts become unnecessary. A flexible flat cable connecting structure for connecting a flexible flat cable (13) in which a plurality of rectangular conductors (11) are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member (17) one end of which is coupled to the connector terminals and in which a plurality of branch conductors (19) are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member (17) is laid on the flexible flat cable (13) so that the intermediate cable arranging member (17) and the flexible flat cable (13) are in the same plane and form an angle. The other ends (21) of the branch conductors (19) of the intermediate cable arranging member (17) are connected to the respective rectangular conductors (11).

公开(公告)号：EP3254020A1

公开(公告)日：2017-12-13

申请号：EP16701480.2

申请日：2016-01-25

Applicant: Philips Lighting Holding B.V.

Inventor： VAN ASSELT, Robert ,  VERHOEVEN, Mark Johannes Antonius ,  VREHEN, Joris Jan ,  LIJTEN, Gerardus Franciscus Cornelis Maria ,  BAX, Laurens ,  VAN DEN EERENBEEMD, Chris

IPC: F21V3/02 ,  F21V31/00 ,  F21K99/00 ,  F21Y115/10

CPC classification number: F21V31/005 ,  F21K9/90 ,  F21V3/02 ,  F21V17/06 ,  F21V17/101 ,  F21V19/0015 ,  F21Y2115/10 ,  H05K1/056 ,  H05K1/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1147 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: This invention relates to the field of lighting modules employing light emitting diodes (LEDs), and more particularly to LED modules suitable for exposed lens plate luminaires. There is herein provided an LED module having a printed circuit board comprising at least two layers, wherein the interface between two layers at a side surface of the printed circuit board is covered by a protrusion of an optically transmissive cover plate. The same said optically transmissive cover plate is also adapted to cover at least one LED positioned in or on the printed circuit board.

公开(公告)号：EP3030060A4

公开(公告)日：2017-04-05

申请号：EP14832154

申请日：2014-07-30

Applicant: KYOCERA CORP

Inventor： KAWASAKI KOUICHI

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/498 ,  H05K1/02 ,  H05K3/24 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/24 ,  H01L23/49838 ,  H01L24/32 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/243 ,  H05K3/244 ,  H05K3/3431 ,  H05K3/4629 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2201/09663 ,  H05K2201/097 ,  H05K2201/098 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/2054 ,  H05K2203/1178 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A wiring board (1) has an insulation base plate (11), and a plurality of electrodes (12) provided adjacent to each other in plan view on the insulation base plate (11), the electrodes (12) have an opening (12b) in the outer periphery and a slit (12a) oriented from the outer periphery to the interior, and, among two electrodes (12) adjacent to each other, the slit (12a) in one electrode (12) has a central line (12c) intersecting the outer periphery of the other electrode (12).

公开(公告)号：EP2993395A1

公开(公告)日：2016-03-09

申请号：EP15167461.1

申请日：2015-05-13

Applicant: Toshiba Lighting & Technology Corporation

Inventor： Hatanaka, Toshihiro ,  Tsuchiya, Ryuji ,  Hino, Kiyokazu ,  Shiraishi, Hiromitsu

IPC: F21V19/00 ,  H05K3/00 ,  F21S8/10

CPC classification number: F21V19/005 ,  F21S41/141 ,  F21S41/19 ,  F21S43/14 ,  F21S43/19 ,  F21S45/10 ,  F21S45/47 ,  F21S45/48 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/10106

Abstract: A lighting device (1) for a moving body including a substrate (2) that has a base body (21) having a plurality of connection sections (121a-121c) on a side surface (21a) and a wiring pattern (24) provided on at least one main surface of the base body (21); a light emitting element (22) that is electrically connected to the wiring patter (24)n; and an adhesive section (60) that is provided between the base body (21) and a body section (10).
The connection sections (121a-121c) are at least one of groove sections, concave sections, and convex sections.
The adhesive section (60) covers at least a part of the plurality of connection sections (121a-121c).

Abstract translation: 一种用于移动体的照明装置（1），其包括具有在侧表面（21a）和布线图案（24）上具有多个连接部分（121a-121c）的基体（21）的基板（2） 在所述基体（21）的至少一个主表面上; 与所述布线图案（24）n电连接的发光元件（22）; 以及设置在基体（21）与主体部（10）之间的粘接部（60）。 连接部（121a〜121c）是槽部，凹部和凸部中的至少一个。 粘合部（60）覆盖多个连接部（121a〜121c）的至少一部分。

公开(公告)号：EP2862423A1

公开(公告)日：2015-04-22

申请号：EP13732042.0

申请日：2013-06-14

Applicant: ALCATEL LUCENT

Inventor： TIMARU, Theodore

IPC: H05K1/14 ,  H01P5/02 ,  H05K3/46 ,  H05K1/02

CPC classification number: H01P5/028 ,  H05K1/0239 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09845

Abstract: The system includes a first printed circuit board including a first transmission line, the first circuit board may be attached to a chassis and a second printed circuit board including a second transmission line, the second circuit board may be attached to the chassis and/or the first printed circuit board and the second transmission line configured to electrically couple power from the first transmission line.

公开(公告)号：EP2704537A1

公开(公告)日：2014-03-05

申请号：EP12777596.3

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00 ,  H01L23/12

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2224/97 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array.
The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

Abstract translation: 本发明提供一种配线基板，其包括基板主体和设置在该基板主体的前表面上的金属化层，以沿着其侧表面延伸，其中镀覆膜和覆盖该金属化层的表面的钎焊材料层 没有损坏; 多片布线基板阵列，用于同时提供多个布线基板; 以及制造该多件式布线基板阵列的方法。 布线基板1a包括：由陶瓷层叠体S形成的俯视呈矩形形状的基板主体2，其具有前表面3和后表面4，并具有四个侧表面5，每个侧表面位于 前表面3和后表面4，并且具有位于前表面3一侧的凹槽表面7和位于背表面4一侧的断裂表面6; 以及在基板主体2的表面3上沿着四个侧面5延伸而形成的俯视矩形框状的金属化层11，其中，陶瓷层叠体的水平面13 基板主体2的S在金属化层11与基板主体2的各侧面5的槽面7之间露出。

公开(公告)号：EP2701470A1

公开(公告)日：2014-02-26

申请号：EP12774076.9

申请日：2012-02-01

Applicant: NGK Sparkplug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

Abstract: Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array.
The wiring substrate 1a is formed of a ceramic material S, has a square (rectangular) shape in plan view, and which has a front surface 2, a back surface 3, and side surfaces 4 each being located between the front surface 2 and the back surface 3, wherein each side surface 4 has a belt-like uneven surface 5 including a plurality of alternate and parallel convex portions 7 and concave portions 6 which are formed so as to extend along the front surface 2, and also has a fracture surface 8 located on a side toward the back surface 3.

Abstract translation: 提供一种陶瓷布线基板，其具有实现可靠的夹紧或钩挂的侧面; 用于提供多个所述布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板1a由陶瓷材料S形成，在平面图中具有正方形（矩形）形状，并且具有前表面2，后表面3和位于前表面2和前表面2之间的侧表面4。 背面3，其中每个侧表面4具有带状的不平坦表面5，该表面5包括多个平行的凸起部分7和形成为沿前表面2延伸的凹入部分6，并且还具有断裂面 8位于背面3的一侧。

公开(公告)号：EP2571068A8

公开(公告)日：2013-08-14

申请号：EP11780357.7

申请日：2011-04-27

Applicant: Panasonic Corporation

Inventor： MOTOYA, Atsushi ,  OKANO, Kazuyuki ,  AKAI, Minako ,  GOTO, Yurika ,  TAGAMI, Naoki ,  HORIUCHI, Makoto ,  MORI, Toshio ,  UEMOTO, Takaari ,  MIKI, Masahiro

IPC: H01L33/60 ,  F21S2/00 ,  G02B5/08 ,  F21Y101/02 ,  H05K1/03

CPC classification number: H01L25/0753 ,  F21K9/23 ,  F21V3/00 ,  F21V7/22 ,  F21Y2115/10 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/09701 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/017 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T428/263 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate (101) according to the present invention includes a substrate (108) and a reflective film (106) that is formed on a front surface of the substrate (108) and has a front surface on which LED chips (102) are to be mounted, and the reflective film (106) is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips (102).

公开(公告)号：EP2519085A4

公开(公告)日：2013-05-08

申请号：EP10839578

申请日：2010-12-24

Applicant: KYOCERA CORP

Inventor： IMAMURA KAZUHITO ,  MORIYAMA YOUSUKE

IPC: H05K1/02 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L21/481 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/96 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0269 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09918 ,  H05K2203/1572 ,  H01L2924/00

Abstract: [Problem] Provided are a many-up wiring substrate that makes it possible to manufacture a wiring substrate where electronic components can be precisely mounted on the wiring substrate, a wiring substrate obtained therefrom, and an electronic device that can be precisely mounted on an external electric circuit board. [Solution] In a many-up wiring substrate including a base substrate (1) having dividing grooves formed as part of main surfaces thereof, along boundaries of a plurality of wiring substrate regions (1a), the plurality of wiring substrate regions (1a) being arranged in a matrix, when seen in a transparent plan view, dividing grooves (2) of one main surface and dividing grooves (3) of an opposite main surface are formed to be deviated in one direction of a transverse direction or longitudinal direction, and a distance (L1) between bottoms of the dividing grooves (2) of one main surface and bottoms of the dividing grooves (3) of the opposite main surface is smaller than a distance (L2) between the bottoms of the dividing grooves (2) of the one main surface and the opposite main surface and a distance (L3) between the bottoms of the dividing grooves (3) of the opposite main surface and the one main surface. Even if a burr is formed on a side, a wiring substrate (1e) can be obtained that can reduce protrusion of the burr to the outside further than the portion that is the bottom of the dividing groove (2) of one main surface.