포지티브형 감광성 수지 조성물
    25.
    发明公开
    포지티브형 감광성 수지 조성물 有权
    正型型感光树脂组合物

    公开(公告)号:KR1020130078436A

    公开(公告)日:2013-07-10

    申请号:KR1020110147388

    申请日:2011-12-30

    CPC classification number: G03F7/105 G03F7/0233 G03F7/0757

    Abstract: PURPOSE: A positive photosensitive resin composition is provided to be able to implement a semiconductor device with an excellent luminous efficiency, color development rate and insulation by including organic dye absorbing wavelengths in a specific region. CONSTITUTION: A positive photosensitive resin composition comprises (A) alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor or their combination; (B) a photosensitive diazoquianone compound; (C) a phenol compound; (D) at least one organic dye with light absorption wavelengths of 400-700 nm; and (E) solvent. The organic dye (D) is included at an amount of 1-40 parts by weight to 100.0 parts by weight of the alkali soluble resin precursor. The organic dye (D) includes a methene group compound.

    Abstract translation: 目的:提供一种正型感光性树脂组合物,以能够通过在特定区域中包含有机染料吸收波长来实现具有优异的发光效率,显色速度和绝缘性的半导体器件。 构成:正型感光性树脂组合物包含(A)选自聚苯并恶唑前体,聚酰亚胺前体或其组合的碱溶性树脂; (B)光敏重氮基醌配合物; (C)酚化合物; (D)至少一种光吸收波长为400-700nm的有机染料; 和(E)溶剂。 有机染料(D)的含量为1-40重量份至100.0重量份的碱溶性树脂前体。 有机染料(D)包括一种甲烯基化合物。

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