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公开(公告)号：KR1020130105313A
公开(公告)日：2013-09-25
申请号：KR1020130000946
申请日：2013-01-04
Applicant: 삼성전자주식회사
CPC classification number: H01L24/96 , H01L21/568 , H01L2224/04105 , H01L2224/19 , H01L2224/73267 , H01L2224/92244 , H01L2224/94
Abstract: PURPOSE: A light emitting device package and a method for manufacturing the same are provided to effectively release heat by directly connecting the light emitting device package to a line pattern instead of mounting the light emitting device package on a circuit substrate. CONSTITUTION: A light emitting laminate includes a first main surface and a main surface. A terminal part (20) is formed under the second main surface. A mold (30) is formed under the second main surface. The mold exposes a part of the terminal part. A wavelength converting part (40) is formed on the first main surface.
Abstract translation: 目的：提供发光器件封装及其制造方法，以通过将发光器件封装直接连接到线图案来有效地释放热量，而不是将发光器件封装安装在电路基板上。 构成：发光层叠体包括第一主表面和主表面。 端子部分（20）形成在第二主表面之下。 模具（30）形成在第二主表面下方。 模具露出端子部分的一部分。 波长转换部分（40）形成在第一主表面上。
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公开(公告)号：KR1020110136676A
公开(公告)日：2011-12-21
申请号：KR1020100102419
申请日：2010-10-20
Applicant: 삼성전자주식회사
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2924/01322 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L33/502 , H01L33/0083 , H01L33/56 , H01L33/58 , H01L33/62 , H01L2933/0033 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting device package using a quantum dot, a lighting apparatus, and a display apparatus are provided to easily control a color coordinate by controlling the particle size and concentration of a quantum dot. CONSTITUTION: A pair of lead frames(102a,102b) is electrically connected to a light emitting device(101) through a conductive wire(W). A package body(103) fixes a pair of lead frames. A sealing member(104) is arranged on the top of the light emitting device. A transparent sealing member(106) protects the light emitting device and the conductive wire. A wavelength converter(105) includes a quantum dot.
Abstract translation: 目的：提供使用量子点的发光器件封装，照明装置和显示装置，以通过控制量子点的粒径和浓度来容易地控制色坐标。 构成：一对引线框架（102a，102b）通过导线（W）与发光器件（101）电连接。 包装体（103）固定一对引线框架。 密封构件（104）布置在发光器件的顶部。 透明密封构件（106）保护发光装置和导线。 波长转换器（105）包括量子点。
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公开(公告)号：KR1020100058779A
公开(公告)日：2010-06-04
申请号：KR1020080117310
申请日：2008-11-25
Applicant: 삼성전자주식회사
IPC: H01L33/52
CPC classification number: H01L33/62 , H01L24/45 , H01L24/48 , H01L24/97 , H01L33/486 , H01L33/56 , H01L2224/45139 , H01L2224/48091 , H01L2224/4824 , H01L2224/97 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: PURPOSE: A light emitting diode package and a manufacturing method thereof are provided to improve light emission efficiency by coating fluorescent material directly on the surface of the light emitting diode device. CONSTITUTION: An LED chip(120) is mounted on the upper part of a substrate(110). A molding material(130) is spread on the top of the substrate including the external surface of the LED chip. An encapsulating material(140) is spread on the lower part of substrate. A through hole is formed on the central part of the substrate. The LED chip is settled on the upper part of the penetration hole. The substrate is composed of the light transmitting quality.
Abstract translation: 目的：提供一种发光二极管封装及其制造方法，以通过直接在发光二极管器件的表面上涂布荧光材料来提高发光效率。 构成：将LED芯片（120）安装在基板（110）的上部。 成型材料（130）被扩散在包括LED芯片的外表面的基板的顶部上。 封装材料（140）扩散在基板的下部。 在基板的中央部形成有通孔。 LED芯片沉入穿孔的上部。 基板由透光质量组成。
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公开(公告)号：KR1020140034496A
公开(公告)日：2014-03-20
申请号：KR1020120100874
申请日：2012-09-12
Applicant: 삼성전자주식회사
CPC classification number: H01L33/60 , H01L33/46 , H01L33/483 , H01L33/50 , H01L33/505
Abstract: A light emitting device package according to an embodiment of the present invention includes: a base having at least one recess; at least one light emitting device mounted inside the recess; and a reflection wall filling the space between the recess and the light emitting device to enclose a side surface of the light emitting device, wherein the recess can be formed with a height range of +20% to -20% of the height of the light emitting device.
Abstract translation: 根据本发明的实施例的发光器件封装包括：具有至少一个凹部的基座; 安装在所述凹部内的至少一个发光器件; 以及填充所述凹部和所述发光装置之间的空间以包围所述发光装置的侧表面的反射壁，其中所述凹部可以形成为所述光的高度的+ 20％至-20％的高度范围 发光装置。
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Patent Agency Ranking
公开(公告)号：KR1020120095573A
公开(公告)日：2012-08-29
申请号：KR1020110014975
申请日：2011-02-21
Applicant: 삼성전자주식회사
IPC: G06F13/14 , G06F13/42 , G06F15/163 , H04L29/06 , H04N21/436 , H04N21/63
CPC classification number: H04L67/325 , H04L69/08 , H04N21/43615 , H04N21/631 , G06F13/14 , G06F13/42 , G06F15/163
Abstract: PURPOSE: A data sharing system and method thereof are provided to personalize data sharing between apparatuses by sharing the data between apparatuses including heterogeneous transmission protocols. CONSTITUTION: A hub apparatus(210) receives data from a first client apparatus which provides the data using a first transmission protocol, a second client apparatus which receives the data, and the first client apparatus. The hub apparatus transmits the data to the second client apparatus using the second transmission protocol. The first and the second transmission protocol are different from each other or are the same. The hub apparatus receives the data from the first client apparatus using the first transmission protocol according to a registered schedule and transmits the data to the second client apparatus using the second transmission protocol.
Abstract translation: 目的：提供数据共享系统及其方法，通过共享包括异构传输协议的设备之间的数据来个性化设备之间的数据共享。 构成：集线装置（210）从使用第一传输协议提供数据的第一客户端设备接收数据，接收数据的第二客户端设备和第一客户端设备。 集线器设备使用第二传输协议向第二客户端设备发送数据。 第一和第二传输协议彼此不同或相同。 集线装置使用第一传输协议根据注册的时间表从第一客户机装置接收数据，并使用第二传输协议将数据发送到第二客户端装置。
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公开(公告)号：KR1020120082714A
公开(公告)日：2012-07-24
申请号：KR1020110004162
申请日：2011-01-14
Applicant: 삼성전자주식회사
IPC: C09J7/02 , C09J201/00 , C09J11/04 , H01L33/00
CPC classification number: H01L33/62 , F21V21/0808 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/83 , H01L25/0753 , H01L33/0095 , H01L2224/27436 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32245 , H01L2224/83191 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/12041 , H01L2933/0066 , H01L2924/00 , H01L2924/00014 , H01L2924/05432 , H01L2924/0543 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , C09J7/29 , C09J7/22 , C09J7/381 , C09J11/04 , C09J201/00 , C09J2201/16 , C09J2203/326 , C09J2205/10 , C09J2205/30 , H01L33/0004 , H01L33/005
Abstract: PURPOSE: An adhesive film for electroluminescent device and a manufacturing method of electroluminescent diode package are provided to minimize light loss of light emitting device and increasing luminance value of the light emitting device. CONSTITUTION: An adhesive film for electroluminescent device comprises double-sided adhesive layer(40) which is for attaching the electrode to the lower surface and the light emitting device to the upper surface, UV curing layer(30) which is attached to one side of the bonding layer, and upper/lower cover layers(10,20) which are attached to exposed surface of the UV curing layer and the adhesive layer. The light emitting device is electroluminescence diode chips. The bonding layer is thermosetting resin including silicone, rubber based, acrylate based, silicone based, epoxy based, vinyl based resin, or a mixture thereof, or an inorganic material having a high optical permeability.
Abstract translation: 目的：提供一种用于电致发光器件的粘合剂膜和电致发光二极管封装的制造方法，以使发光器件的光损耗最小化并且增加发光器件的亮度值。 构成：用于电致发光器件的粘合膜包括用于将电极附着到下表面的双面粘合剂层（40）和发光器件到上表面的UV固化层（30），UV固化层 粘合层和附着在UV固化层和粘合剂层的暴露表面上的上/下覆盖层（10,20）。 发光器件是电致发光二极管芯片。 粘结层是包括硅酮，橡胶基，丙烯酸酯基，硅酮基，环氧基，乙烯基树脂或其混合物的热固性树脂或具有高透光性的无机材料。
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28.发明公开형광체 필름, 이의 제조방법, 형광층 도포 방법, 발광소자 패키지의 제조방법 및 발광소자 패키지 有权磷光体膜，其制造方法，在LED芯片上涂覆磷光体层的方法，制造LED封装的方法和其制造的LED封装
公开(公告)号：KR1020120019385A
公开(公告)日：2012-03-06
申请号：KR1020110083886
申请日：2011-08-23
Applicant: 삼성전자주식회사
CPC classification number: B32B3/10 , B32B3/08 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L33/50 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2933/0041 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A phosphor film, a manufacturing method thereof, a method for coating a phosphor layer, a method for manufacturing an LED package, and an LED package manufactured thereby are provided to prevent a wire from being deformed even if the wire is coated on a wire-bonded light emitting diode chip. CONSTITUTION: A phosphor film(100) comprises a base film(110), a phosphor layer(130), and a cover film(150). The phosphor layer is formed on the base film and mixes a phosphor particle with a resinous material hardened partially. The cover film is formed in order to protect the phosphor layer on the phosphor layer. The phosphor layer is in a semi-hardening state at room temperature. A variable phase change is generated when the phosphor layer is heated.
Abstract translation: 目的：提供荧光体膜，其制造方法，荧光体层的涂布方法，制造LED封装的方法以及由此制造的LED封装，以防止电线即使将电线涂覆在电线上而变形 导线发光二极管芯片。 构成：荧光体膜（100）包括基膜（110），荧光体层（130）和覆盖膜（150）。 荧光体层形成在基膜上，并将荧光体颗粒与部分硬化的树脂材料混合。 形成覆盖膜以保护磷光体层上的磷光体层。 荧光体层在室温下处于半硬化状态。 当荧光体层被加热时产生可变的相变。
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公开(公告)号：KR1020110091210A
公开(公告)日：2011-08-11
申请号：KR1020100010927
申请日：2010-02-05
Applicant: 삼성전자주식회사
Abstract: PURPOSE: Device and method for evaluating optical characteristic of an LED chip and a method of manufacturing an LED device are provided to reduce color dispersion of an LED device emitting a particular color of light including white and increase manufacturing yield of an LED device emitting a particular color of light. CONSTITUTION: A device(100) for evaluating optical characteristic of an LED chip comprises light converting filters(151,152), which convert monochromatic light emitting from an LED chip(50), for example blue light or ultraviolet light, into other wavelength of color and emits white light. White light emitting from the light converting filters is received by a unit for measuring optical characteristic, thus the optical characteristic of the white light is measured. The optical characteristic measuring unit can comprises a photodiode sensor(130) measuring luminous energy and a spectrometer(140) measuring spectrum.
Abstract translation: 目的：提供用于评估LED芯片的光学特性的装置和方法以及制造LED装置的方法，以减少发射包括白色的特定颜色的LED的LED装置的色散，并且增加发射特定的LED的LED装置的制造成品率 光的颜色 构成：用于评估LED芯片的光学特性的设备（100）包括光转换滤光器（151,152），其将从LED芯片（50）发射的单色光（例如蓝光或紫外光）转换成其他波长的颜色， 发出白光。 由光转换滤波器发出的白光由用于测量光学特性的单元接收，因此测量白光的光学特性。 光学特性测量单元可以包括测量光能的光电二极管传感器（130）和测量光谱的光谱仪（140）。
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公开(公告)号：KR1020100071937A
公开(公告)日：2010-06-29
申请号：KR1020090127737
申请日：2009-12-21
Applicant: 삼성전자주식회사
CPC classification number: H01L33/50 , H01L33/486 , H01L33/505 , H01L33/52 , H01L2224/48091 , H01L2224/48257 , H01L2224/8592 , H01L2924/3025 , H01L2933/0041 , B82Y20/00 , H01L2924/00014 , H01L2924/00
Abstract: PURPOSE: A light emitting device package, a backlight unit, a display device, and a lighting device are provided to improve luminous efficiency by properly setting the shape and size of a groove in consideration of the shape and size of a chip. CONSTITUTION: A package body(11) provides a chip mounting region(11a). The package body includes a first lead terminal and a second lead terminal. An LED chip(15) is mounted on the chip mounting region. The LED chip is electrically connected to the first and second lead terminals. The groove unit is formed along the LED chip on the chip mounting region. A wavelength conversion unit(18) is made of resins containing a wavelength conversion material(18b).
Abstract translation: 目的：提供发光器件封装，背光单元，显示装置和照明装置，以通过考虑芯片的形状和尺寸适当地设定凹槽的形状和尺寸来提高发光效率。 构成：包装体（11）提供芯片安装区域（11a）。 封装体包括第一引线端子和第二引线端子。 LED芯片（15）安装在芯片安装区域上。 LED芯片电连接到第一和第二引线端子。 槽单元沿着芯片安装区域上的LED芯片形成。 波长转换单元（18）由含有波长转换材料（18b）的树脂制成。
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