公开(公告)号：WO2008058673A2

公开(公告)日：2008-05-22

申请号：PCT/EP2007009713

申请日：2007-11-09

Applicant: HAEUSERMANN GMBH ,  OBERENDER LOTHAR ,  JANESCH RUDOLF ,  STRUMMER ERICH ,  HACKL JOHANN

Inventor： OBERENDER LOTHAR ,  JANESCH RUDOLF ,  STRUMMER ERICH ,  HACKL JOHANN

IPC: H05K1/02 ,  B23K20/10 ,  H05K3/10 ,  H05K3/32

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/78313 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0209 ,  H05K1/0263 ,  H05K3/103 ,  H05K3/222 ,  H05K3/328 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2224/48 ,  H01L2924/00

Abstract: The invention relates to a circuit board comprising at least one additional electrically conductive structure that is in the form of a round or rectangular electrically conductive wiring element, in particular in the form of an elongate copper element or element containing copper, that is brought into contact with copper film elements by ultrasound on at least one part on the surface on the copper film elements and is integrated into the circuit board by means of a lamination process. The at least one elongate wiring element has a cross-section that is deformed by means of a specifically formed sonotrode in a contact area that is flat in parts, such that the contact surfaces are at least 20%, in particular more than 30% and more particularly more than 50% greater in a non-deformed contact surface. The wiring element is further deformed in the cross-section in an approximately triangular like manner or in a trapezoidal manner thus increasing the contact surface. Also, the elongate wiring element in brought into contact at defined intervals in a flat manner on a conductive film element that is arranged therebelow.

Abstract translation: 本发明涉及一种具有在一个圆形或矩形的导电布线元件的形式的至少一个附加的导电结构的电路板，尤其是在细长的铜或含有铜的元件的形式，其为至少分段通过超声和​​这样的装置，通过在铜箔上的元件超声表面的装置接触作为添加元素 通过层压工艺来在印刷电路板，它是由特殊形状的超声焊极的装置的横截面，例如在变形至少一个细长的配线构件中至少分段平面接触区域集成，通过30％以上的至少20％的接触面，特别是，非常特别通过更 超过50％相对于进行了非变形接触面增加，从而进一步配线部件变形大约三角形状或在横截面为梯形，并 这样的接触面积增加，实现，并进一步由此细长配线部件以特定的间隔接触在位于箔元件下方的导电表面。

公开(公告)号：WO00002425A1

公开(公告)日：2000-01-13

申请号：PCT/SE1999/001178

申请日：1999-06-29

IPC: H01R43/02 ,  H05K1/03 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/341 ,  H01R43/0256 ,  H05K1/0306 ,  H05K3/4015 ,  H05K2201/068 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10969 ,  Y02P70/613

Abstract: The present invention relates to mounting an electric connector (20) onto a printed circuit board, particularly to a printed circuit board comprised of ceramic material, for instance either an LTCC substrate or an HTCC substrate. The problem addressed is one where the connector (20) tends to loosen from the substrate when the temperature varies. This is due to the difference in the coefficients of thermal expansion of the printed circuit board and the connector (20). The problem is solved with the aid of a so-called shim (10) that has a coefficient of thermal expansion between that of the printed circuit board and that of the connector. One side of the shim (10) is soldered onto the connector and the other side of the shim is soldered onto the printed circuit board. The connector (20) is therewith fastened to the printed circuit board. Shear stresses acting between the connector (20) and the printed circuit board are distributed through said board through the medium of two joints instead of one. The connector may alternatively be provided with a built-in shim.

Abstract translation: 本发明涉及将电连接器（20）安装到印刷电路板上，特别涉及由陶瓷材料（例如LTCC衬底或HTCC衬底）构成的印刷电路板。 所解决的问题是当温度变化时连接器（20）倾向于从基板松开的问题。 这是由于印刷电路板和连接器（20）的热膨胀系数的差异。 借助于具有印刷电路板和连接器的热膨胀系数的所谓的垫片（10）来解决问题。 将垫片（10）的一侧焊接到连接器上，将垫片的另一侧焊接到印刷电路板上。 连接器（20）固定在印刷电路板上。 作用在连接器（20）和印刷电路板之间的剪切应力通过两个接头的介质而不是一个分布在所述板上。 连接器可以替代地设置有内置垫片。

公开(公告)号：WO98033363A1

公开(公告)日：1998-07-30

申请号：PCT/JP1998/000280

申请日：1998-01-22

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4015 ,  H05K3/3405 ,  H05K3/341 ,  H05K2201/09172 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10962 ,  Y02P70/613

Abstract: There are disclosed printed board (5) on which electronic parts are mounted, a method for manufacturing the printed board, and a structure for connecting conductor elements (8, 8') to this printed board. The printed board includes an insulating supporting substrate (50) and at least one metallic terminal (53, 54). The supporting substrate is provided with at least one opening (51, 52) through the substrate, and the metallic terminal is fixed to the supporting substrate without protruding from the supporting substrate and bridges the opening.

Abstract translation: 公开了其上安装有电子部件的印刷电路板（5），印刷电路板的制造方法以及用于将导体元件（8,8'）连接到该印刷电路板的结构。 印刷电路板包括绝缘支撑基板（50）和至少一个金属端子（53,54）。 支撑基板设置有穿过基板的至少一个开口（51,52），并且金属端子固定到支撑基板而不从支撑基板突出并且桥接开口。

公开(公告)号：WO1995025346A1

公开(公告)日：1995-09-21

申请号：PCT/DE1995000359

申请日：1995-03-14

Applicant: FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V. ,  BUSCHICK, Klaus

Inventor： FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

IPC: H01L23/498

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/4038 ,  H05K2201/0187 ,  H05K2201/1028 ,  H05K2203/0235 ,  H05K2203/063 ,  H01L2924/00

Abstract: Electric connections assembled in a connection or contacting element may be produced in high number and with a high density, preferably by a process from the thin film technology. The increasing 3D-integration of microelectronic structures requires a high number of vertical electric connections in the smallest possible space and with a good signal transmission quality, in particular for contacts through microelectronic substrates. For that purpose, prefabricated miniaturised contacting elements which provide the required high number of vertical electric connections are embedded in the most different substrate materials. The invention allows vertical electric connections to achieve the high quality of usual horizontal printed circuits. The contacting elements are embedded in the substrate materials by a planar junction technique which is a simple packaging technique that may be carried out even by small enterprises.

Abstract translation: 本发明涉及电连接，其中被组合在在连接或Durchkontaktierungselement并且能够以高量和高密度来制造，并且优选地包括的薄膜技术的方法被使用。 微电子结构的生长3D集成需要通过在小的空间，并用良好的信号传输质量在大量的垂直电连接微电子基底材料特定的通孔。 这是通过嵌入完成预设计，小型化，根据本发明的馈通元件，其提供在各种基材材料的可用的需要大量的电垂直连接。 通过本发明，在垂直的电连接实现高品质传统的水平互连。 根据本发明的由平面Fügertechnik的手段在基片材料的嵌入馈通是可以由较小的公司来进行简单的封装技术。

公开(公告)号：WO1993026141A1

公开(公告)日：1993-12-23

申请号：PCT/US1993004931

申请日：1993-05-25

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  PARRISH, Steven, R. ,  CHAMPLIN, David, E.

IPC: H05K01/00

CPC classification number: B60R16/0238 ,  H01R9/28 ,  H02B1/20 ,  H05K3/103 ,  H05K3/107 ,  H05K3/325 ,  H05K7/026 ,  H05K2201/098 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/49162

Abstract: A flexibly configurable power distribution center (30) in which an electrical signal or power is routed by implementing an electrical interconnection at any point along a path of a conductor. Insulative portions (34, 35) or boards within an electrical power distribution center are fabricated having a plurality of recesses in the insulating portions. The strips of metal (66) are dimensioned and disposed within the recesses (64) for receiving electrical conductors therein. The electrical conductors (66) are in the form of flexibly configurable strips of metal such as steel, copper, brass or the like, which are disposed within the recesses in the insulating portions. The strips of metal (66) are dimensioned and disposed within the recesses (64), forming an exposed conductive ridge which is mechanically and electrically engageable by interface terminals along substantially the entire length of the conductor. The interface terminals (72, 72') have at least one female mating portion (74) for mechanically mating with the conductive ridge to establish electrical continuity therewith.

Abstract translation: 一种灵活配置的配电中心（30），其中通过沿着导体的路径的任何点实现电互连来传送电信号或电力。 制造在配电中心内的绝缘部分（34,35）或板，其中绝缘部分具有多个凹槽。 金属条（66）的尺寸设置在凹槽（64）内，用于在其中接纳电导体。 电导体（66）为柔性可配置的金属条，例如钢，铜，黄铜等，它们设置在绝缘部分的凹槽内。 金属条（66）的尺寸设置并设置在凹槽（64）内，形成暴露的导电脊，该裸露的导电脊基本上在导体的整个长度上由接口端子机械地和电接合。 接口端子（72,72'）具有至少一个阴配合部分（74），用于与导电脊部机械地配合以与其形成电连续性。

公开(公告)号：WO1993002485A1

公开(公告)日：1993-02-04

申请号：PCT/JP1992000913

申请日：1992-07-17

Applicant: FUJITSU LIMITED ,  TOZAWA, Norio

Inventor： FUJITSU LIMITED

IPC: H01P03/08

CPC classification number: H01P3/081 ,  H05K1/0237 ,  H05K1/0265 ,  H05K3/244 ,  H05K3/4015 ,  H05K2201/098 ,  H05K2201/1028

Abstract: A microstrip line capable of feeding a large DC current, in spite of maintaining a high characteristic impedance. The microstrip line is provided with a dielectric base (10), an earthing conductor (12), a conductor strip (14), and an upper conductor part (16). The upper conductor part (16) is provided nearly on the central line of the conductor strip (14), and has a section which is thick in a vertical direction and whose width w1 of the lower base (16a) is narrower than the width W of the conductor strip (14) and respective width w2 from the base (16a) to its opposite side (16b) are nearly equal to the width w1 of the base (16a) or become larger than the width w1 at upper parts. The upper conductor part (16) of such sectional shape is formed by welding onto the conductor strip (14) a linear member made of gold, silver or copper whose section is shaped so through etching, or by depositing on the conductor strip (14) gold, silver or copper through plating.

Abstract translation: 尽管维持高的特性阻抗，但是能够馈送大直流电流的微带线。 微带线设置有电介质基底（10），接地导体（12），导体条（14）和上导体部分（16）。 上导体部（16）大致设置在导体条（14）的中心线上，具有在垂直方向上较厚的部分，下基板（16a）的宽度w1比宽度W窄 的导体条（14）的宽度w2和从基部（16a）到其相对侧（16b）的宽度w2几乎等于基部（16a）的宽度w1或变得大于上部的宽度w1。 这种截面形状的上导体部分（16）通过在导体条（14）上焊接由金，银或铜制成的线状部件形成，其截面通过蚀刻成形，或通过沉积在导体条（14）上而形成， 金，银或铜通过电镀。

公开(公告)号：TWI505899B

公开(公告)日：2015-11-01

申请号：TW102107683

申请日：2013-03-05

Applicant: 村田製作所股份有限公司 ,  MURATA MANUFACTURING CO., LTD.

Inventor： 中野公介 ,  NAKANO, KOSUKE ,  高岡英清 ,  TAKAOKA, HIDEKIYO

IPC: B23K35/24 ,  B23K101/42

CPC classification number: B23K31/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3026 ,  B23K2201/00 ,  B23K2201/34 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/18 ,  B23K2203/42 ,  C22C9/00 ,  C22C9/01 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01G4/228 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T403/479

公开(公告)号：TWI464129B

公开(公告)日：2014-12-11

申请号：TW101116513

申请日：2012-05-09

Applicant: 法國聖戈本玻璃公司 ,  SAINT-GOBAIN GLASS FRANCE

Inventor： 德珍 克里斯多夫 ,  DEGEN, CHRISTOPH ,  克洛瓦 赫拉德 ,  CHOLEWA, HARALD ,  瑞爾 伯恩哈德 ,  REUL, BERNHARD ,  瑞特薩克 米伽 ,  RATEICZAK, MITJA ,  史奇拉布 安德亞斯 ,  SCHLARB, ANDREAS ,  勒斯梅斯特 洛沙 ,  LESMEISTER, LOTHAR

IPC: C03C27/04 ,  B23K35/30

CPC classification number: H01R4/02 ,  H01L2924/0002 ,  H05B3/84 ,  H05B2203/016 ,  H05K3/3463 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/0001

公开(公告)号：TW428125B

公开(公告)日：2001-04-01

申请号：TW088108023

申请日：1999-05-18

Applicant: 羅沐股份有限公司

Inventor： 中村聰

IPC: G05F

CPC classification number: H05K1/148 ,  H01M2/1061 ,  H01M2/20 ,  H01M2/30 ,  H01M2/34 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/141 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/36 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0382 ,  H05K2201/1028

Abstract: 本發明之保護電路裝置(3)係用以防止對充電池2過度充電。保護電路裝置(3)具備:形成有預定電路圖案之電路基板本體部(32);及表面形成有複數個外部端子30，同時藉金屬片(35,36)而連接於電路基板本體部(32)之島狀部(33,34)。島狀部(33,34)係包含有第l及第2島狀部為宜。第l島狀部(33)以具備有外部端子(30),且對電路基板本體部(32)成平行狀為佳。第2島狀物部(34)配置在第l島狀部(33)與電路基板本體部(32)之間，對電路基板本體部(32)構成豎立狀。

Abstract in simplified Chinese: 本发明之保护电路设备(3)系用以防止对充电池2过度充电。保护电路设备(3)具备:形成有预定电路图案之电路基板本体部(32);及表面形成有复数个外部端子30，同时藉金属片(35,36)而连接于电路基板本体部(32)之岛状部(33,34)。岛状部(33,34)系包含有第l及第2岛状部为宜。第l岛状部(33)以具备有外部端子(30),且对电路基板本体部(32)成平行状为佳。第2岛状物部(34)配置在第l岛状部(33)与电路基板本体部(32)之间，对电路基板本体部(32)构成竖立状。

公开(公告)号：KR1020160099406A

公开(公告)日：2016-08-22

申请号：KR1020150021838

申请日：2015-02-12

Applicant: 삼성전자주식회사

Inventor： 김만호 ,  정화중 ,  김영석 ,  윤영권 ,  이기혁 ,  최용환 ,  표선형

IPC: H05K7/06 ,  H05K1/18 ,  H05K5/02

CPC classification number: H04M1/0277 ,  H04M1/0202 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/182 ,  H05K1/183 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/0465 ,  H05K7/06 ,  H05K5/02

Abstract: 본발명의일 실시예에따르면, 휴대용전자장치는, 정면커버와, 후면커버와, 상기정면커버및 후면커버사이에배치되는회로기판으로서, 상기회로기판내에삽입된도전성패턴을포함하는회로기판과, 상기도전성패턴과전기적으로연결된신호발생또는전원공급소자와, 상기회로기판상에부착되고, 상기회로기판의위에서볼 때, 상기도전성패턴과적어도일부중첩되는접착층과, 상기접착층 위에배치되고, 상기회로기판의위에서볼 때, 상기접착층과적어도일부중첩되는제 1 구조체와, 상기제 1 구조체의상부에배치되고, 상기회로기판의위에서볼 때, 상기제 1 구조체와적어도일부중첩되며, 금속물질을포함하는하부면을포함하는제 2 구조체, 및상기제 1 구조체및 상기제 2 구조체의하부면사이에삽입되어, 상기제 2 구조체를상기제 1 구조체에부착시키는금속층을포함할수 있다. 다양한다른실시예들이가능하다.

Abstract translation: 公开了用于扩展区域以另外安装部件的便携式电子设备。 根据本发明的实施例，便携式电子设备包括：前盖; 后盖; 布置在前盖和后盖之间的电路板，并且包括插入电路板中的导电图案; 电连接到导电图案的信号产生或电源装置; 附着在所述电路板上的粘合剂层，并且当在所述电路板上方被看见时至少部分地与所述导电图案重叠; 布置在所述粘合剂层上的第一结构，并且当在所述电路板上方被看到时，至少部分地与所述粘合剂层重叠; 布置在所述第一结构的上部的第二结构，当在所述电路板上方被看到时，至少部分地与所述第一结构重叠，并且包括具有金属材料的下部表面; 以及插入在第一结构和第二结构的下部表面之间的金属层，以将第二结构附接到第一结构。 此外，其他各种实施例也是适用的。