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公开(公告)号:KR1020050000182A
公开(公告)日:2005-01-03
申请号:KR1020030040777
申请日:2003-06-23
Applicant: 전자부품연구원
IPC: H03H9/46
CPC classification number: H03H9/46 , H01P1/203 , H01P1/212 , H01P11/007
Abstract: PURPOSE: A method for fabricating band pass filter is provided to obtain high resolution and accurate fine patterns by using photosensitive Ag paste to forming a conductive layer. CONSTITUTION: A filter layer(21) is formed on an upper surface of a substrate. An exposure process is performed to expose a part of the filter layer. A development process is performed to form a filter pattern by developing the exposed part of the filter layer and removing an unexposed part of the filter layer from the filter layer. A firing process for the filter layer having the filter pattern is performed. The filter pattern includes one or more unit cells having a cuneal opening.
Abstract translation: 目的:提供一种制造带通滤波器的方法,通过使用感光Ag糊来形成导电层以获得高分辨率和精确的精细图案。 构成:在基板的上表面上形成有过滤层(21)。 执行曝光处理以暴露过滤层的一部分。 通过显影过滤层的暴露部分并从过滤层去除过滤层的未曝光部分,进行显影处理以形成过滤器图案。 执行具有滤波器图案的过滤层的点火处理。 过滤器图案包括一个或多个具有密闭开口的单元电池。
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公开(公告)号:KR1020040099932A
公开(公告)日:2004-12-02
申请号:KR1020030032074
申请日:2003-05-20
Applicant: 전자부품연구원
IPC: H03H9/56
CPC classification number: H03H9/56 , H01P1/20345 , H03H9/54 , H03H2009/02173
Abstract: PURPOSE: A duplexing module using a laminated structure of ceramic substrate and FBAR(Film Bulk Acoustic Resonator) filter is provided to minimize the size and the mounting cost by forming a three-dimensional module. CONSTITUTION: An FBAR filter is formed on a resonator structure. An inductor and a delay signal line are patterned on an inductor substrate(50) and a delay line substrate(60). A first ground substrate(40) and a second ground substrate(70) include ground patterns connected to the inductor substrate and the delay line substrate. A connective substrate(30) is electrically connected to pad connection terminals of the inductor substrate and the delay line substrate through signal lines. A ground part of the resonator structure is electrically connected to ground patterns of the first substrate and the second substrate. The second ground substrate, the delay line substrate, the inductor substrate, the first ground substrate, the connective substrate, and the resonator structure are stacked sequentially and are packaged by using via holes of each substrate.
Abstract translation: 目的:提供一种使用陶瓷基板和FBAR(薄膜体声波谐振器)滤波器的叠层结构的双工模块,通过形成三维模块来最小化尺寸和安装成本。 构成:在谐振器结构上形成FBAR滤波器。 电感器和延迟信号线在电感器基板(50)和延迟线基板(60)上图案化。 第一接地衬底(40)和第二接地衬底(70)包括连接到电感器衬底和延迟线衬底的接地图案。 连接基板(30)通过信号线电连接到电感器基板和延迟线基板的焊盘连接端子。 谐振器结构的接地部分电连接到第一基板和第二基板的接地图案。 依次堆叠第二接地衬底,延迟线衬底,电感器衬底,第一接地衬底,连接衬底和谐振器结构,并且通过使用每个衬底的通孔来封装。
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公开(公告)号:KR1020040048004A
公开(公告)日:2004-06-07
申请号:KR1020020075750
申请日:2002-12-02
Applicant: 전자부품연구원
CPC classification number: H01B3/12 , C04B35/453 , C04B35/46 , C04B35/495 , C04B35/6303
Abstract: PURPOSE: Provided is a low temperature co-fired ceramic composition having a middle dielectric constant, which is excellent in a quality coefficient and a resonant frequency temperature coefficient. CONSTITUTION: The low temperature co-fired ceramic composition is produced by a process comprising the steps of: ball-milling ZnO, Nb2O5, TiO2 raw powders in the ratio of 1:1:2; calcining the milled powder at 950-1100deg.C; adding 0.1-1.0wt% of SnO2 powder to the first calcined powder and then calcining at 950-1100deg.C to obtain a second calcined powder; adding a low temperature-sintering agent to the second calcined powder and then ball-milling to obtain a mixture powder; molding the mixture powder to obtain an article; and calcining the article at 850-950deg.C.
Abstract translation: 目的:提供具有中等介电常数的低温共烧陶瓷组合物,其质量系数和共振频率温度系数优异。 构成:低温共烧陶瓷组合物通过包括以下步骤的方法制备:将ZnO,Nb 2 O 5,TiO 2原料粉末以1:1:2的比例球磨; 将研磨粉末煅烧至950-1100℃; 向第一煅烧粉末中添加0.1-1.0重量%的SnO 2粉末,然后在950-1100℃下煅烧,得到第二煅烧粉末; 向第二煅烧粉末中加入低温烧结剂,然后进行球磨,得到混合粉末; 将混合粉末成型得到制品; 并在850-950℃下煅烧文章。
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公开(公告)号:KR100416689B1
公开(公告)日:2004-01-31
申请号:KR1019990007634
申请日:1999-03-09
Applicant: 전자부품연구원
IPC: H03B5/08
Abstract: PURPOSE: A voltage controlled oscillator with multi-band frequency matching circuits is provided to generate one form of radio frequency from bands of more than two frequencies. CONSTITUTION: A voltage controlled oscillator with multi-band frequency matching circuits includes the following components. A resonance circuit(30), a variable frequency band unit(40), a buffer amplifier(70), and a multi-band frequency matching unit(100). A resonance circuit(30) is equipped with a Line Concentrator(LC) parallel circuit of capacity(C1) and inductor(L1) and a serial circuit of capacity(C2) and varactor diode(VA). A varactor diode(VA) functions as a variable capacity as it forms LC parallel resonance circuit by the authenticated voltage of the voltage source(Vt). The LC parallel resonance circuit(30) generates signals according to the size of the voltage from the voltage source(Vt).
Abstract translation: 目的:提供一个带有多频段频率匹配电路的压控振荡器,用于从两个以上频率的频段中产生一种无线电频率。 构成:具有多频带频率匹配电路的压控振荡器包括以下组件。 谐振电路(30),可变频带单元(40),缓冲放大器(70)以及多频带频率匹配单元(100)。 谐振电路(30)配备有电容(C1)和电感(L1)的集线器(LC)并联电路和电容(C2)和变容二极管(VA)的串联电路。 变容二极管(VA)用作可变电容,因为它通过电压源(Vt)的认证电压形成LC并联谐振电路。 LC并联谐振电路(30)根据来自电压源(Vt)的电压的大小产生信号。
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公开(公告)号:KR101404014B1
公开(公告)日:2014-06-27
申请号:KR1020120136488
申请日:2012-11-28
Applicant: 전자부품연구원
CPC classification number: H01L2224/16225 , H01L2924/1532
Abstract: 본 발명은 3차원 패키징 모듈에 대하여 개시한다. 본 발명의 일 면에 따른 3차원 패키징 모듈은, 복수의 층으로 구성되며, 상기 복수의 층 중 어느 한 층에서 내장된 인덕터를 포함하는 인터포저, 상기 인터포저의 하부면 상에 형성된 TMV(Through Mold Via)들 사이에 배치되어 상기 인터포저의 하부면에 실장되는 IC 및 상기 인덕터가 내장된 층과 다른 층에서 형성되어 상기 인덕터와 상기 IC를 연결하는 패턴을 포함하는 인터포저 모듈; 및 상기 IC와 연결되는 커패시터가 내장되며, 실장용 패드(PAD)을 포함하는 인쇄회로기판을 포함한다.
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公开(公告)号:KR1020140068690A
公开(公告)日:2014-06-09
申请号:KR1020120136488
申请日:2012-11-28
Applicant: 전자부품연구원
CPC classification number: H01L2224/16225 , H01L2924/1532
Abstract: A three-dimensional packaging module is disclosed. The three-dimensional packaging module, according to an aspect of the present invention, comprises: an interposer including a connecting member in which IC and an inductor connected to the IC are equipped; and a printed circuit board including a pad for mounting in which a capacitor connected to the IC is equipped. The connecting member and the pad for mounting are configured with a number and a shape corresponding to each other to form, when connected to each other through soldering, the IC and a peripheral circuit of the IC including the inductor and the capacitor as a one module by electrically connecting the IC with at least one of the inductor and the capacitor.
Abstract translation: 公开了三维封装模块。 根据本发明的一个方面的三维封装模块包括:插入器,包括连接IC和连接到IC的电感器的连接构件; 以及印刷电路板,其包括用于安装的焊盘,其中配备有连接到IC的电容器。 连接构件和用于安装的焊盘构造成具有相互对应的数量和形状,以通过焊接将IC和包括电感器和电容器的IC的外围电路作为一个模块形成 通过将IC与电感器和电容器中的至少一个电连接。
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公开(公告)号:KR101362198B1
公开(公告)日:2014-02-12
申请号:KR1020120051674
申请日:2012-05-15
Applicant: 전자부품연구원
CPC classification number: H01L2224/04105 , H01L2224/10 , H01L2224/16225 , H01L2224/19 , H01L2224/24137 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73267 , H01L2224/92244 , H01L2924/15153 , H01L2924/1531 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 본 발명은 몰딩 패키지 및 그 제조방법에 관한 것으로, 보다 상세하게는 몰딩 중 칩의 이동을 방지할 수 있는 몰딩 패키지 및 그 제조방법에 관한 것으로, 터포저가 없이 몰딩 패키지를 제작함으로써 패키지 가격이 절감되며, 소형화 및 얇은 패키지 구현이 가능하도록 하며 종래의 칩내장형 몰딩 패키지의 경우 몰딩 후 칩과 기판을 연결하는데 비해 칩과 기판을 연결하기 위한 비아 가공 및 도금 공정을 생략할 수 있어 미리 금속에 칩과 기판을 접속시킨 후 몰딩하게 되므로 칩 이동에 의한 접속 불량을 감소시킬 수 있는 효과가 있다.
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公开(公告)号:KR101350311B1
公开(公告)日:2014-01-13
申请号:KR1020120131638
申请日:2012-11-20
Applicant: 전자부품연구원
Abstract: A dual band antenna is disclosed. The dual band antenna according to one aspect of the present invention includes: a reverse '�� type impedance matching part with a first terminal connected to a ground; a first pattern line which is connected to a second terminal of the impedance matching part, and is formed by being extended along the opposite direction to the second terminal; and a second pattern line which includes a first, a second, a third and a fourth line. The first line crosses a connection point of the second terminal of the impedance matching part and the first pattern line and is connected to a feeding line located closely to the ground. The second, the third and the fourth line are formed at least in a constant interval with the first pattern line. A part of the second line, the third line and the fourth line are formed in a reverse '�� shape. The second pattern line is coupled to the first pattern line. The impedance matching part, the first pattern line and the second pattern line are formed on a printed circuit board, and transmit and receive a signal of two frequency bands.
Abstract translation: 公开了一种双频带天线。 根据本发明的一个方面的双频带天线包括:反向 型阻抗匹配部分,其具有连接到地的第一端子; 第一图案线,其连接到所述阻抗匹配部的第二端子,并且沿着与所述第二端子相反的方向延伸形成; 以及包括第一,第二,第三和第四行的第二图案线。 第一线穿过阻抗匹配部分的第二端子和第一图案线的连接点,并且连接到靠近地面的馈电线。 第二,第三和第四行至少与第一图案线形成一定的间隔。 第二行的一部分,第三行和第四行以相反的“ ”形状形成。 第二图案线耦合到第一图案线。 阻抗匹配部分,第一图案线和第二图案线形成在印刷电路板上,并且发送和接收两个频带的信号。
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公开(公告)号:KR101341619B1
公开(公告)日:2014-01-13
申请号:KR1020110143951
申请日:2011-12-27
Applicant: 전자부품연구원
CPC classification number: H01L24/73 , H01L2224/24 , H01L2224/24227 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2225/1023 , H01L2225/1058 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: 반도체 패키지는 수동 박막 소자가 집적된 기판에 적어도 하나의 구멍이 형성되고 이 구멍에 집적 회로가 삽입되며 수동 박막 소자와 집적 회로를 연결 부재를 통해서 연결함으로써 형성된다.
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公开(公告)号:KR1020130112426A
公开(公告)日:2013-10-14
申请号:KR1020120034800
申请日:2012-04-04
Applicant: 전자부품연구원
IPC: H04B1/48
CPC classification number: H04B1/0057 , H04B1/48
Abstract: PURPOSE: An RF front end module for triple mode and band is provided to support not only a global positioning system (GPS) signal of 1.575 GHz, a Bluetooth signal of 2.4 GHz band and a WiFi signal but also a WiFi signal of 5 GHz band. CONSTITUTION: A Bluetooth-WiFi transceiving path (130) includes a Bluetooth receiving path, a WiFi receiving path of a second frequency band, and a WiFi transmitting path of a second frequency band. The WiFi receiving path of the second frequency band receives a WiFi signal of the second frequency band. The WiFi transmitting path of the second frequency band delivers the WiFi signal of the second frequency band to a triplexer. A WiFi transceiving path (140) includes a WiFi receiving path of a third frequency band and a WiFi transmitting path of the third frequency band. The WiFi transmitting path of the third frequency band delivers a WiFi signal of the third frequency band to the triplexer.
Abstract translation: 目的:提供用于三重模式和频带的RF前端模块,不仅支持1.575 GHz的全球定位系统(GPS)信号,2.4 GHz频段的蓝牙信号和WiFi信号,还支持5 GHz频段的WiFi信号 。 构成:蓝牙WiFi收发路径(130)包括蓝牙接收路径,第二频带的WiFi接收路径和第二频带的WiFi发送路径。 第二频带的WiFi接收路径接收第二频带的WiFi信号。 第二频带的WiFi发送路径将第二频带的WiFi信号传送到三路复用器。 WiFi收发路径(140)包括第三频带的WiFi接收路径和第三频带的WiFi发送路径。 第三频带的WiFi发送路径将第三频带的WiFi信号传送到三工器。
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