Abstract:
PURPOSE: A positive photosensitive resin composition is provided to be able to implement a semiconductor device with an excellent luminous efficiency, color development rate and insulation by including organic dye absorbing wavelengths in a specific region. CONSTITUTION: A positive photosensitive resin composition comprises (A) alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor or their combination; (B) a photosensitive diazoquianone compound; (C) a phenol compound; (D) at least one organic dye with light absorption wavelengths of 400-700 nm; and (E) solvent. The organic dye (D) is included at an amount of 1-40 parts by weight to 100.0 parts by weight of the alkali soluble resin precursor. The organic dye (D) includes a methene group compound.