中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1211 records (took 0.022 seconds)

    Rückverdrahtungsplatine
    271.
    发明公开
    Rückverdrahtungsplatine 审中-公开

    公开(公告)号：EP1349440A1

    公开(公告)日：2003-10-01

    申请号：EP02006973.8

    申请日：2002-03-27

    Applicant: Schroff GmbH

    Inventor： Röhrich, Manfred

    IPC: H05K7/14 ,  H01R12/34 ,  H01R12/16

    CPC classification number: H01R12/585 ,  H01R12/7088 ,  H05K1/0263 ,  H05K1/116 ,  H05K7/1457 ,  H05K2201/044 ,  H05K2201/0979 ,  H05K2201/10295

    Abstract: Eine Rückverdrahtungsplatine (3) für elektronische Steckbaugruppen ist an mindestens einer Modulschiene (2) eines Baugruppenträgers befestigbar. Die Rückverdrahtungsplatine (3) ist in gleichartige Abschnitte (4) unterteilt. Sie hat Randbereiche (5) und Signalanschluss-Felder (7), zwischen denen Stromanschluss-Felder (8) von Stromversorgungsanschlüssen (9) vorgesehen sind. Anschlussstücke (11) mit Kontaktstiften (12) sind mit den Stromversorgungsanschlüssen (9) kontaktiert. Die Stromversorgungsanschlüsse (9) eines Stromanschluss-Feldes (8) sowie die Kontaktstifte (12) des zugehörigen Anschlussstückes (11) sind miteinander korrespondierend in Form eines U angeordnet, wobei der U-Rücken zu dem benachbarten Signalanschluss-Feld (7) weist.

    Abstract translation: 该装置具有用于附接到具有带有附接孔的边缘区域，至少一个信号连接区域，至少一个当前连接区域和至少一个连接部分的模块轨道的组件载体。 电流连接区域和相关联的连接部分的接触引脚的电流供应连接被布置成U形的形状，其桥接面临相邻的信号连接区域。 该装置具有用于附接到至少一个模块轨道的组装载体，其具有至少一个具有附接孔（6）的边缘区域（5），至少一个信号连接区域（7），至少一个当前连接区域（8） 和至少一个连接部。 当前连接场的电流供应连接（9）和相关联的连接部分的接触针彼此以U形的形式布置，桥的面向相邻的信号连接场。

    BACKPLANE FOR HIGH SPEED DATA PROCESSING SYSTEM
    272.
    发明公开
    BACKPLANE FOR HIGH SPEED DATA PROCESSING SYSTEM 失效
    BACK FOR HIGH-SPEED数据处理系统

    公开(公告)号：EP0958717A4

    公开(公告)日：2002-07-24

    申请号：EP97920374

    申请日：1997-04-11

    Applicant: ARIZONA DIGITAL INC

    Inventor： BERDING ANDREW R

    IPC: H05K1/02 ,  H05K1/14 ,  H05K7/14

    CPC classification number: H05K1/0248 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09254 ,  H05K2201/09263

    Abstract: A data processing system includes a backplane and a plurality of logic boards connected to the backplane by a plurality of connectors. In one embodiment of the invention, a set of common points (23, 24) is electrically coupled to the connectors by individual conductive traces between each common point (23) and the corresponding pins (31-36) of the connectors. The common points are preferably centrally located among the plurality of connectors to reduce propagation delay. A connector (75) can be attached at the common points. The traces are separated from each other by lateral displacement in a single plane. If the backplane is a multi-layered printed circuit board, the traces are separated from each other by vertical displacement between the layers of the printed circuit board or by both vertical and horizontal displacement. The traces to the connectors nearest the common points (83) have a minimum length (96) greater than the distance (92) between the nearest connectors and the common points.

    Contact assembly
    277.
    发明公开
    Contact assembly 失效
    联系组装

    公开(公告)号：EP0461702A1

    公开(公告)日：1991-12-18

    申请号：EP91201354.7

    申请日：1991-06-04

    Applicant: FRAMATOME CONNECTORS BELGIUM N.V.

    Inventor： Schoss, Udo Hermann ,  Morlion, Danny Louis Cornelis

    IPC: H01R23/68 ,  H01R13/03

    CPC classification number: H05K1/118 ,  H01R12/721 ,  H01R12/737 ,  H01R13/03 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/365 ,  H05K2201/0311 ,  H05K2201/044 ,  H05K2201/09172 ,  H05K2203/302

    Abstract: A contact assembly with at least one signal contact and at least one ground contact, in particular for use in a connector or the like, comprises a support of resilient conductive material, an insulating intermediate layer provided on the support and at least one signal conductor supported on the insulating intermediate layer. The support is used as ground conductor and two or more adjacent contact pads are provided for each signal conductor or each group of signal conductors adjacent a first edge of the support. One contact pad is connected with the support and the other contact pad(s) is (are) connected to the respective signal conductors.

    Abstract translation: 具有至少一个信号触头和至少一个接地触头的触头组件，特别是用于连接器等中的触头组件包括弹性导电材料的支撑件，设置在支撑件上的绝缘中间层和支撑的至少一个信号导线 在绝缘中间层上。 该支架被用作接地导体，并且为每个信号导体或与支架的第一边缘相邻的每组信号导体提供两个或更多个相邻接触垫。 一个接触垫与支座连接，另一个接触垫连接到相应的信号导体。

    Bus structure
    278.
    发明公开
    Bus structure 失效
    总线结构

    公开(公告)号：EP0403288A3

    公开(公告)日：1991-05-22

    申请号：EP90306520.9

    申请日：1990-06-14

    Applicant: GRAPHICO CO. LTD.

    Inventor： Takashima, Tokuhei

    IPC: G06F13/40 ,  G06F1/16 ,  H05K7/14

    CPC classification number: H05K1/0228 ,  G06F13/409 ,  H05K1/0245 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/097

    Abstract: Disclosed is a radial type of parallel system bus structure using bus wire-printed disks (15) each having printed signal conductors (7) of equal length extending radially from a common contact centre . Each printed signal conductor comprises two twisted conductor lines, and each conductor line consists of many segments disposed alternately on opposite surfaces of the disk, the successive segments of each line being connected by plating in through-holes(10) in the disk. The radial arrangement of signal conductors permits connection of selected CPU boards via equal length of signal path. Also, the use of twisted conductor lines improves the signal transmission characteristics of the bus in high-frequency range.

    Bus structure
    280.
    发明公开
    Bus structure 失效
    Busstruktur。

    公开(公告)号：EP0403288A2

    公开(公告)日：1990-12-19

    申请号：EP90306520.9

    申请日：1990-06-14

    Applicant: GRAPHICO CO. LTD.

    Inventor： Takashima, Tokuhei

    IPC: G06F13/40 ,  G06F1/16 ,  H05K7/14

    CPC classification number: H05K1/0228 ,  G06F13/409 ,  H05K1/0245 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/097

    Abstract: Disclosed is a radial type of parallel system bus structure using bus wire-printed disks (15) each having printed signal conductors (7) of equal length extending radially from a common contact centre . Each printed signal conductor comprises two twisted conductor lines, and each conductor line consists of many segments disposed alternately on opposite surfaces of the disk, the successive segments of each line being connected by plating in through-holes(10) in the disk. The radial arrangement of signal conductors permits connection of selected CPU boards via equal length of signal path. Also, the use of twisted conductor lines improves the signal transmission characteristics of the bus in high-frequency range.

    Abstract translation: 公开了使用总线丝印盘（15）的径向类型的并行系统总线结构，每个盘具有从公共接触中心径向延伸的相等长度的印刷信号导体（7）。 每个印刷信号导体包括两条扭绞导体线，每条导线由交替设置在盘的相对表面上的许多部分组成，每条线的连续部分通过电镀连接在盘中的通孔（10）中。 信号导体的径向布置允许通过等长的信号路径连接选定的CPU板。 而且，采用双绞线改善了总线在高频范围内的信号传输特性。

Patent Agency Ranking