公开(公告)号：US09781845B2

公开(公告)日：2017-10-03

申请号：US14771182

申请日：2014-02-27

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Johannes Stahr ,  Mikael Tuominen

IPC: H05K1/18 ,  H05K3/46 ,  H05K3/32 ,  H05K3/30

CPC classification number: H05K3/4611 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/323 ,  H05K3/46 ,  H05K2201/032 ,  H05K2203/063 ,  H05K2203/068

Abstract: In a semi-finished product for the production of a printed circuit board, the semi-finished product comprising a plurality of having multiple insulating layers of a prepreg material and conductive layers (2, 2′) of a conductive material and further comprising having at least one electronic component embedded in at least one insulating layer the at least one electronic component is attached to a corresponding conductive layer by the aid of an Anisotropic Conductive Film and the Anisotropic Conductive Film as well as the prepreg material are in an unprocessed state. The method for producing a printed circuit board comprises the following steps: Providing at least one conductive layer (2), Applying an Anisotropic Conductive Film on the conductive layer, Affixing at least one electronic component on the Anisotropic Conductive Film, Embedding the electronic component in at least one insulating layer of prepreg material to obtain a semi-finished product, Laminating the semi-finished product to process the prepreg material and the Anisotropic Conductive Film.

公开(公告)号：US20170247334A1

公开(公告)日：2017-08-31

申请号：US15506681

申请日：2015-08-27

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Tatsuro ISHIKAWA ,  Kunihiro NODA ,  Yasuhide OHUCHI ,  Hiroki CHISAKA ,  Dai SHIOTA ,  Yukitsugu MAEDA ,  Takafumi IMOTO ,  Kouhei FUJITA ,  Yasuyuki AKAI

IPC: C07D233/60 ,  G03F7/038 ,  G03F7/039 ,  C08K5/3445 ,  G03F7/16 ,  H05K3/28 ,  G03F7/32 ,  G03F7/40 ,  C23C22/05 ,  H05K3/46 ,  H05K1/09 ,  G03F7/031 ,  G03F7/20

CPC classification number: C07D233/60 ,  C08K5/3445 ,  C23C22/02 ,  C23C22/05 ,  C23F11/00 ,  G03F7/004 ,  G03F7/031 ,  G03F7/038 ,  G03F7/039 ,  G03F7/162 ,  G03F7/168 ,  G03F7/20 ,  G03F7/322 ,  G03F7/40 ,  H05K1/09 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/032

Abstract: A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

公开(公告)号：US09736941B1

公开(公告)日：2017-08-15

申请号：US15455560

申请日：2017-03-10

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yuji Kunimoto

IPC: H05K1/11 ,  H05K1/05

CPC classification number: H05K1/116 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/05 ,  H05K3/4608 ,  H05K3/4661 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/09718 ,  H05K2203/0353

Abstract: A wiring substrate includes an insulating layer, a stack including wiring layers and photosensitive-resin insulating layers on a first surface of the insulating layer, a wiring layer on a second surface of the insulating layer, having a lower wiring density than the wiring layers, a metal core plate buried in the insulating layer and positioned on the stack side with respect to the center of the insulating layer in its thickness direction, and a via wiring buried in the insulating layer to have a first end face exposed at the first surface and joined to the lowermost one of the wiring layers, and a second end face joined to the metal core plate. The first surface and the first end face are substantially flush with each other. The wiring layers include a signal line, and a ground line concentrically formed around the signal line, with a predetermined interval therebetween.

公开(公告)号：US20170135208A1

公开(公告)日：2017-05-11

申请号：US15342308

申请日：2016-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doh Won JUNG ,  Se Yun KIM ,  Jong Wook ROH ,  Jongmin LEE ,  Sungwoo HWANG ,  Jinyoung HWANG ,  Chan KWAK

IPC: H05K1/09 ,  C09D1/00 ,  C09D7/12 ,  C01G55/00 ,  C09D5/24

CPC classification number: H05K1/09 ,  B82Y30/00 ,  B82Y40/00 ,  C01G55/004 ,  C01P2002/72 ,  C01P2002/85 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/24 ,  C01P2004/61 ,  C01P2006/40 ,  C08K3/22 ,  C09D1/00 ,  C09D5/24 ,  C09D7/70 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338 ,  H05K2201/0776 ,  H05K2201/10977 ,  Y10S977/755 ,  Y10S977/896 ,  Y10S977/932

Abstract: An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

公开(公告)号：US20170127527A1

公开(公告)日：2017-05-04

申请号：US15409221

申请日：2017-01-18

Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.

Inventor： Dror Hurwitz ,  Alex Huang

IPC: H05K3/00 ,  H05K1/03 ,  H05K3/06 ,  H05K1/11

CPC classification number: H05K3/007 ,  C25D5/022 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0064 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/09609 ,  H05K2201/10242 ,  H01L2924/00

Abstract: An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.

公开(公告)号：US09622346B2

公开(公告)日：2017-04-11

申请号：US14438004

申请日：2013-10-21

Applicant: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Inventor： Jin Kawakita ,  Toyohiro Chikyo ,  Yasuo Hashimoto ,  Barbara Horvath

IPC: C09D17/00 ,  H05K1/09 ,  C09D201/00 ,  H01B1/22 ,  C09J7/02 ,  C08G73/02 ,  H01L21/768 ,  C08K3/08 ,  C08L65/00 ,  C09J165/00 ,  C08L79/02 ,  H05K3/40 ,  H01L23/498

CPC classification number: H05K1/095 ,  C08G73/0266 ,  C08G2261/3221 ,  C08G2261/3223 ,  C08G2261/43 ,  C08G2261/964 ,  C08K3/08 ,  C08L65/00 ,  C08L79/02 ,  C09D17/00 ,  C09D201/00 ,  C09J7/20 ,  C09J165/00 ,  C09J2205/102 ,  C09J2465/00 ,  H01B1/22 ,  H01L21/76898 ,  H01L23/49883 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/032 ,  Y10T428/24339

Abstract: A conductive polymer-metal complex becomes to be adhered simply and strongly on the surface of a substrate such as PTFE. By subjecting a solution containing a monomer which provides a conductive polymer, an anion, and a metal ions such as Ag+, Cu2+, Cu+ and the like to an irradiation with light having an energy required for exciting an electron to an energy level capable of reducing the metal ion, such as ultraviolet light, under an appropriated condition, thereby precipitating the conductive polymer-metal complex as being dispersed in the reaction liquid. By supplying this dispersion liquid onto various substrates, the complex microparticles in the dispersion liquid enter into and mate with the narrow holes on the surface of the substrate. As a result, the complex precipitate formed on the surface of the substrate and the substrate can be adhered strongly to each other.

公开(公告)号：US20170099732A1

公开(公告)日：2017-04-06

申请号：US15127203

申请日：2015-03-26

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Jinjoo PARK ,  Sumito UEHARA ,  Kousuke MIURA ,  Hiroshi UEDA

IPC: H05K1/09 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K1/097 ,  H05K1/092 ,  H05K3/12 ,  H05K3/246 ,  H05K3/4069 ,  H05K2201/032

Abstract: A substrate for a printed circuit board according to the present invention includes a base film having an insulating property and including at least one opening; a first conductive layer that is formed on both surfaces of the base film by applying and heat-treating a conductive ink containing metal particles, and that fills the at least one opening; and a second conductive layer formed, by plating, on at least one of surfaces of the first conductive layer. The metal particles preferably have a mean particle size of 1 nm or more and 500 nm or less.

公开(公告)号：US09560773B2

公开(公告)日：2017-01-31

申请号：US14809117

申请日：2015-07-24

Applicant: Tessera, Inc.

Inventor： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: An electrical connection structure includes a variable-composition nickel alloy layer with a minor constituent selected from a group consisting of boron, carbon, phosphorus, and tungsten, wherein at least over a portion of a conductive substrate, the concentration of the minor constituent decreases throughout the variable-composition nickel alloy layer in a direction from the bottom surface of the variable-composition nickel alloy layer to the top surface of the variable-composition nickel alloy layer.

Abstract translation: 电连接结构包括具有选自硼，碳，磷和钨的次要成分的可变组成镍合金层，其中至少在一部分导电基底上，次要成分的浓度全部降低 该可变组成镍合金层在从可变组成镍合金层的底面到可变组成镍合金层的顶表面的方向上。

公开(公告)号：US20170013715A1

公开(公告)日：2017-01-12

申请号：US14840302

申请日：2015-08-31

Applicant: Rohde & Schwarz GmbH & Co. KG

Inventor： Uwe Hassel

IPC: H05K1/11 ,  C25D7/12 ,  H05K3/06 ,  C25D5/34 ,  C25D5/48 ,  B23K26/362 ,  H05K1/03 ,  C25D3/38

CPC classification number: H05K3/4084 ,  C23C16/14 ,  C23C28/023 ,  C25D7/123 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/064 ,  H05K3/427 ,  H05K2201/032 ,  H05K2201/0959 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The printed circuit board with at least one substrate layer having signal lines on a corresponding upper surface and on a corresponding lower surface has a sleeve-sized conductive layer on a circumference of at least one via hole between the upper and lower surface for a conductive connection between at least one signal line on the upper surface and at least one signal line on the lower surface. to An axial enlargement of the sleeve-sized conductive layer is radially bent above a base layer of copper on the upper surface and below a base layer of copper on the lower surface.

Abstract translation: 具有至少一个在相应的上表面上和相应的下表面上具有信号线的基底层的印刷电路板在上表面和下表面之间的至少一个通孔的圆周上具有套筒尺寸的导电层，用于导电连接 在上表面上的至少一个信号线和下表面上的至少一个信号线之间。 套筒尺寸的导电层的轴向扩大径向地弯曲在上表面上的铜基底上方，并且在下表面上的铜基底层下面。

公开(公告)号：US09538656B2

公开(公告)日：2017-01-03

申请号：US14364085

申请日：2013-01-25

Applicant: Electrolux Home Products Corporation N.V.

Inventor： Laurent Jeanneteau ,  Thibaut Rigolle ,  Alex Viroli ,  Andrea Fattorini

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K1/18 ,  H05K1/05 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/142 ,  H05K1/0306 ,  H05K1/056 ,  H05K1/14 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3421 ,  H05K3/4015 ,  H05K3/4046 ,  H05K2201/0183 ,  H05K2201/032 ,  H05K2201/041 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.

Abstract translation: 本发明涉及包括印刷电路板（20），至少一个单独的电路板（10）和用于所述印刷电路板（20）的至少一个电力连接器（12）的电气和/或电子电路。 所述至少一个电源连接器（12）被连接或连接到相应的对应物。 在单独的电路板（10）处销售许多电和/或电子部件（22）。 所述至少一个单独的电路板（10）通过多个焊点（16）连接到所述印刷电路板（20）。 焊点（16）通过通孔技术连接到单独的电路板（10）。 焊接接头（16）通过SMD（表面安装器件）技术连接到印刷电路板（20）。 至少一个电源连接器（12）通过通孔技术紧固在单独的电路板（10）处。