公开(公告)号：US20230254975A1

公开(公告)日：2023-08-10

申请号：US18079267

申请日：2022-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunjae KIM ,  Kyongsoon CHO

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/183 ,  H05K1/0274 ,  H05K2201/09036 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10628 ,  H05K2201/10977

Abstract: A semiconductor package that includes a circuit board having an opening therein. The circuit board includes a first portion, and a second portion disposed below the first portion. The first portion protrudes further in a horizontal direction towards the opening than the second portion. A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate. A connection terminal directly contacts a lower surface of the first portion of the circuit board and an upper surface of the image sensor chip. A gap-fill member covers the connection terminal and covers a portion of an upper surface of the image sensor chip and at least a portion of a lateral side surface of the image sensor chip. The transparent substrate has a greater horizontal width than the circuit board.

公开(公告)号：US11659664B2

公开(公告)日：2023-05-23

申请号：US17471570

申请日：2021-09-10

Applicant: SEIKO EPSON CORPORATION

Inventor： Masataka Kazuno ,  Tetsuya Otsuki ,  Hitoshi Ueno

IPC: H05K1/18 ,  G01P3/44 ,  G01P15/18 ,  G01P15/125

CPC classification number: H05K1/181 ,  G01P3/44 ,  G01P15/125 ,  G01P15/18 ,  H05K2201/10151 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.

公开(公告)号：US20180263121A1

公开(公告)日：2018-09-13

申请号：US15913094

申请日：2018-03-06

Applicant: BorgWarner Ludwigsburg GmbH

Inventor： Sisay Tadele ,  Helmut Hoppe ,  Alexander Dauth ,  Gerd Bräuchle

IPC: H05K3/30

CPC classification number: H05K3/306 ,  H01G2/06 ,  H01G2/106 ,  H01G9/06 ,  H01G9/08 ,  H01G9/26 ,  H05K1/18 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/09027 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10522 ,  H05K2201/10606 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2201/10901 ,  H05K2201/2018 ,  H05K2201/2045

Abstract: What is described is a mounting aid for mounting electrical components, in particular electrolytic capacitors or chokes, on a printed circuit board, said mounting aid comprising a body, which has compartments for receiving the electrical components, wherein the compartments have a base with openings for the insertion of connection wires of the electrical components, and metal parts fastened to the body, which metal parts each form at least one contact pin on the underside of the body and each from a busbar for connection to electrical components in a plurality of compartments of the body.

公开(公告)号：US09949378B2

公开(公告)日：2018-04-17

申请号：US14251988

申请日：2014-04-14

Applicant: Presidio Components, Inc.

Inventor： Hung Van Trinh

IPC: H01L23/48 ,  H01L23/52 ,  H05K3/34 ,  H01L23/495 ,  H01L23/00 ,  H01L23/498 ,  H01G2/06 ,  B23K1/00 ,  B23K35/26 ,  C22C13/00 ,  H01G4/38 ,  H01G4/232

CPC classification number: H05K3/3426 ,  B23K1/0016 ,  B23K35/262 ,  C22C13/00 ,  H01G2/06 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/498 ,  H01L23/562 ,  H05K2201/10015 ,  H05K2201/10628 ,  H05K2201/10787 ,  H05K2203/047 ,  H05K2203/1173 ,  H05K2203/1377 ,  Y02P70/613

Abstract: An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

公开(公告)号：US20180042104A1

公开(公告)日：2018-02-08

申请号：US15785563

申请日：2017-10-17

Applicant: OMRON Corporation

Inventor： Shingo NAGAOKA ,  Hiroyuki ONISHI ,  Takeo NISHIKAWA ,  Kentaro HAMANA

IPC: H05K1/02 ,  H01L23/433 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01L23/36 ,  H01L23/4332 ,  H01L23/5222 ,  H02M1/44 ,  H02M3/155 ,  H02M7/48 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/0311 ,  H05K2201/066 ,  H05K2201/0792 ,  H05K2201/10166 ,  H05K2201/10265 ,  H05K2201/10356 ,  H05K2201/10628 ,  H05K2201/10757

Abstract: Provided is a power converter which is applied to a power converter equipped with a switching element provided on a line, and a radiator connected to a predetermined potential such as a ground potential. A noise eliminator in which a conductive member is covered with insulator is provided between the switching element (semiconductor switch) and the radiator (heatsink). A flexible connecting line connected to a conductive member of the noise eliminator is connected to an on-board line disposed on a circuit board.

公开(公告)号：US20170354037A1

公开(公告)日：2017-12-07

申请号：US15535639

申请日：2015-12-08

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  Sumitomo Electric Industries, Ltd.

Inventor： Tou Chin ,  Yu Muronoi

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10628 ,  H05K2201/10757 ,  Y02P70/611 ,  Y02P70/613

Abstract: Provided are a circuit assembly in which it is possible to eliminate or reduce a level difference between a mounting surface of a substrate and portions to which terminals that are electrically connected to a conductive member are connected, and that can be easily produced, and a method for manufacturing the same. A circuit assembly includes a substrate provided with openings and an electronic component mounted on one side of the substrate, a conductive member that is a plate-shaped member fixed to another side of the substrate, the conductive member constituting a conductive path, and a relay member that is fixed to a surface on the substrate side of the conductive member and made of an electrically conductive material, the relay member being accommodated in the openings formed in the substrate, at least one terminal of the electronic component being connected to the relay member.

公开(公告)号：US20170318661A1

公开(公告)日：2017-11-02

申请号：US15486374

申请日：2017-04-13

Applicant: Mitsubishi Electric Corporation

Inventor： Shinji MATSUNAGA

IPC: H05K1/02 ,  H01L23/495 ,  H01L23/367 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49894 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/10628 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit board, on which a packaged semiconductor integrated circuit is to be mounted, includes a substrate, a heat-dissipating connection pad, and a first open area. The substrate includes a substrate body having a main surface, a metal layer located on the main surface, and an insulating layer located on the metal layer. In the heat-dissipating connection pad, the metal layer is exposed from an opening in the insulating layer. The heat-dissipating connection pad is connectable to a heat-dissipating unit of the semiconductor integrated circuit via a bond. In the first open area, the metal layer is exposed from an opening in the insulating layer located outboard with respect to a periphery of the heat-dissipating connection pad.

公开(公告)号：US20170110340A1

公开(公告)日：2017-04-20

申请号：US15392909

申请日：2016-12-28

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/48 ,  H01L21/54 ,  H01L21/78

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US20170027077A1

公开(公告)日：2017-01-26

申请号：US15074236

申请日：2016-03-18

Applicant: AeroVironment, Inc.

Inventor： William John Nicoloff

IPC: H05K7/14 ,  H05K5/00 ,  B64D45/00 ,  H05K5/02 ,  H05K1/02 ,  H05K7/18 ,  H05K1/18

CPC classification number: H05K7/1422 ,  B64C1/06 ,  B64C39/024 ,  B64D45/00 ,  H05K1/0271 ,  H05K1/181 ,  H05K5/0034 ,  H05K5/0217 ,  H05K7/183 ,  H05K2201/09063 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/2027 ,  H05K2201/2045 ,  H05K2203/167

Abstract: A shock resistant fuselage system includes first and second fuselage side walls, each of the first and second fuselage side walls having a plurality of guide posts, and a printed circuit board (PCB) rigidly attached to at least one of the first and second fuselage side walls, the PCB having a plurality of guide slots, each of the plurality of guide posts slideably seated in a respective one of the plurality of guide slots so that elastic deformation of the PCB is guided by the guide slots between the first and second fuselage side walls.

Abstract translation: 抗冲击机身系统包括第一和第二机身侧壁，第一和第二机身侧壁中的每一个具有多个导向柱，以及刚性地连接到第一和第二机身侧的至少一个的印刷电路板 所述PCB具有多个引导槽，所述多个引导柱中的每一个可滑动地安置在所述多个引导槽中的相应一个引导槽中，使得所述PCB的弹性变形由所述第一和第二机身侧之间的引导槽引导 墙壁

公开(公告)号：US09546764B2

公开(公告)日：2017-01-17

申请号：US14809195

申请日：2015-07-25

Applicant: GrafTech International Holdings Inc.

Inventor： Alexander J. Augoustidis ,  Gregory P. Kramer ,  Robert Anderson Reynolds, III

IPC: F21V29/70 ,  F21K99/00 ,  F21V29/83 ,  H05K1/03 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/05 ,  H05K3/44 ,  H05K7/20 ,  H05K1/09 ,  H05K1/02 ,  H05K3/24

CPC classification number: F21K9/20 ,  F21V29/70 ,  F21V29/83 ,  F21V29/85 ,  H05B33/06 ,  H05B33/12 ,  H05K1/0203 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/056 ,  H05K1/092 ,  H05K3/245 ,  H05K3/44 ,  H05K7/20127 ,  H05K7/20963 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/1056 ,  H05K2201/10628

Abstract: A display device is provided. The display device includes a light engine having light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the light emitting components for improved cooling of the heat generated by the light emitting component and surrounding devices.

Abstract translation: 提供显示装置。 显示装置包括具有安装到具有柔性石墨基板的柔性电路板的发光部件的光引擎。 柔性电路板包括形成在柔性石墨基板的表面上的电介质层和形成在电介质表面上的导电层。 高的平面内导热石墨衬底提供增强的传热能力以有效地将热量从发光部件移开，以改善由发光部件和周围器件产生的热量的冷却。