公开(公告)号：US20170343204A1

公开(公告)日：2017-11-30

申请号：US15681989

申请日：2017-08-21

Applicant: Molex, LLC

Inventor： Yi-Tse HO

IPC: F21V29/83 ,  F21K9/232 ,  H05K3/18 ,  F21V29/77 ,  H05K1/02 ,  F21V19/00 ,  F21Y2107/40 ,  H05K3/38 ,  H05K3/10 ,  H05K3/00 ,  F21V3/00 ,  F21Y2115/10

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

公开(公告)号：US09821787B2

公开(公告)日：2017-11-21

申请号：US14632574

申请日：2015-02-26

Applicant: NISSIN KOGYO CO., LTD.

Inventor： Sakae Miyasaka

IPC: H05K7/10 ,  B60T15/02 ,  H05K3/40 ,  H05K3/32

CPC classification number: B60T15/028 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/10151 ,  H05K2203/048

Abstract: One embodiment provides a circuit board having a substrate and an electrode portion which is provided on the substrate. The electrode portion includes: a quadrangular land which is provided on a front surface of the substrate; a solder layer which is laminated on the whole of a front surface of the land; and a pad which is joined to a front surface of the solder layer. When the electrode portion is seen from thereabove, an outer circumferential line of the pad touches each of four sides of the land. Exposed portions where the solder layer is exposed are formed individually at four corners of a front surface of the electrode portion. And, the exposed portions are formed to have the same shape.

公开(公告)号：US09627739B2

公开(公告)日：2017-04-18

申请号：US13526817

申请日：2012-06-19

Applicant: Theodore Timaru

Inventor： Theodore Timaru

IPC: H05K5/00 ,  H01P5/02 ,  H05K1/14 ,  H05K1/02

CPC classification number: H01P5/028 ,  H05K1/0239 ,  H05K1/142 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/09845

Abstract: The system includes a first printed circuit board including a first transmission line, the first circuit board may be attached to a chassis and a second printed circuit board including a second transmission line, the second circuit board may be attached to the chassis and/or the first printed circuit board and the second transmission line configured to electrically couple power from the first transmission line.

公开(公告)号：US20170019996A1

公开(公告)日：2017-01-19

申请号：US15124499

申请日：2015-02-27

Applicant: SONY CORPORATION

Inventor： Toshihiko WATANABE

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

Abstract: A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

Abstract translation: 安装基板包括形成在基板10中的通孔13，第一接地部21，第二接地部31，第一部件安装部22，第二部件安装部32，导电层14和填充部件 15被填充到通孔13的一部分中。从第一陆部21的中心到部件51的最短距离允许值L0基于定位的通孔15的一部分的体积Vh来确定 在第一接地部21侧的填充部件15的上表面上，要安装到第一部件安装部22的部件51的长度L1和部件51的倾斜度的最大允许值为 相对于基板10的第一表面11安装到第一部件安装部22。

公开(公告)号：US09456503B2

公开(公告)日：2016-09-27

申请号：US14209106

申请日：2014-03-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi Nomura ,  Akihiko Kamada

IPC: H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/14

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2201/2072 ,  H05K2203/063 ,  H05K2203/1327 ,  Y10T29/49146 ,  H01L2924/00014

Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

Abstract translation: 在连接部件中的绝缘基板的接触面上形成防止树脂层分离的接合结构，该接触面与树脂层接触。 树脂层与绝缘基板的与树脂层接触的接触表面中的接合结构接合，接触表面形成连接部件的侧表面。

公开(公告)号：US09433087B2

公开(公告)日：2016-08-30

申请号：US14482177

申请日：2014-09-10

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Tomohiro Tashiro

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K5/00 ,  G02F1/1345 ,  H05K3/32 ,  G02F1/1333 ,  H05K3/36

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  G02F2001/133302 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/323 ,  H05K3/361 ,  H05K5/0017 ,  H05K2201/068 ,  H05K2201/09154

Abstract: A display device includes: a glass substrate including a driver circuit and a plurality of connection terminals that is connected to the driver circuit and is arranged in an array, and an elongated FPC, which has a plurality of panel connection terminals that correspond to the connection terminals and which is mounted on the glass substrate, wherein the FPC has a coverlay. The FPC has a chamfered-area end gap between an end portion of the coverlay facing an end face of the glass substrate and a chamfered-area end portion of the glass substrate in a mounted state, wherein the chamfered-area end gap is covered with an insulating resin, and wherein the chamfered-area end gap at a center portion of the FPC is narrower than the chamfered-area end gap at both end portions of the FPC.

Abstract translation: 显示装置包括：玻璃基板，包括驱动电路和连接到驱动电路并且布置成阵列的多个连接端子，以及细长FPC，其具有与连接对应的多个面板连接端子 端子，并且其安装在玻璃基板上，其中FPC具有覆盖层。 FPC在安装状态下在覆盖物的面向玻璃基板的端面的端部与玻璃基板的倒角区域端部之间具有倒角区域端部间隙，其中，倒角区域端部间隙被覆盖 绝缘树脂，并且其中FPC的中心部分处的倒角区域端部间隙比FPC的两个端部处的倒角区域端部间隙窄。

公开(公告)号：US09420681B1

公开(公告)日：2016-08-16

申请号：US14742721

申请日：2015-06-18

Applicant: Interface Optoelectronics (ShenZhen) Co., Ltd. ,  General Interface Solution Limited

Inventor： Shih-Chieh Huang

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/02 ,  G06F3/041 ,  G06F2203/04103 ,  H05K1/0306 ,  H05K3/28 ,  H05K2201/09145 ,  H05K2201/09154

Abstract: A substrate structure includes a substrate, a buffer layer, and a protecting layer. The substrate includes a side surface. The buffer layer is disposed between the side surface of the substrate and the protecting layer, and the hardness of the protecting layer is greater than the hardness of the buffer layer.

Abstract translation: 衬底结构包括衬底，缓冲层和保护层。 基板包括侧面。 缓冲层设置在基板的侧表面和保护层之间，保护层的硬度大于缓冲层的硬度。

公开(公告)号：US20160061424A1

公开(公告)日：2016-03-03

申请号：US14721255

申请日：2015-05-26

Applicant: TOSHIBA LIGHTING & TECHNOLOGY CORPORATION

Inventor： Toshihiro Hatanaka ,  Ryuji Tsuchiya ,  Kiyokazu Hino ,  Hiromitsu Shiraishi

IPC: F21V19/00 ,  F21V23/00 ,  F21V31/00 ,  F21V23/06

CPC classification number: F21V19/005 ,  F21S41/141 ,  F21S41/19 ,  F21S43/14 ,  F21S43/19 ,  F21S45/10 ,  F21S45/47 ,  F21S45/48 ,  F21Y2115/10 ,  F21Y2115/30 ,  H05K3/0061 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/10106

Abstract: According to one embodiment, a lighting device for a moving body includes a substrate that has a base body having a plurality of connection sections on a side surface and a wiring pattern provided on at least one main surface of the base body; a light emitting element that is electrically connected to the wiring pattern; and an adhesive section that is provided between the base body and a body section.The connection sections are at least one of groove sections, concave sections, and convex sections.The adhesive section covers at least a part of the plurality of connection sections.

Abstract translation: 根据一个实施例，一种用于移动体的照明装置包括：基底，该基底具有在侧面上具有多个连接部分的基体，以及布置在基体的至少一个主表面上的布线图形; 电连接到所述布线图案的发光元件; 以及设置在基体和主体部之间的粘合部。 连接部是槽部​​，凹部和凸部中的至少一个。 粘合部分覆盖多个连接部分的至少一部分。

公开(公告)号：US09232643B2

公开(公告)日：2016-01-05

申请号：US14006047

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/0298 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/46 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2203/0346 ,  Y10T29/49155

Abstract: Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.

Abstract translation: 提供一种陶瓷布线基板; 用于提供多个布线基板的多片陶瓷布线基板阵列; 以及可靠地制造布线基板阵列的方法。 陶瓷布线基板包括：基板主体，具有前表面，后表面，侧面，位于前表面侧的槽表面和位于背面侧的断裂面; 以及在平面图中具有凹形形状的凹口，并且设置在至少一个侧面上，以便在前表面和后表面之间延伸，其中在具有凹口的侧表面中， 凹槽表面和断裂表面在凹口的相对侧上具有弯曲部分，弯曲部分在侧视图中朝向基板主体的前表面凸出。

公开(公告)号：US20150257274A1

公开(公告)日：2015-09-10

申请号：US14625809

申请日：2015-02-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yasuhiko KUSAMA ,  Hideyuki TAKO ,  Kenji KAWAI ,  Fumihisa MIYASAKA

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15313 ,  H05K3/0011 ,  H05K3/0032 ,  H05K3/007 ,  H05K3/301 ,  H05K3/4602 ,  H05K2201/09063 ,  H05K2201/09154 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/1105 ,  H05K2203/1316 ,  H05K2203/167 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part, and a resin layer filling the hole and supporting the electronic components.

Abstract translation: 布线基板包括芯层，该芯层具有贯穿其的厚度方向的孔，并且具有从孔的内壁向孔的内部空间突出的突出部，设置在孔中的多个电子部件， 在平面图中以间隔间隔并排配置，电子部件具有侧部，侧部与突出部接合，树脂层填充孔并支撑电子部件。