公开(公告)号：US4725504A

公开(公告)日：1988-02-16

申请号：US18346

申请日：1987-02-24

Applicant: Philip D. Knudsen ,  Daniel P. Walsh

Inventor： Philip D. Knudsen ,  Daniel P. Walsh

IPC: B32B15/088 ,  C23C18/20 ,  C23C18/34 ,  C25D5/56 ,  H05K3/02 ,  H05K3/18 ,  H05K3/38 ,  B32B15/08

CPC classification number: H05K3/181 ,  H05K3/38 ,  H05K3/381 ,  H05K2201/0154 ,  H05K2201/0344 ,  H05K2203/122 ,  H05K3/022 ,  Y10T428/12722 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: One or both surfaces of a uniformly and completely textured polyimide sheet are coated with a layer of electroless nickel or cobalt and a subsequent layer of electrolytically applied copper yielding an adhesiveless laminate useful in the production of electronic circuitry. The copper and nickel or cobalt layers are strongly bonded to the textured polyimide sheet to the extent that the laminate exceeds bond strength requirements as measured by current standard peel strength tests of the Institute for Interconnecting and Packaging Electronic Circuits (IPC) for both initial and post solder float adhesion.

公开(公告)号：US3953664A

公开(公告)日：1976-04-27

申请号：US518219

申请日：1974-10-25

Applicant: Eiichi Tsunashima

Inventor： Eiichi Tsunashima

IPC: H01R12/51 ,  H05K1/09 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K1/18

CPC classification number: H05K3/0094 ,  H05K3/4069 ,  H05K1/095 ,  H05K2201/012 ,  H05K2201/0344 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/0979 ,  H05K2201/09981 ,  H05K2203/1453 ,  H05K3/3447 ,  H05K3/429

Abstract: An improved printed circuit board has an electrically insulating board which is made of a base containing synthetic resin, and has at least two conductors, one conductor being on one surface of said circuit board and the other conductor being on the opposite surface of the circuit board. At least one hole extends therethrough, and a conductive layer extends through the hole and covers at least part of the surface of the conductors for connecting the conductors on both surfaces of the circuit board through said hole. A filler composed of electrically insulating resin fills the hole and covers the surface of the layer for providing a highly reliable electrical connection between the two conductors on both surfaces of the circuit board.

Abstract translation: 改进的印刷电路板具有由包含合成树脂的基底制成的电绝缘板，并且具有至少两个导体，一个导体位于所述电路板的一个表面上，另一个导体位于电路板的相对表面上 。 至少一个孔延伸穿过其中，并且导电层延伸穿过孔并且覆盖导体表面的至少一部分，用于通过所述孔连接电路板的两个表面上的导体。 由电绝缘树脂构成的填料填充孔并覆盖层的表面，以在电路板的两个表面上的两个导体之间提供高度可靠的电连接。

公开(公告)号：US3854973A

公开(公告)日：1974-12-17

申请号：US28095672

申请日：1972-08-16

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  INNES W ,  MERSEREAU M ,  RHODENIZER H

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  C23C3/00

CPC classification number: H05K3/381 ,  C23C18/1605 ,  C23C18/2086 ,  H05K3/062 ,  H05K3/108 ,  H05K3/181 ,  H05K2201/0344 ,  H05K2203/0783 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31957

Abstract: Substrates are disclosed for use in forming printed circuit boards by the additive process, in which the surface of the substrate is contacted with a particular class of solvents, activated for electroless deposition of the metal thereon, and at one or more points in the process the board is heated or baked.

Abstract translation: 公开了用于通过添加方法形成印刷电路板的基板，其中基板的表面与特定类别的溶剂接触，用于在其上无电沉积金属，并且在该过程的一个或多个点处 板被加热或烘烤。

公开(公告)号：US3679472A

公开(公告)日：1972-07-25

申请号：US3679472D

申请日：1970-07-16

Applicant: WESTERN ELECTRIC CO

Inventor： CROSBY GERALD E ,  SHANEFIELD DANIEL J

IPC: H01B1/00 ,  H01L49/02 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  B44D1/18

CPC classification number: H05K3/181 ,  C23C18/1603 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1689 ,  H01B1/00 ,  H01L49/02 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/245 ,  H05K2201/0338 ,  H05K2201/0344 ,  H05K2203/121

Abstract: THE BOND BETWEEN A METAL FILM AND A SUBSTRATE IS INCREASED BY EMPLOYING AN INTERMEDIATE LAYER WHICH EFFECTS A TENACIOUS BOND TO THE SUBSTRATE. THE PROPENSITY OF SUCH AN INTERMEDIATE LAYER TO BE EXTREMELY DIFFICULT, IF NOT IMPOSSIBLE, TO ETCH WITHOUT DELETERIOUSLY DAMAGING THE FILM IS ELIMINATED BY USING A DISCONTINUOUS INTERMEDIATE LAYER. ELECTROPLATING OF THE METAL FILM IS FACILITRATED BY DEPOSITING A CONTINUOUS CONDUCTIVE COATING WHICH CAN BE ETCHED WITHOUT DELETERIOUS DAMAGE TO THE METAL FILM ONTO THE DISCONTINUOUS INTERMEDIATE LAYER.

公开(公告)号：US3288639A

公开(公告)日：1966-11-29

申请号：US41603364

申请日：1964-12-04

Applicant: XEROX CORP

Inventor： SMITH FREDERICK HENRY JR

IPC: H01B1/00 ,  H01L49/02 ,  H05K1/16 ,  H05K3/10 ,  H05K3/18

CPC classification number: H05K1/167 ,  H01B1/00 ,  H01L49/02 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0326 ,  H05K2201/0344 ,  H05K2203/0165 ,  H05K2203/0315 ,  H05K2203/1105 ,  H05K2203/121 ,  H05K2203/1536

公开(公告)号：US2830918A

公开(公告)日：1958-04-15

申请号：US38928853

申请日：1953-10-30

Applicant: MOTOROLA INC

Inventor： ZIMMERMAN JACK J

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42

CPC classification number: H05K3/426 ,  H05K3/108 ,  H05K3/181 ,  H05K3/282 ,  H05K3/3489 ,  H05K2201/0344 ,  H05K2203/075 ,  Y10S428/901 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/31714

公开(公告)号：US2585752A

公开(公告)日：1952-02-12

申请号：US2931748

申请日：1948-05-26

Applicant: SPRAGUE ELECTRIC CO

Inventor： DORST STANLEY O

IPC: H01B1/00 ,  H01G4/28 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/34

CPC classification number: H05K3/3468 ,  H01B1/00 ,  H01G4/28 ,  H05K1/0306 ,  H05K3/067 ,  H05K3/108 ,  H05K2201/0305 ,  H05K2201/0344 ,  Y10T29/435

公开(公告)号：JP6240342B2

公开(公告)日：2017-11-29

申请号：JP2016559558

申请日：2015-04-09

Applicant: クアルコム,インコーポレイテッド

Inventor： ホウサム・ワフィク・ジョマ ,  オマー・ジェームズ・ブチール ,  チン−クァン・キム

IPC: H05K3/10 ,  H01L23/12 ,  H01L23/32 ,  H05K1/02

CPC classification number: H05K1/112 ,  H01L23/49822 ,  H05K1/0298 ,  H05K3/422 ,  H05K3/425 ,  H05K3/429 ,  H01L2224/16225 ,  H01L23/49827 ,  H01L2924/15311 ,  H05K2201/0344 ,  H05K2201/09036 ,  H05K2201/10378

公开(公告)号：JP2014179638A

公开(公告)日：2014-09-25

申请号：JP2014095177

申请日：2014-05-02

Applicant: Arakawa Chem Ind Co Ltd ,  荒川化学工業株式会社

Inventor： HAMAZAWA AKIHISA ,  NISHIMURA KOJI ,  AIDA HIDEKI

IPC: H05K1/03 ,  C08G73/10 ,  H05K3/18

CPC classification number: H05K1/0277 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/108 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0344 ,  H05K2201/068 ,  Y10T29/49124

Abstract: PROBLEM TO BE SOLVED: To provide a flexible circuit board which is arranged to keep high insulation reliability, to achieve highly tight adhesion of a wiring line, and to have low thermal expandability, and allows a fine circuit to be formed.SOLUTION: A flexible circuit board has a copper circuit formed to have a pattern having a width of 4-18 μm by performing a wiring pattern process, by an electric copper plating method, on a nickel plating layer of a polyimide film with the nickel plating layer which is arranged by stacking at least a nickel plating layer on the polyimide film. The polyimide film has a thermal expansion coefficient of 0-8 ppm/°C in a range of 100-200°C, and the nickel plating layer has a thickness of 0.03-0.3 μm.

Abstract translation: 要解决的问题：提供一种柔性电路板，其布置成保持高绝缘可靠性，以实现布线的高度紧密粘附，并具有低热膨胀性，并且可以形成精细电路。解决方案：柔性 电路板具有通过电镀铜法在具有镀镍层的聚酰亚胺膜的镀镍层上进行布线图案处理而形成具有宽度为4-18μm的图案的铜电路，镀镍层布置在 通过在聚酰亚胺膜上至少层叠镍镀层。 该聚酰亚胺膜的热膨胀系数为0〜8ppm /℃，范围为100〜200℃，镀镍层的厚度为0.03〜0.3μm。

公开(公告)号：JP4668362B2

公开(公告)日：2011-04-13

申请号：JP2010541616

申请日：2010-06-02

Applicant: 古河電気工業株式会社

Inventor： 賢一 大賀 ,  季実子 藤澤

IPC: B32B15/08 ,  C23C18/54

CPC classification number: B32B15/08 ,  B32B2307/3065 ,  B32B2457/00 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/2073 ,  C23C18/40 ,  H05K1/0393 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0344 ,  Y10T428/12569