公开(公告)号：EP2743291B9

公开(公告)日：2018-02-07

申请号：EP13197126.9

申请日：2013-12-13

Applicant: Plastic Components and Modules Automotive S.p.A.

Inventor： Parola, Enrico ,  Iacobone, Pasquale ,  Valentin, Etienne

IPC: C08J5/00 ,  C08J5/04 ,  C08K3/00 ,  C08K7/06 ,  C08K7/14 ,  C08L23/02 ,  C08L23/04 ,  C08L23/06 ,  C08L23/10 ,  C08L23/12 ,  H05K3/10 ,  B82Y30/00

CPC classification number: H01B1/18 ,  B29C71/04 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/043 ,  C08K7/06 ,  C08K7/14 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2203/107 ,  H05K2203/1136

Abstract: A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, comprises a non-conductive polymeric matrix; a dispersed phase comprising at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fibre filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix.

公开(公告)号：EP2332883B1

公开(公告)日：2017-06-28

申请号：EP09813245.9

申请日：2009-09-10

Applicant: LG Chem, Ltd.

Inventor： KWON, Won-Jong ,  KIM, Jae-Hong ,  JIN, Sun-Mi ,  LEE, Sang-Uck ,  LIM, Young-Soo

IPC: B82B3/00 ,  C09D11/52

CPC classification number: H01B1/22 ,  B22F1/0018 ,  B22F9/24 ,  B22F2001/0033 ,  B82Y10/00 ,  B82Y30/00 ,  C09D11/52 ,  H01B1/24 ,  H01L31/022433 ,  H05K1/092 ,  H05K1/097 ,  H05K2201/026 ,  Y02E10/50 ,  Y10S977/762 ,  Y10S977/81 ,  Y10S977/895 ,  Y10S977/90 ,  Y10T428/12229

公开(公告)号：EP3180404A1

公开(公告)日：2017-06-21

申请号：EP15753331.6

申请日：2015-08-11

Applicant: BASF SE

Inventor： ZHANG, Rui ,  DIETSCH, Herve ,  GAO, Xuerong

IPC: C09D5/24 ,  C09D11/52 ,  H01B1/22

CPC classification number: C09D5/24 ,  C08F212/08 ,  C08F220/06 ,  C08K2003/0806 ,  C09D7/61 ,  C09D7/70 ,  C09D11/037 ,  C09D11/107 ,  C09D11/52 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/026

Abstract: Described is a composition suitable for the preparation of an electroconductive transparent layer said composition comprising silver nanowires and dissolved styrene/(meth)acrylic copolymers.

Abstract translation: 描述的是适用于制备/来导电透明层的组合物所述组合物包含银纳米线和溶解的苯乙烯（甲基）丙烯酸共聚物。

公开(公告)号：EP3072373A4

公开(公告)日：2017-06-21

申请号：EP14863676

申请日：2014-11-14

Applicant: C3NANO INC

Inventor： YANG XIQIANG ,  LI YING-SYI ,  HUANG YUNG-YU ,  SCULLY CHRISTOPHER S ,  MORRIS CLIFFORD M ,  VIRKAR AJAY

IPC: H05K1/02 ,  C09D5/24 ,  C09D11/08 ,  C09D11/10 ,  C09D11/38 ,  C09D11/52 ,  H01B1/22 ,  H05K1/09 ,  H05K3/10 ,  H05K3/12

CPC classification number: C09D11/52 ,  C09D11/08 ,  C09D11/10 ,  C09D11/38 ,  H05K1/097 ,  H05K3/105 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026

公开(公告)号：EP2602288A4

公开(公告)日：2016-11-16

申请号：EP11814716

申请日：2011-08-04

Applicant: HITACHI CHEMICAL CO LTD

Inventor： KUMASHIRO YASUSHI ,  MARUYAMA NAOKI ,  INADA MAKI

IPC: C08L63/00 ,  C08K3/00 ,  H01B1/24 ,  H01C7/00 ,  H01C17/06 ,  H05K1/16

CPC classification number: C09D11/324 ,  B82Y99/00 ,  C08K3/04 ,  C08K3/041 ,  C08K3/045 ,  C08K5/1535 ,  C08K7/24 ,  C08K2201/005 ,  C08K2201/011 ,  C08L63/00 ,  C09D11/36 ,  C09D11/38 ,  C09D11/52 ,  C09D163/00 ,  H01B1/24 ,  H01C7/003 ,  H01C17/0652 ,  H01C17/06593 ,  H05K1/167 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/742

公开(公告)号：EP3083248A2

公开(公告)日：2016-10-26

申请号：EP14871982.6

申请日：2014-12-19

Applicant: The Regents of the University of California

Inventor： COLEMAN, Todd, Prentice ,  KIM, Yun, Soung ,  BAJEMA, Michael ,  WEINREB, Robert, N.

IPC: B32B37/00 ,  H01L21/67 ,  H01L21/68

CPC classification number: H05K1/118 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/145 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L33/62 ,  H01L2224/24011 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/25175 ,  H01L2224/82005 ,  H01L2224/82051 ,  H01L2224/82106 ,  H01L2224/82951 ,  H01L2224/97 ,  H01L2933/0066 ,  H05K1/025 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/303 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0173 ,  H05K2203/1316 ,  H05K2203/1469 ,  H05K3/467 ,  H01L2224/82

Abstract: Disclosed are highly scalable fabrication methods for producing electronic circuits, devices, and systems. In one aspect, a fabrication method includes attaching an electronic component at a location on a substrate including a flexible and electrically insulative material; forming a template to encase the electronic component by depositing a material in a phase to conform on the surfaces of the electronic component and the substrate, and causing the material to change to solid form; and producing a circuit or electronic device by forming openings in the substrate to expose conductive portions of the electronic component, creating electrical interconnections coupled to at least some of the conductive portions in a selected arrangement on the substrate, and depositing a layer of an electrically insulative and flexible material over the electrical interconnections on the substrate to form a flexible base of the circuit, in which the produced circuit or electronic device is encased in the template.

Abstract translation: 公开的是用于制造电子电路，设备，和系统的高度可伸缩的制造方法。 在一个方面中，一种制造方法包括：在上的基材，包括柔性和电绝缘材料的位置处附连到电子元件; 形成模板，通过在一个相沉积材料到电子部件的表面和所述基板上符合，并且使改变到固体形式的材料来包住电子元件; 和通过在该衬底上形成开口部的制造电路或电子装置，以暴露所述电子部件的导电部分，产生耦合到至少一些所述导电部的在所选择的排列在基片上的电互连，并沉积电绝缘层 并在基板上的电互连的柔性材料，以形成电路，其中，所述产生电路或电子设备被封装的柔性基底。

公开(公告)号：EP2977415A1

公开(公告)日：2016-01-27

申请号：EP15189199.1

申请日：2015-10-09

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： The designation of the inventor has not yet been filed

IPC: C09D11/00 ,  C09D11/30 ,  C09D11/52 ,  H01B1/14 ,  H01B1/20 ,  H01L23/552 ,  H05K1/02 ,  H05K1/09

CPC classification number: C09D11/00 ,  C09D11/30 ,  C09D11/52 ,  H01B1/12 ,  H01B1/20 ,  H01B1/22 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/097 ,  H05K2201/026 ,  H05K2201/0329 ,  H01L2924/00

Abstract: The present invention relates to a composition comprising
(i) at least one conductive polymer;
(ii) metal nanowires;
(iii) a first solvent having a boiling point in the range from 80 to 120°C;
(iv) a second solvent having a boiling point of more than 150°C; and
(v) at least one surfactant.
The invention also relates to process for the production of a layered body comprising an electrically conductive layer deposited onto a substrate, to a layered body obtainable by this process and to the use of the composition according to the present invention.

Abstract translation: 本发明涉及包含（i）至少一种导电聚合物的组合物; （ii）金属纳米线; （iii）沸点在80〜120℃的第一溶剂; （iv）沸点高于150℃的第二溶剂; 和（v）至少一种表面活性剂。 本发明还涉及生产层叠体的方法，其包括沉积在基底上的导电层，可通过该方法获得的层状体以及根据本发明的组合物的用途。

公开(公告)号：EP2824676A4

公开(公告)日：2015-12-02

申请号：EP13757358

申请日：2013-03-08

Applicant: SHOWA DENKO KK ,  UNIV OSAKA

Inventor： SUGANUMA KATSUAKI ,  NOGI MASAYA ,  JIU JINTING ,  SUGAHARA TOHRU ,  UCHIDA HIROSHI ,  SHINOZAKI KENJI

IPC: H01B13/00 ,  H05K3/10

CPC classification number: H01B13/003 ,  H01B13/0026 ,  H05K1/0306 ,  H05K1/097 ,  H05K3/10 ,  H05K3/106 ,  H05K2201/0108 ,  H05K2201/026

公开(公告)号：EP2843667A4

公开(公告)日：2015-10-21

申请号：EP13782608

申请日：2013-04-26

Applicant: UNIV OSAKA ,  SHOWA DENKO KK

Inventor： SUGANUMA KATSUAKI ,  OHTSUKA KUNIAKI ,  MURAHASHI KOICHIRO ,  TAKEMURA YASUTAKA ,  UCHIDA HIROSHI

IPC: H01B1/22 ,  C09D11/00 ,  H01B1/00 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/22 ,  C09D11/03 ,  C09D11/52 ,  H01B13/0016 ,  H01B13/003 ,  H01B13/0036 ,  H05K1/097 ,  H05K3/1283 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2203/107

公开(公告)号：EP2922099A1

公开(公告)日：2015-09-23

申请号：EP15156396.2

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael, R. ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A. ,  Winoto, Adrian ,  Wolk, Jeffrey

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  B82Y30/00 ,  B82Y20/00

CPC classification number: H01B1/22 ,  B22F1/0025 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: There is disclosed a transparent conductor comprising a substrate and a conductive layer on the substrate, the conductive layer including a plurality of metal nanowires and a matrix.

Abstract translation: 公开了一种透明导体，其在衬底上包括衬底和导电层，导电层包括多个金属纳米线和基体。