公开(公告)号：US5024871A

公开(公告)日：1991-06-18

申请号：US483501

申请日：1990-02-21

Applicant: David J. Arthur ,  Gwo S. Swei

Inventor： David J. Arthur ,  Gwo S. Swei

IPC: C08K3/00 ,  C04B26/08 ,  C04B35/14 ,  C04B41/45 ,  C08K9/00 ,  C08K9/04 ,  C08L27/12 ,  H01B1/22 ,  H01L23/14 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: C04B41/009 ,  C04B26/08 ,  C04B35/14 ,  C04B41/4584 ,  C08K9/04 ,  H01L23/145 ,  H05K1/0373 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/29 ,  Y10T428/3154

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent.

公开(公告)号：US4900614A

公开(公告)日：1990-02-13

申请号：US232779

申请日：1988-08-16

Applicant: Keita Miyazato ,  Kouichi Yamaki

Inventor： Keita Miyazato ,  Kouichi Yamaki

IPC: C03C25/24 ,  C08J5/24 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28

CPC classification number: C08J5/24 ,  C03C25/246 ,  H05K1/0366 ,  C08J2363/00 ,  H05K2201/0112 ,  H05K2201/0239 ,  H05K2203/122 ,  H05K2203/1572 ,  H05K3/0082 ,  H05K3/28 ,  Y10S428/901 ,  Y10T442/2582 ,  Y10T442/2607

Abstract: A glass fiber base material for print wiring substrate is disclosed, comprising a fluorescent whitening agent attached to the surface of a sheet made of glass fibers such as woven fabrics, non-woven fabrics and paper. The glass fiber base material has excellent ultraviolet light-shielding properties and, hence, is very useful in production of super LSI.

Abstract translation: 公开了一种用于印刷布线基板的玻璃纤维基材，包括附着在由玻璃纤维如织物，无纺织物和纸制成的片材的表面上的荧光增白剂。 玻璃纤维基材具有优异的紫外线遮光性，因此在超级LSI的制造中非常有用。

公开(公告)号：US4647402A

公开(公告)日：1987-03-03

申请号：US747563

申请日：1985-06-21

Applicant: Katsuhide Tamura

Inventor： Katsuhide Tamura

IPC: G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H01B1/06

CPC classification number: B82Y30/00 ,  B82Y10/00 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0239 ,  H05K2201/0326

Abstract: An electro-optic display device in which a conductive paste is disposed between opposed electrodes is characterized in that said conductive paste contains silane coupling agents. A process for making an electro-optic display device in which a conductive paste is disposed between opposed electrodes is characterized in that said conductive paste is applied onto films which are formed by applying a silane coupling agent onto at least one of the electrodes.

Abstract translation: 其中在相对电极之间设置导电膏的电光显示装置的特征在于所述导电浆料含有硅烷偶联剂。 制造其中在相对电极之间设置导电膏的电光显示装置的方法的特征在于，将所述导电膏施加到通过将硅烷偶联剂涂覆在至少一个电极上形成的膜上。

公开(公告)号：US3940534A

公开(公告)日：1976-02-24

申请号：US494771

申请日：1974-08-05

Applicant: Herbert J. Fick ,  Edward J. Mahagnoul

Inventor： Herbert J. Fick ,  Edward J. Mahagnoul

IPC: H05K1/03 ,  B32B17/12

CPC classification number: H05K1/036 ,  H05K1/0366 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10S428/91 ,  Y10T428/31616 ,  Y10T428/31681 ,  Y10T442/3813

Abstract: A mechanically sound electrically stable substrate for use in an electrical laminate wherein the substrate supports at least one electrically conductive metallic layer. The substrate portion comprises a woven glass cloth base pad which is interposed between a pair of outer substrate layers of a polyester mat. The polyester mat comprises a mat of spunbonded continuous filament polyester fibers, preferably polyethylene terephthalate fibers, calendered, with the fibers including a mixture of bulk fibers of relatively high melting point retained in place or bonded by a binder fiber of essentially the same polyester material but with a relatively lower melting point. In fabrication, the mat, along with the glass cloth, is saturated with a curable resin, for example a heat curable resin, preferably polybutadiene, which is cured in-situ.

Abstract translation: 一种用于电气层压板的机械稳定的电稳定基底，其中所述基底支撑至少一个导电金属层。 基板部分包括插入在聚酯垫的一对外基材层之间的编织玻璃布基垫。 聚酯垫包括纺粘的连续长丝聚酯纤维毡，优选聚对苯二甲酸乙二醇酯纤维，压延，其中纤维包括保留在适当位置的较高熔点的本体纤维的混合物或由基本上相同的聚酯材料的粘合剂纤维粘合，但是 熔点相对较低。 在制造中，垫与玻璃布一起被可固化树脂饱和，例如固化树脂，例如原位固化的热固性树脂，优选聚丁二烯。

公开(公告)号：US20240182657A1

公开(公告)日：2024-06-06

申请号：US18282929

申请日：2022-03-09

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Akira IRIFUNE ,  Mitsuyoshi NISHINO

IPC: C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  H05K1/03

CPC classification number: C08J5/244 ,  C08K3/22 ,  C08K3/36 ,  C08K9/02 ,  C08K9/06 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2371/12 ,  C08K2003/2206 ,  C08K2003/2237 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: A resin composition contains a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, a curing agent (B), a titanate compound filler (C), and a silica filler (D), in which the content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.




In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.




In Formula (2), R4 represents a hydrogen atom or an alkyl group.

公开(公告)号：US09464214B2

公开(公告)日：2016-10-11

申请号：US14189302

申请日：2014-02-25

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  B32B37/12 ,  C08K3/38 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30 ,  B32B37/18 ,  C09K5/14

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Abstract translation: 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：US20160029483A1

公开(公告)日：2016-01-28

申请号：US14769919

申请日：2014-01-31

Applicant: ISHIHARA CHEMICAL CO., LTD.

Inventor： Yuichi KAWATO ,  Hidetoshi ARIMURA ,  Tomio KUDO

IPC: H05K1/09 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K1/092 ,  B22F3/008 ,  B22F7/04 ,  C09D5/24 ,  C09D7/40 ,  H01B1/22 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/1291 ,  H05K3/386 ,  H05K2201/0239 ,  H05K2203/072 ,  H05K2203/1131

Abstract: To provide copper particulate dispersion capable of forming a conductive film having favorable adhesiveness on an inorganic substrate by photo-sintering. The copper particulate dispersion includes a dispersion vehicle and copper particulates RUM The copper particulates are dispersed into the dispersion vehicle. The copper particulate dispersion includes an adhesion improvement agent for improving adhesiveness between a conductive film formed on a substrate by photo-sintering the copper particulate and the substrate. The substrate is an inorganic substrate. The adhesion improvement agent is a compound containing a phosphorus atom. Thus, the adhesion improvement agent improves adhesiveness between the conductive film and the inorganic substrate.

Abstract translation: 提供能够通过光烧结在无机基板上形成具有良好粘合性的导电膜的铜微粒分散体。 铜颗粒分散体包括分散载体和铜微粒RUM铜颗粒分散在分散载体中。 铜微粒分散体包括粘合改善剂，用于通过光致烧结铜颗粒和基底来提高形成在基底上的导电膜之间的粘附性。 基材是无机基材。 粘附改善剂是含有磷原子的化合物。 因此，粘合改善剂改善了导电膜和无机基材之间的粘附性。

公开(公告)号：US20150382461A1

公开(公告)日：2015-12-31

申请号：US14849122

申请日：2015-09-09

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hyung Gi HA ,  Jae Won JUNG ,  Yong Hwan KIM ,  Jong Jin LEE ,  Ja Ho KOO ,  Young Hwan SHIN ,  Dong Kyu LEE

IPC: H05K1/09

CPC classification number: H05K1/09 ,  H05K1/0284 ,  H05K1/11 ,  H05K3/383 ,  H05K3/385 ,  H05K3/462 ,  H05K2201/0195 ,  H05K2201/0239

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有用于电路的金属图案的基底基板; 以及设置在所述金属图案上的表面粗糙度，其中所述表面粗糙度在锚结构中具有第一表面粗糙度，以及在所述第一表面粗糙度上形成的针结构中具有黑色氧化物层的第二表面粗糙度。

公开(公告)号：US20150344733A1

公开(公告)日：2015-12-03

申请号：US14654911

申请日：2014-01-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Katsuya TOMIZAWA ,  Tomo CHIBA ,  Hiroshi TAKAHASHI ,  Eisuke SHIGA ,  Daisuke UEYAMA ,  Kentaro NOMIZU

IPC: C09D179/08 ,  C09D165/00 ,  H05K1/03 ,  C08K9/04

CPC classification number: C09D179/08 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/011 ,  C08L101/00 ,  C09D165/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31663 ,  Y10T442/2861 ,  Y10T442/2992 ,  C08L83/04

Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 μm to 100 μm; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Abstract translation: 本发明提供一种树脂组合物，其包含：平均粒径为1.0nm〜100nm的氧化铝和/或勃姆石的纳米粒子（A） 平均粒径为0.20μm〜100μm的微粒（B）; 和热固性树脂（C），其中纳米粒子（A）的表面用聚硅氧烷类改性剂处理。

公开(公告)号：US09169346B2

公开(公告)日：2015-10-27

申请号：US12337651

申请日：2008-12-18

Applicant: Chien-Jen Chung ,  Zhuo Wang

Inventor： Chien-Jen Chung ,  Zhuo Wang

IPC: C08G59/30 ,  B32B15/14 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  C08J5/24 ,  C08L63/00 ,  B32B17/04 ,  H05K1/03 ,  B32B27/26 ,  B32B17/10 ,  C08K3/36

CPC classification number: C08G59/30 ,  B32B15/14 ,  B32B17/04 ,  B32B17/10733 ,  B32B27/04 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  C08G59/308 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/02 ,  C08K3/36 ,  C08K2201/019 ,  C08L63/00 ,  C08L2205/16 ,  C08L2666/58 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0275 ,  Y10T428/259 ,  Y10T428/2971 ,  Y10T428/31529 ,  C08L2666/54

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract translation: 除此之外，本文提供环氧树脂清漆及其制备和使用方法。 在一些实施方案中，环氧树脂清漆至少包含填料如二氧化硅。 在某些实施方案中，本文提供的环氧树脂清漆用于制造层压体，例如覆铜层压板。 在更远的实施例中，本文提供的覆铜层压板用于制造印刷电路板（PCB）。