公开(公告)号：SG113012A1

公开(公告)日：2005-07-28

申请号：SG200407676

申请日：2004-12-23

Applicant: ASML NETHERLANDS BV

Inventor： CONSOLINI JOSEPH J ,  BEST KEITH FRANK ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F7/20 ,  G03F9/00 ,  H01L21/027

Abstract: In a method of measurement according to one embodiment of the invention, a relative position of a temporary alignment mark on one side of a substrate and an alignment mark on the other side of the substrate is determined, and the temporary alignment mark is removed. Before removal of the temporary alignment mark, a relative position of that mark and another mark on the same side of the substrate may be determined. The temporary alignment mark may be formed in, e.g., an oxide layer.

公开(公告)号：NL1036559A1

公开(公告)日：2009-09-15

申请号：NL1036559

申请日：2009-02-11

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  BUEL HENRICUS WILHELMUS MARIA VAN ,  GUI CHENG-QUN ,  ONVLEE JOHANNES ,  PELLENS RUDY JAN MARIA ,  EDART REMI DANIEL MARIE ,  VOZNYI OLEG VIACHESLAVOVICH ,  MAURY PASCALE ANNE

IPC: G03F9/00 ,  G03F7/20 ,  H01L21/68

公开(公告)号：SG142129A1

公开(公告)日：2008-05-28

申请号：SG2003065968

申请日：2003-11-06

Applicant: ASML NETHERLANDS BV

Inventor： BEST KEITH FRANK ,  CONSOLINI JOSEPH J ,  FRIZ ALEXANDER

IPC: G03F9/00 ,  G03C5/00 ,  G03F7/00 ,  G03F7/20 ,  H01L21/027 ,  H01L23/544

Abstract: Device Manufacturing Method and Device Manufactured Thereby A device manufacturing method comprising the steps of providing a first substrate having first and second surfaces; patterning said first surface of said substrate with at least one reversed alignment marker; providing a protective layer over said alignment marker(s); bonding said first surface of said first substrate to a second substrate; locally etching said first substrate as far as said protective layer to form a trench around the or each reversed alignment marker; and forming at least one patterned layer on said second surface using a lithographic projection apparatus having a front-to- backside alignment system whilst aligning said substrate to the alignment markers revealed in the or each trench.

公开(公告)号：DE602004011458D1

公开(公告)日：2008-03-13

申请号：DE602004011458

申请日：2004-12-15

Applicant: ASML NETHERLANDS BV

Inventor： CONSOLINI JOSEPH J ,  BEST KEITH FRANK ,  FRIZ ALEXANDER

IPC: G01B11/00 ,  G03F9/00 ,  G03F7/20 ,  H01L21/027

Abstract: In a method of measurement according to one embodiment of the invention, a relative position of a temporary alignment mark on one side of a substrate and an alignment mark on the other side of the substrate is determined, and the temporary alignment mark is removed. Before removal of the temporary alignment mark, a relative position of that mark and another mark on the same side of the substrate may be determined. The temporary alignment mark may be formed in, e.g., an oxide layer.