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公开(公告)号：KR1020140088988A
公开(公告)日：2014-07-14
申请号：KR1020120158404
申请日：2012-12-31
Applicant: 도레이첨단소재 주식회사
IPC: C09J163/00 , C09J175/04 , C09J7/00 , G06F3/041
CPC classification number: C09J163/00 , C09J7/00 , C09J175/04 , G06F3/0412 , G06F3/044
Abstract: The present invention relates to a solventless transparent adhesive composition which exhibits excellent adhesive properties by obtaining an adhesive with excellent internal cohesiveness and hardness in a thickness direction through a method forming a preparatory cross-linking agent on an adhesive layer and has excellent adhesive properties in a device such as a touch panel for a display by satisfying the coexistence of flexibility and adhesion durability in addition to filling properties in purpose in which steps of an object to be attached exist, and to a manufacturing method thereof. To this end, the solventless transparent adhesive composition and the manufacturing method thereof according to the present invention obtains an adhesive resin by thermoset after mixing a methylene diphenyl diisocyanate derivative and bisphenol A type epoxy diacrylate as a preparatory cross-linking agent, wherein adhesiveness with an object to be attached is 500-1,500 g/inch.
Abstract translation: 本发明涉及一种无溶剂透明粘合剂组合物，其通过在粘合剂层上形成预备交联剂的方法获得具有优异的内部粘结性和厚度方向的硬度的粘合剂而具有优异的粘合性，并且在 以及其制造方法，除了具有附着目标的目的的填充特性以外，还可以通过满足挠性和粘合耐久性的共存性等用于显示器的装置。 为此，根据本发明的无溶剂透明粘合剂组合物及其制造方法在混合亚甲基二苯基二异氰酸酯衍生物和双酚A型环氧二丙烯酸酯作为制备交联剂后，通过热固性获得粘合剂树脂，其中与 要附着的物体是500-1,500克/英寸。
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公开(公告)号：KR101330260B1
公开(公告)日：2013-11-15
申请号：KR1020110134827
申请日：2011-12-14
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 차세대 유연디스플레이(Flexible Display)의 소자로 이용이 가능한 유기박막트랜지스터(OTFT, organic thin film transistor)의 구성 성분 중 게이트절연막의 유기절연체로 이용할 수 있는 신규한 유기절연체 조성물 및 이를 이용한 유기절연막을 함유하는 유기박막트랜지스터에 관한 것으로서, 상기 유기절연체 조성물은 페놀노볼락수지 및 이미다졸 유도체를 포함하여 이루어지는 것을 특징으로 하는데, 상기 페놀노볼락수지 및 이미다졸 유도체는 상호 분자간 수소결합에 의한 복합체(Complex)를 형성하는 것을 특징으로 하며 이러한 복합체를 유기박막트랜지스터의 게이트절연막으로 형성할 경우 소자의 전기적 특성을 향상시키고 요구되는 박막특성을 충족시켜 우수한 소자를 제공할 수 있게 한다.
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公开(公告)号：KR1020120087008A
公开(公告)日：2012-08-06
申请号：KR1020110008425
申请日：2011-01-27
Applicant: 도레이첨단소재 주식회사
IPC: C09J133/04 , C09J7/02 , H01L21/58
CPC classification number: C09J133/04 , C09J7/22 , C09J7/30 , C09J7/38 , C09J7/385 , C09J2201/606 , C09J2203/326 , C09J2205/10 , H01L21/6836 , H01L2221/68327
Abstract: PURPOSE: An adhesive film for back grinding of semiconductor wafer equipped with a surface-protective membrane having excellent cushionability is provided to enhance cutting properties and adhesive properties without damages on a surface protective film or a wafer. CONSTITUTION: An adhesive film for back grinding of semiconductor wafer equipped with a surface-protective membrane having excellent cushionability comprises an adhesive layer(4) which is welded on the semiconductor wafer and is spread on a single-side or both sides of the base film(5). The adhesive layer comprises a first acrylic copolymer having an average molecular weight of 1,200,000-3,000,000, a second acrylic copolymer which has the average molecular weight of 500,000-1,000,000, and a hardener. The adhesive layer is formed from a thermosetting adhesive composition which includes 5-20 parts by weight of the second acrylic copolymer for 100.0 parts by weight of the first acrylic copolymer.
Abstract translation: 目的：提供具有耐冲击性优异的表面保护膜的半导体晶片的背面研磨用粘合膜，以提高切削性和粘合性，而不会对表面保护膜或晶片造成损害。 构成：具有耐冲击性优异的表面保护膜的半导体晶片的背面研磨用粘合膜包括焊接在半导体晶片上并被分散在基膜的单面或两面的粘接层（4） （5）。 粘合剂层包括平均分子量为1,200,000-3,000,000的第一丙烯酸共聚物，平均分子量为500,000-1,000,000的第二丙烯酸共聚物和硬化剂。 粘合剂层由热固性粘合剂组合物形成，该热固性粘合剂组合物包含对于100.0重量份第一丙烯酸共聚物的5-20重量份的第二丙烯酸共聚物。
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公开(公告)号：KR1020110025258A
公开(公告)日：2011-03-10
申请号：KR1020090083241
申请日：2009-09-04
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/02
CPC classification number: C09J7/385 , C09J4/00 , C09J2203/31 , C25D5/02
Abstract: PURPOSE: An adhesive sheet for plating is provided to obtain high dimensional stability, excellent reliability and processability and to prevent the residue from being attached to the surface. CONSTITUTION: An adhesive sheet for plating includes a substrate(1), and an adhesive layer(2) which includes a thermosetting adhesive resin and a thermosetting agent as an adhesive layer formed on at least one side of the substrate. The adhesive sheet further includes an energy-curable acrylic oligomer and an energy beam initiator. The substrate is at least one metal foil selected from foil, alloy foil, and plating foil, wherein the foil is made of aluminum, magnesium, titanium, chrome, manganese, iron, nickel, zinc or tin.
Abstract translation: 目的：提供用于电镀的粘合片以获得高尺寸稳定性，优异的可靠性和加工性，并防止残留物附着在表面上。 构成：用于电镀的粘合片包括基材（1）和粘合剂层（2），该粘合剂层包括热固性粘合剂树脂和热固性剂作为形成在基材的至少一面上的粘合剂层。 粘合片还包括能量可固化的丙烯酸类低聚物和能量束引发剂。 基板是选自箔，合金箔和电镀箔中的至少一种金属箔，其中箔由铝，镁，钛，铬，锰，铁，镍，锌或锡制成。
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公开(公告)号：KR1020100083359A
公开(公告)日：2010-07-22
申请号：KR1020090002702
申请日：2009-01-13
Applicant: 도레이첨단소재 주식회사
IPC: H01L21/302 , H01L21/78 , H01L21/301
CPC classification number: H01L21/6836 , C09J7/22 , C09J2203/326 , C09J2433/00 , H01L21/6835 , H01L2221/68327
Abstract: PURPOSE: A wafer support adhesive film for processing a semiconductor thin film wafer is provided to prevent the damage to a semiconductor wafer by not requiring an additional cleaning process in a separation process. CONSTITUTION: An adhesive film is attached to a circuit formation surface of a semiconductor wafer(W) by using a laminator(16). The semiconductor wafer is thinned by grinding the rear of the semiconductor wafer with a grinder(10). The rear of the semiconductor wafer is fixed to a dicing tape(11). The dicing tape has adhesion and is maintained in a frame(12).
Abstract translation: 目的：提供用于处理半导体薄膜晶片的晶片支撑粘合膜，以通过在分离过程中不需要额外的清洁处理来防止对半导体晶片的损坏。 构成：通过使用层压机（16）将粘合膜附着到半导体晶片（W）的电路形成表面。 通过用研磨机（10）研磨半导体晶片的后部来减薄半导体晶片。 半导体晶片的后部固定在切割胶带（11）上。 切割带具有附着力并保持在框架（12）中。
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Patent Agency Ranking
公开(公告)号：KR1020100073612A
公开(公告)日：2010-07-01
申请号：KR1020080132328
申请日：2008-12-23
Applicant: 도레이첨단소재 주식회사
IPC: C09J11/04
CPC classification number: C09J11/00 , C08K3/32 , C09J9/00 , C09J2205/102
Abstract: PURPOSE: A non-halogen flame retardant adhesive composition for a semiconductor device is provided to obtain excellent non-halogen retardant effect while maintaining properties of the adhesive by making a non-halogen phosphate flame retardant dispersed uniformly within the adhesive. CONSTITUTION: A non-halogen flame retardant adhesive composition for a semiconductor device includes a thermosetting resin, a hardener, a rubber having carbon-carbon double bond, and a non-halogen phosphate-based flame retardant. The non-halogen phosphate-based flame retardant is an energy ray-curable flame retardant compound which contains phosphorous physically or chemically and has an energy ray-curable structure.
Abstract translation: 目的：提供一种用于半导体器件的非卤素阻燃剂粘合剂组合物，以通过使非卤素磷酸酯阻燃剂均匀分散在粘合剂中而保持粘合剂的性能而获得优异的非卤素阻燃效果。 构成：用于半导体器件的非卤素阻燃剂粘合剂组合物包括热固性树脂，硬化剂，具有碳 - 碳双键的橡胶和非卤素磷酸酯类阻燃剂。 无卤素磷酸酯类阻燃剂是能量射线固化型阻燃化合物，其在物理或化学上含有磷并且具有能量射线固化性结构。
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公开(公告)号：KR1020090053062A
公开(公告)日：2009-05-27
申请号：KR1020070119697
申请日：2007-11-22
Applicant: 도레이첨단소재 주식회사
Abstract: 본 발명은 다이싱·다이본드용 점착테이프에 관한 것으로서, 보다 상세하게는 다이싱테이프가 따로 필요하지 않으며, 접착필름에 페녹시 골격을 함유한 에폭시 수지와 에너지선 중합형 화합물의 첨가로 자외선 경화함에 따라 다이의 픽업성능이 향상되고, 접착특성이 우수한 다이싱·다이본드용 점착테이프에 관한 것이다. 이를 위해 본 발명에 따른 다이싱·다이본드용 점착테이프는 반도체 다이싱 및 다이본딩에 사용되는 다이본드용 점접착테이프에 있어서, 기재와 그 위에 형성된 점접착제층을 포함하되, 상기 점접착제층은 (A)점착성분, (B)에폭시수지, (C)경화제, (D)잠재성 경화촉진제, (E)에너지선 경화형 올리고머 및 (F)광개시제를 포함하며, 상기 (B)에폭시수지는 페녹시 골격을 포함하는 에폭시 수지인 것을 특징으로 한다.
다이싱, 다이본드, 점착테이프, 점접착제층, 에폭시수지, 페녹시 골격-
公开(公告)号：KR100845978B1
公开(公告)日：2008-07-11
申请号：KR1020070040263
申请日：2007-04-25
Applicant: 도레이첨단소재 주식회사
CPC classification number: H01L21/6836 , H01L21/566 , H01L2221/68327
Abstract: An adhesion tape for semiconductor dicing is provided to prevent generation of a burr on a substrate due to high speed blade when dicing a semiconductor chip and prevent contamination of the semiconductor chip. A base film includes an inner layer formed by mixing polypropylene(2) of 20 to 30 wt% and ethylene-based rubber-propylene compound(3) of 70 to 80 wt%. The ethylene-based rubber-propylene compound is dispersed in a matrix of the polypropylene. The base film has a thickness of 25 to 200 mum, and the inner layer has a thickness of a quarter as thick as the thickness of the base film. The base film has an outer layer(1) of polypropylene.
Abstract translation: 提供了用于半导体切割的粘合带，用于当切割半导体芯片并防止半导体芯片的污染时，防止由于高速刀片而在基板上产生毛刺。 基膜包括通过混合20〜30重量％的聚丙烯（2）和70〜80重量％的乙烯系橡胶 - 丙烯化合物（3）而形成的内层。 乙烯类橡胶 - 丙烯化合物分散在聚丙烯的基质中。 基膜的厚度为25〜200μm，内层的厚度为基膜的厚度的四分之一。 基膜具有聚丙烯的外层（1）。
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公开(公告)号：KR101786085B1
公开(公告)日：2017-10-17
申请号：KR1020110031225
申请日：2011-04-05
Applicant: 도레이첨단소재 주식회사
IPC: C09J179/08 , C09J11/00 , C09J183/10 , C09J7/02
Abstract: 본발명은반도체장치용접착제조성물및 이를이용한접착필름에관한것이다. 보다상세하게는폴리이미드(Polyimide) 수지; 및상기폴리이미드수지 100 중량부대비 0.1 내지 80 중량부범위의벤즈옥사진 (Benzoxazine) 수지를포함하는반도체장치용접착제조성물; 및상기접착제조성물로부터형성되고, 유리전이온도(T)가 130 내지 200℃범위인접착제층을포함하는접착필름에관한것이다. 본발명의반도체장치용접착제조성물은산 이무수물과디아민및/또는디이소시아네이트로부터얻어지는폴리이미드수지와벤즈옥사진수지를포함함으로써접착필름의테이핑작업온도를낮추면서도우수한신뢰성을유지할수 있다.
Abstract translation: 本发明涉及用于半导体器件的粘合剂组合物和使用其的粘合剂膜。 更具体地说，本发明涉及聚酰亚胺树脂; 并且相对于100重量份聚酰亚胺树脂，苯并恶嗪树脂为0.1〜80重量份; 以及由该粘合剂组合物形成并且具有130-200范围内的玻璃化转变温度（T）的粘合剂层。 通过包括聚酰亚胺树脂和同时降低粘接膜的贴胶带操作温度能够维持优异的可靠性从酸二酐和二胺和/或二异氰酸酯而得到的苯并恶嗪树脂用于本发明的半导体器件的粘合剂组合物。
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公开(公告)号：KR101571160B1
公开(公告)日：2015-11-23
申请号：KR1020130110455
申请日：2013-09-13
Applicant: 도레이첨단소재 주식회사
IPC: C09J7/00 , C09J163/00 , C09J11/00
Abstract: 본발명은디스플레이용투명접착필름에관한것으로서, 보다상세하게는종래의아크릴중합체에비해수증기투과율이현저히낮고, 투명성및 내습열안정성이우수하며, 금속혹은금속산화물로이루어진도전막의부식을방지할수 있는디스플레이용투명접착필름에관한것이다.
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