公开(公告)号：US20150094403A1

公开(公告)日：2015-04-02

申请号：US14250130

申请日：2014-04-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ki Seok KIM ,  Hwa Young LEE ,  Ji Hye SHIM

IPC: C08K9/06 ,  H05K1/03

CPC classification number: C08K9/06 ,  C08L63/00 ,  C09C1/02 ,  C09C1/021 ,  C09C1/027 ,  C09C1/028 ,  C09C1/28 ,  C09C1/3081 ,  C09C1/36 ,  C09C1/3684 ,  C09C1/405 ,  C09C1/407 ,  C09C1/42 ,  C09C3/12 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: Disclosed herein is a surface-modified inorganic filler including an alkyl group and an amine group sequentially introduced on a surface thereof, wherein the alkyl group and the amine group are introduced on the surface of the inorganic filler in a weight ratio between the alkyl group and the amine group of 0.5:9.5 to 4:6. An epoxy resin composition including the surface-treated inorganic filler according to the present invention may have low dielectric loss rate and low coefficient of thermal expansion properties.

Abstract translation: 本文公开了一种表面改性的无机填料，其包括在其表面上顺序引入的烷基和胺基，其中烷基和胺基以无机填料的表面上以烷基与 胺基为0.5:9.5至4:6。 包含根据本发明的表面处理无机填料的环氧树脂组合物可以具有低的介电损耗率和低的热膨胀系数。

公开(公告)号：US20150034366A1

公开(公告)日：2015-02-05

申请号：US14481188

申请日：2014-09-09

Applicant: Panasonic Corporation

Inventor： Shingo YOSHIOKA ,  Hiroaki FUJIWARA ,  Hiromitsu TAKASHITA ,  Tsuyoshi TAKEDA

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/119 ,  H01L2224/81385 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/0044 ,  H05K3/0076 ,  H05K3/0079 ,  H05K3/0085 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0239 ,  H05K2201/0376 ,  H05K2201/0769 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/09972 ,  H05K2203/0108 ,  H05K2203/013 ,  H05K2203/0143 ,  H05K2203/0228 ,  H05K2203/0264 ,  H05K2203/0285 ,  H05K2203/0565 ,  H05K2203/0706 ,  H05K2203/0776 ,  H05K2203/1163 ,  Y02P70/611

Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.

Abstract translation: 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。

公开(公告)号：US20140151100A1

公开(公告)日：2014-06-05

申请号：US14092188

申请日：2013-11-27

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Yeon Seop YU ,  Moon II Kim ,  Jun Young Kim

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2924/3511 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.

Abstract translation: 电子部件嵌入式印刷电路板包括具有空腔的芯体; 插入腔内的电子部件; 绝缘层层叠在芯的顶部和底部，并与具有分别作用在有机材料和无机材料上的官能团的偶联剂混合以结合到电子部件的外周表面; 以及设置在绝缘层上的电路图案。

公开(公告)号：US20110217512A1

公开(公告)日：2011-09-08

申请号：US13060327

申请日：2009-08-28

Applicant: Masaru Heishi ,  Nobuhiro Goto ,  Hiroshi Kouyanagi ,  Reona Yokota ,  Toshiaki Tanaka

Inventor： Masaru Heishi ,  Nobuhiro Goto ,  Hiroshi Kouyanagi ,  Reona Yokota ,  Toshiaki Tanaka

IPC: B32B27/38 ,  B32B33/00 ,  B32B37/02 ,  B32B37/06 ,  B32B37/10 ,  B32B37/12 ,  B32B37/14

CPC classification number: H05K3/4661 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/1476 ,  Y10T428/24355

Abstract: Provided is a laminated body capable of reducing the surface roughness of the surface of a roughening-treated cured body layer, and increasing the adhesive strength between the cured body layer and a metal layer. A laminated body includes a cured body layer formed by: laminating a resin film on a substrate, forming a preliminary-cured body layer by preliminary-curing the resin film at 100° C. to 200° C., and performing a roughening treatment on the surface of the cured object layer at 55° C. to 80° C. The resin film is formed from a resin composition including an epoxy resin, a phenol curing agent, a curing accelerator, and a surface-treated substance which is a surface treated, using 0.5 to 3.5 parts by weight of a silane coupling agent, on 100 parts by weight of inorganic filler with a mean particle diameter of 0.05 to 1.5 μm. The silane coupling agent has an epoxy group, an imidazole group, or an amino group.

Abstract translation: 提供一种能够降低经粗化处理的固化体层的表面的表面粗糙度并提高固化体层与金属层之间的粘合强度的层叠体。 层叠体包括：固化体层，其通过以下方式形成：将树脂膜层压在基材上，通过在100℃〜200℃下预干燥树脂膜，并对树脂膜进行粗糙化处理，形成预固化体层 固化物层的表面在55℃至80℃。树脂膜由包括环氧树脂，酚固化剂，固化促进剂的树脂组合物和作为表面的表面处理物质形成 在100重量份的平均粒径为0.05〜1.5μm的无机填料中使用0.5〜3.5重量份的硅烷偶联剂进行处理。 硅烷偶联剂具有环氧基，咪唑基或氨基。

公开(公告)号：US07931830B2

公开(公告)日：2011-04-26

申请号：US11265287

申请日：2005-11-03

Applicant: Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas

Inventor： Robert M. Japp ,  Voya R. Markovich ,  Kostas I. Papathomas

IPC: H01B3/24 ,  H01L29/51

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08J2363/04 ,  H01B3/00 ,  H01B3/40 ,  H05K3/4602 ,  H05K2201/0209 ,  H05K2201/0239

Abstract: A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage by weight of a filler, and, significantly, only a minor amount of bromine. A circuitized substrate comprised of one or more of these dielectric layers and one or more conductive layers is also provided.

Abstract translation: 一种电介质组合物，其适于与支撑材料（例如玻璃纤维布）组合以形成可用于诸如PCB，芯片载体等的电路化的电介质层。 作为这样的层，其包括树脂，预定重量百分比的填料，以及明显仅少量的溴。 还提供了由这些电介质层中的一个或多个以及一个或多个导电层构成的电路化衬底。

公开(公告)号：US20100255319A1

公开(公告)日：2010-10-07

申请号：US12575861

申请日：2009-10-08

Applicant: SANKAR K. PAUL

Inventor： SANKAR K. PAUL

IPC: B32B27/00 ,  C08L83/00 ,  C08K3/18 ,  C08K3/20 ,  C08K3/34 ,  C08K3/38 ,  C08K3/22

CPC classification number: C09J151/04 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B15/14 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/283 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  C08G77/12 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/14 ,  C08K9/06 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J151/08 ,  C09J153/00 ,  C09J153/025 ,  H05K1/0373 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/24917 ,  Y10T428/31663

Abstract: Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.

Abstract translation: 描述了有机硅复合材料，其包含30至90体积％ 通过固化在同一共聚物中含有包含硅氢化物的含硅重复单元和包含C1-10烯键式不饱和基团的含硅重复单元的有机硅聚合物衍生的固化的有机硅共聚物的％ 和10至70体积份。 介电填料的％。 复合材料用于制造电路组件。

公开(公告)号：US20100243311A1

公开(公告)日：2010-09-30

申请号：US12607666

申请日：2009-10-28

Applicant: Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

Inventor： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

IPC: H01R12/04 ,  H01K3/10

CPC classification number: H05K3/4661 ,  H05K3/0035 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/1168

Abstract: A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

Abstract translation: 一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层， 第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和 聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。 第一绝缘层的第一表面面向第二绝缘层的第二表面。

公开(公告)号：US07754790B2

公开(公告)日：2010-07-13

申请号：US12010172

申请日：2008-01-22

Applicant: Masao Saito ,  Osamu Takamatsu ,  Takayuku Matsushima

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuku Matsushima

IPC: B32B7/10 ,  C08K9/02 ,  C08L63/10

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US20100144947A1

公开(公告)日：2010-06-10

申请号：US12523865

申请日：2008-01-16

Applicant: Naoaki Narishige ,  Shinji Tanabe

Inventor： Naoaki Narishige ,  Shinji Tanabe

IPC: C08K3/22 ,  B32B1/00

CPC classification number: C01G23/006 ,  C01P2002/34 ,  C01P2004/62 ,  C01P2006/12 ,  C08K9/04 ,  C09C1/00 ,  C09C1/36 ,  H01G4/1218 ,  H01G4/1236 ,  H01G4/206 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/2991

Abstract: It is an object of the present invention to provide an inorganic filler, which effectively suppresses elution of A-site metals such as Ba, Ca, Sr, and Mg from a perovskite-type composite oxide and which can be particularly preferably used as an inorganic filler for a composite dielectric body. The inorganic filler of the present invention is characterized in that it comprises a perovskite-type composite oxide that has been coated by hydrolyzing a titanate coupling agent in a solvent. The pH of the inorganic filler is preferably 8.5 or less when it is dispersed in water, and the aforementioned solvent is preferably water.

Abstract translation: 本发明的目的是提供一种无机填料，其有效地抑制了钙钛矿型复合氧化物中Ba，Ca，Sr和Mg等A位金属的溶出，特别优选用作无机填料 用于复合电介质体的填料。 本发明的无机填料的特征在于，其包含通过在溶剂中水解钛酸酯偶联剂而被包覆的钙钛矿型复合氧化物。 当分散在水中时，无机填充剂的pH优选为8.5以下，上述溶剂优选为水。

公开(公告)号：US20100092764A1

公开(公告)日：2010-04-15

申请号：US12337651

申请日：2008-12-18

Applicant: Chien-Jen CHUNG ,  Zhuo Wang

Inventor： Chien-Jen CHUNG ,  Zhuo Wang

IPC: B32B27/38 ,  C08L63/00 ,  B32B5/16 ,  B32B17/02 ,  B05D3/02 ,  B32B37/06

CPC classification number: C08G59/30 ,  B32B15/14 ,  B32B17/04 ,  B32B17/10733 ,  B32B27/04 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  C08G59/308 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  C08J2463/02 ,  C08K3/36 ,  C08K2201/019 ,  C08L63/00 ,  C08L2205/16 ,  C08L2666/58 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0275 ,  Y10T428/259 ,  Y10T428/2971 ,  Y10T428/31529 ,  C08L2666/54

Abstract: Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In farther embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).

Abstract translation: 除此之外，本文提供环氧树脂清漆及其制备和使用方法。 在一些实施方案中，环氧树脂清漆至少包含填料如二氧化硅。 在某些实施方案中，本文提供的环氧树脂清漆用于制造层压体，例如覆铜层压板。 在更远的实施例中，本文提供的覆铜层压板用于制造印刷电路板（PCB）。