公开(公告)号：EP0285831A1

公开(公告)日：1988-10-12

申请号：EP88103631.3

申请日：1988-03-08

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Brune, Johannes, Dipl.-Ing. ,  Latussek, Hans-Peter, Dipl.-Ing.

IPC: H05K1/00

CPC classification number: H01R12/7088 ,  H05K1/029 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/10053 ,  H05K2201/10303

Abstract: Die Erfindung bezieht sich auf eine Rückwandleiterplatte (2) mit mehreren parallel nebeneinander auf der den Baugruppen zu­gewandten Seite (4) angeordneten Federleisten (6) und mit wenig­stens einem Bus (30, 32), der wenigstens aus einer Busleitung (34, 36) besteht. Erfindungsgemäß ist einem Buskontaktstift (12, 14) jeder Federleiste (6) eines Busses (30, 32) ein federnder Kontakt (16, 18) auf der den Baugruppen abgewandten Seite (10) der Rückwandleiterplatte (2) angebracht, wobei jeweils der dem Buskontaktstift (12, 14) jeder Federleiste (6) benachbarte Kon­taktstift (22, 20) des federnden Kontaktes (16, 18) elektrisch leitend mit dem zugeordneten Buskontaktstift (12, 14) verbunden ist, sind der zweite Kontaktstift (20, 22) jedes federnden Kon­taktes (16, 18) mittels der Busleitung (34, 36) miteinander elektrisch leitend verbunden und ist die Kontaktierung jedes federnden Kontaktes (16, 18) mittels eines Handhabungsmittels (24) steuerbar ist. Somit können Baugruppen von einem baugrup­penübergreifenden Bus (30, 32) abgetrennt werden, ohne dabei diese Baugruppen aus ihren Steckplätzen eines Baugruppenträgers herausziehen zu müssen.

Abstract translation: 本发明涉及一种具有由侧的侧并行布置（4）的组件面朝多个侧的背板印刷电路板（2）的板条（6）和与至少一个总线（30，32）的至少一条总线线路（34，36）的 ， 根据本发明的一个总线的每个插座连接器（6）的一总线触点（12，14）（30,32），其安装，上侧的弹性接触（16,18）远离所述背板印刷电路板（2）的组装侧（10），其特征在于每个汇流接触的 （12，14）的弹性接触（16,18）的每个插座连接器（6）相邻的接触销（22，20）的导电连接到相关联的总线触点（12，14）连接到所述第二接触销（20,22）分别弹性 接触（16，18）通过总线（34，36）的装置被导电地连接，并且每个弹性接触（16,18）的通过操纵装置的装置的接触（24）是可控的。 因此，一个组件跨总线（30，32）的子组件是分开的，而不需要在机架中拉从槽中这些组件。

公开(公告)号：EP0229503A2

公开(公告)日：1987-07-22

申请号：EP86309758.0

申请日：1986-12-15

Applicant: TRW INC.

Inventor： Damerow, Milton Frank ,  Kocin, Michael Joseph

IPC: H05K1/14 ,  H05K1/00 ,  H05K3/36

CPC classification number: H01R12/722 ,  H01R12/73 ,  H01R12/79 ,  H01R12/91 ,  H05K1/144 ,  H05K2201/044

Abstract: A dual printed circuit board module having two printed circuit boards mounted in an inwardly facing relationship on two thermal frame members that also function as structural and enclosing members. A connector mounted between and at one edge of the thermal frame members serves to establish electrical connections between the circuit boards and a backplane circuit panel to which the boards are to be connected. A flexible interconnect circuit, located near the same edge of the boards as the backplane connector, is used both to connect the boards to the connector and to provide board- to-board connections independently of the connector. This arrangement greatly facilitates assembly and testing of the module, reduces signal path lengths, and enhances the structural and thermal integrity of the module.

公开(公告)号：EP0027047B1

公开(公告)日：1986-09-10

申请号：EP80303504.7

申请日：1980-10-03

Applicant: UNIVERSITY COLLEGE LONDON

Inventor： Borrill, Paul Lindsey

IPC: H05K1/00 ,  H05K9/00 ,  H05K3/46

CPC classification number: H05K1/0219 ,  H05K9/0039 ,  H05K2201/044 ,  H05K2201/09236

公开(公告)号：EP0098295B1

公开(公告)日：1986-08-20

申请号：EP83900514.7

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT, Kenneth Wayne ,  MASSEY, Edwin Michael

IPC: H01B7/08 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G5/005 ,  H05K1/0263 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: A backplane power distribution system for making connections to the power planes of a computer system and having the capability of handling very high levels of current. This is achieved with a stepped backplane construction (17b-e). For example, in a multiple layer system having, in order, a first conductive layer (10a), a first dielectric layer (12a, 12b), a second conductive layer (10b), a second dielectric layer (12bc), and so on, each successive conductive and dielectric layers extend transversely beyond the preceding layers to present a substantial exposed area on all but the first conductive layer (17b-e). Typically, rectangular metal bus bars (not shown) are bolted to the backplane using plated through holes (20b-e) to make contact with the exposed areas (17b-e). Holes through the layers are provided and prepared such that each hole (15, 20 and 22) may make contact with a particular conductive layer as desired or in the case of ground with all ground conductive layers. Conductive layers (10a) and (10i) may be used as signal layers utilizing traces (14) and holes (15) while layers (10b-h) are so-called power planes.

公开(公告)号：EP0114175A3

公开(公告)日：1986-07-23

申请号：EP83104870

申请日：1983-05-17

Applicant: Siemens Aktiengesellschaft

Inventor： Wessely, Herrmann, Dipl.-Ing. ,  Hatheier, Reinhard

IPC: H05K07/02

CPC classification number: H05K1/0263 ,  H05K1/0262 ,  H05K1/141 ,  H05K7/02 ,  H05K2201/044 ,  H05K2201/10272

公开(公告)号：EP0098295A4

公开(公告)日：1984-04-24

申请号：EP83900514

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT KENNETH WAYNE ,  MASSEY EDWIN MICHAEL

IPC: H01B7/00 ,  H02G5/00 ,  H05K1/02 ,  H05K3/32 ,  H05K3/42 ,  H05K3/46 ,  H01B7/08 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G5/005 ,  H05K1/0263 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: A backplane power distribution system for making connections to the power planes of a computer system and having the capability of handling very high levels of current. This is achieved with a stepped backplane construction (17b-e). For example, in a multiple layer system having, in order, a first conductive layer (10a), a first dielectric layer (12a, 12b), a second conductive layer (10b), a second dielectric layer (12bc), and so on, each successive conductive and dielectric layers extend transversely beyond the preceding layers to present a substantial exposed area on all but the first conductive layer (17b-e). Typically, rectangular metal bus bars (not shown) are bolted to the backplane using plated through holes (20b-e) to make contact with the exposed areas (17b-e). Holes through the layers are provided and prepared such that each hole (15, 20 and 22) may make contact with a particular conductive layer as desired or in the case of ground with all ground conductive layers. Conductive layers (10a) and (10i) may be used as signal layers utilizing traces (14) and holes (15) while layers (10b-h) are so-called power planes.

Abstract translation: 背板配电系统，用于连接计算机系统的电源层，并具有处理非常高电流的能力。 这是通过阶梯背板结构（17b-e）实现的。 例如，在依次具有第一导电层（10a），第一电介质层（12a，12b），第二导电层（10b），第二电介质层（12bc）等的多层系统 每个连续的导电层和电介质层横向延伸超过前面的层，以在除了第一导电层（17b-e）之外的所有层上呈现实质的暴露区域。 典型地，使用镀通孔（20b-e）将矩形金属汇流条（未示出）螺栓连接到底板以与暴露区域（17b-e）接触。 提供并制备穿过层的孔，使得每个孔（15,20和22）可以根据需要与特定导电层接触，或者在所有接地导电层接地的情况下。 导电层（10a）和（10i）可以用作迹线（14）和孔（15）的信号层，而层（10b-h）是所谓的电源平面。

公开(公告)号：EP0098295A1

公开(公告)日：1984-01-18

申请号：EP83900514.0

申请日：1983-01-12

Applicant: ELXSI

Inventor： HOLBERT, Kenneth Wayne ,  MASSEY, Edwin Michael

IPC: H01B7 ,  H02G5 ,  H05K3 ,  H05K1

CPC classification number: H02G5/005 ,  H05K1/0263 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: Système de distribution d'alimentation par arrière-plan permettant d'établir des connexions entre les plans d'alimentation d'un système d'ordinateur et pouvant supporter des courants de niveau très élevé. Ceci est obtenu grâce à une construction d'arrière-plans en échelon (17b-e). Par exemple, dans un système multicouches possédant, dans l'ordre, une première couche conductrice (10a), une première couche diélectrique (12ab), une deuxième couche conductrice (10b), une deuxième couche diélectrique (12bc, etc.), chacune des couches conductrices et diélectriques successives s'étend transversalement au-delà des couches précédentes pour présenter une zone exposée considérable sur toutes les couches conductrices à l'exception de la première (17b-e). Généralement, des barres de bus métalliques rectangulaires (non illustrées) sont boulonnées aux arrière-plans en utilisant des trous traversants plaqués (20b-e) afin d'établir le contact avec les zones exposées (17b-e). Les trous traversant les couches sont obtenus et préparés de manière que chaque trou (15, 20 et 22) soit en contact avec une couche conductrice particulière désirée ou dans le cas d'une mise à la terre avec toutes les couches conduisant à la terre. Les couches conductrices (10a et 10i) peuvent être utilisées comme couches de signaux utilisant des tracés (14) et des trous (15) tandis que les couches (10b-h) sont appelées plans d'alimentation.

公开(公告)号：EP2822372B1

公开(公告)日：2016-09-14

申请号：EP13175312.1

申请日：2013-07-05

Applicant: Pentair Technical Solutions GmbH

Inventor： Dizel, Sergej ,  Mann, Dietmar ,  Gauges, Dietmar ,  Müller, Jochen

IPC: H05K7/14 ,  H05K1/14

CPC classification number: H05K5/0256 ,  H05K1/144 ,  H05K7/1427 ,  H05K7/1445 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y10T29/53183

公开(公告)号：EP2945470A4

公开(公告)日：2016-05-04

申请号：EP13874793

申请日：2013-08-07

Applicant: HUAWEI TECH CO LTD

Inventor： BAI LEI ,  LIU XIONGBIAO ,  PENG LEXIONG

IPC: H01R12/73 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K3/366 ,  H01R12/722 ,  H01R12/737 ,  H05K1/117 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/09163 ,  H05K2201/10189

公开(公告)号：EP2836058A4

公开(公告)日：2015-03-11

申请号：EP12876061

申请日：2012-10-26

Applicant: HUAWEI TECH CO LTD

Inventor： WANG BAOQI ,  ZHANG GUODONG ,  LIU FANGMING

IPC: H05K7/02 ,  H01R12/00 ,  H04Q1/02

CPC classification number: H01R12/737 ,  H04Q1/15 ,  H05K1/14 ,  H05K3/366 ,  H05K5/0065 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189

Abstract: The present invention is applicable to the field of communications technologies, and provides a perpendicular and orthogonal interconnection system and a communications device. The perpendicular and orthogonal interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group, where the first board group includes a plurality of first boards parallel to each other, and the second board group includes a plurality of second boards parallel to each other; a plurality of curved male connectors is arranged on each of the first boards, a plurality of curved female connectors is arranged on each of the second boards, and the curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence. In the present invention, the curved male connectors and the curved female connectors directly cooperate and are connected. When the perpendicular and orthogonal interconnection system is upgraded, only the board that permanently has the curved male connectors and the curved female connectors needs to be replaced, which is rather simple and shortens a signal link. Based on the foregoing advantages, the perpendicular and orthogonal interconnection system is applicable to various communications devices; therefore, its upgrade is convenient, signal quality is improved, heat dissipation is ideal, and material costs are saved.