公开(公告)号：SG11201606187RA

公开(公告)日：2016-09-29

申请号：SG11201606187R

申请日：2011-09-05

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  CHIU WEI LAN WILLIAM ,  PINDER HARVEY WAYNE

IPC: C09G1/02 ,  C09G1/04 ,  C09G1/18 ,  C09K3/14

Abstract: An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

公开(公告)号：SG10201606566SA

公开(公告)日：2016-09-29

申请号：SG10201606566S

申请日：2011-09-05

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  CHIU WEI LAN WILLIAM ,  PINDER HARVEY WAYNE

Abstract: An aqueous polishing composition has been found, the said aqueous polishing composition comprising (A) at least one type of abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) at least one water-soluble polymer selected from the group consisting of linear and branched alkylene oxide homopolymers and copolymers; and (C) at least one anionic phosphate dispersing agent; and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

公开(公告)号：SG10201407348PA

公开(公告)日：2015-01-29

申请号：SG10201407348P

申请日：2010-11-10

Applicant: BASF SE

Inventor： LAUTER MICHAEL ,  RAMAN VIJAY IMMANUEL ,  LI YUZHUO ,  VENKATARAMAN SHYAM SUNDAR ,  SHEN DANIEL KWO-HUNG

Abstract: 23 Abstract A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING INORGANIC PARTICLES AND POLYMER PARTICLES A chemical mechanical polishing (CMP) composition, comprising (A) at least one type of inorganic particles which are dispersed in the liquid medium (C), (B) at least one type of polymer particles which are dispersed in the liquid medium (C), (C) a liquid medium, wherein the zeta-potential of the inorganic particles (A) in the liquid medium (C) and the zeta-potential of the polymer particles in the liquid medium (C) are of same signs. No Figure

公开(公告)号：SG188460A1

公开(公告)日：2013-04-30

申请号：SG2013017264

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

Abstract: An aqueous polishing composition comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9 as evidenced by the electrophoretic mobility; (B) water-soluble and water-dispersible hydroxy group containing components selected from (b1 ) aliphatic and cycloaliphatic hydroxycarboxylic acids, wherein the molar ratio of hydroxy groups to carboxylic acid groups is at least 1; (b2) esters and lactones of the hydroxycarboxylic acids (b1 ) having at least one hydroxy group; and (b3) mixtures thereof; and (C) water-soluble and water-dispersible polymer components selected from (c1 ) linear and branched alkylene oxide polymers; (c2) linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) polymers; and (c3) cationic polymeric flocculants having a weight average molecular weight of less than 100,000 Dalton.; and a process for polishing substrate materials for electrical, mechanical and optical devices.

公开(公告)号：SG188459A1

公开(公告)日：2013-04-30

申请号：SG2013017256

申请日：2011-09-06

Applicant: BASF SE

Inventor： NOLLER BASTIAN ,  FRANZ DIANA ,  LI YUZHUO ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE ,  VENKATARAMAN SHYAM SUNDAR

Abstract: An aqueous polishing composition comprising (A) at least one water-soluble or water-dispersible compound selected from the group consisting of N-substituted diazenium dioxides and N'-hydroxy-diazenium oxide salts; and (B) at least one type of abrasive particles; the use of the compounds (A) for manufacturing electrical, mechanical and optical devices and a process for polishing substrate materials for electrical, mechanical and optical devices making use of the aqueous polishing composition.

公开(公告)号：SG188206A1

公开(公告)日：2013-04-30

申请号：SG2013010632

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

Abstract: An aqueous polishing composition having a pH of 3 to 11 and comprising (A) abrasive particles which are positively charged when dispersed in an aqueous medium free from component (B) and of a pH of 3 to 9 as evidenced by the electrophoretic mobility; (B) anionic phosphate dispersing agents; and (C) a polyhydric alcohol component selected from the group consisting of (c1) water-soluble and water-dispersible, aliphatic and cycloaliphatic, monomeric, dimeric and oligomeric polyols having at least 4 hydroxy groups; (c2) a mixture consisting of (c21) water-soluble and water-dispersible, aliphatic and cycloaliphatic polyols having at least 2 hydroxy groups; and (c22) water-soluble or water-dispersible polymers selected from linear and branched alkylene oxide homopolymers and copolymers (c221 ); and linear and branched, aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers (c222); and (c3) mixtures of (c1) and (c2); and a process for polishing substrates for electrical, mechanical and optical devices.

公开(公告)号：EP2613910A4

公开(公告)日：2017-12-13

申请号：EP11823141

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  VENKATARAMAN SHYAM SUNDAR ,  PINDER HARVEY WAYNE

IPC: B24B37/04 ,  C09G1/02 ,  C09K3/14

CPC classification number: H01L21/30625 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  C11D3/14 ,  C11D3/3707 ,  C11D3/3723 ,  C11D3/3773 ,  C11D3/3776 ,  C11D7/20 ,  C11D11/0047 ,  H01L21/31053

Abstract: CMP process for substrates containing silicon oxide dielectric films and polysilicon and/or silicon nitride films comprising the steps of (1) contacting the substrate with an aqueous composition containing (A) abrasive particles which are positively charged when dispersed in an aqueous medium having a pH in the range of from 3 to 9; (B) a water-soluble or water-dispersible linear or branched alkylene oxide homopolymer or copolymer; and (C) a water-soluble or water-dispersible polymer selected from (c1) aliphatic and cycloaliphatic poly(N-vinylamide) homopolymers and copolymers, (c2) homopolymers and copolymers of acrylamide monomers of the general formulas I and II: H2C=C(-R)-C(=0)-N(-R1)(-R2) (I), H2C=C(-R)-C(=0)-R3 (II), wherein the variables have the following meaning R hydrogen atom, fluorine atom, chlorine atom, nitrile group, or organic residue; R1 and R2 hydrogen atom or organic residue; R3 saturated N-heterocyclic ring; (c3) cationic polymeric flocculants; and (c4) mixtures thereof; (2) polishing the substrate until the silicon oxide dielectric film is removed and the polysilicon and/or silicon nitride film is or are exposed exposed.

公开(公告)号：EP2614123A4

公开(公告)日：2014-07-30

申请号：EP11823142

申请日：2011-09-06

Applicant: BASF SE

Inventor： LI YUZHUO ,  CHU JEA-JU ,  VENKATARAMAN SHYAM SUNDAR ,  USMAN IBRAHIM SHEIK ANSAR ,  PINDER HARVEY WAYNE

IPC: C09G1/02 ,  C03C19/00 ,  C09G1/04 ,  C09G1/18 ,  C09K3/14

CPC classification number: C09K3/1409 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

公开(公告)号：EP2794733A4

公开(公告)日：2015-11-11

申请号：EP11878326

申请日：2011-12-21

Applicant: BASF SE

Inventor： VENKATARAMAN SHYAM SUNDAR ,  SU EASON YU-SHEN

IPC: C08J5/14 ,  C09K3/14

CPC classification number: C09G1/02 ,  C03C15/00 ,  C09K3/1409 ,  C09K3/1436 ,  C09K3/1463 ,  H01L21/31053

Abstract: Provided is a process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of borophosphosilicate glass (BPSG) material in the presence of a chemical mechanical polishing (CMP) composition which comprises: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of anionic phosphate or phosphonate as dispersing agent or charge reversal agent, (C) at least one type of surfactant, and (D) an aqueous medium.

公开(公告)号：EP2794790A4

公开(公告)日：2015-07-29

申请号：EP11878201

申请日：2011-12-21

Applicant: BASF SE

Inventor： RAMAN VIJAY IMMANUEL ,  LI YUZHUO ,  SCHADE CHRISTIAN ,  VENKATARAMAN SHYAM SUNDAR ,  SU EASON YU-SHEN ,  USMAN IBRAHIM SHEIK ANSAR ,  GAO NING

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105

CPC classification number: C09G1/04 ,  C09G1/00 ,  C09G1/02 ,  C09K3/1463 ,  C09K13/00 ,  H01L21/302 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/461

Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(OR2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.

Abstract translation: 一种化学机械抛光（CMP）组合物，其包含：（A）无机颗粒，有机颗粒或其混合物或复合物，（B）至少一种作为分散剂的有机聚合物或电荷反转剂，其包含膦酸盐 P（ΟO）（OR1）（OR2）或膦酸（P（ΟO）（OH）2）部分或其去质子化形式为侧基，其中R 1为烷基，芳基，烷基芳基或芳基烷基， 烷基，芳基，烷基芳基或芳烷基，和（C）水性介质。