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1.CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES 有权
Title translation: 化学 - 机械 - 药理学 - 药理学杂志公开(公告)号:EP2794790A4
公开(公告)日:2015-07-29
申请号:EP11878201
申请日:2011-12-21
Applicant: BASF SE
Inventor: RAMAN VIJAY IMMANUEL , LI YUZHUO , SCHADE CHRISTIAN , VENKATARAMAN SHYAM SUNDAR , SU EASON YU-SHEN , USMAN IBRAHIM SHEIK ANSAR , GAO NING
IPC: C09G1/02 , C09K3/14 , H01L21/304 , H01L21/306 , H01L21/3105
CPC classification number: C09G1/04 , C09G1/00 , C09G1/02 , C09K3/1463 , C09K13/00 , H01L21/302 , H01L21/30625 , H01L21/31053 , H01L21/461
Abstract: A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(OR2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
Abstract translation: 一种化学机械抛光(CMP)组合物,其包含:(A)无机颗粒,有机颗粒或其混合物或复合物,(B)至少一种作为分散剂的有机聚合物或电荷反转剂,其包含膦酸盐 P(ΟO)(OR1)(OR2)或膦酸(P(ΟO)(OH)2)部分或其去质子化形式为侧基,其中R 1为烷基,芳基,烷基芳基或芳基烷基, 烷基,芳基,烷基芳基或芳烷基,和(C)水性介质。
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2.A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-xGex MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC ORGANIC COMPOUND 有权
Title translation: 用于生产半导体器件利用元素锗及/或SI1-xGex材料使用CMP成分与特定的有机化合物的化学机械抛光公开(公告)号:EP2742103A4
公开(公告)日:2015-03-25
申请号:EP12819882
申请日:2012-07-30
Applicant: BASF SE
Inventor: NOLLER BASTIAN MARTEN , DRESCHER BETTINA , GILLOT CHRISTOPHE , LI YUZHUO , GAO NING
IPC: H01L21/306 , C09G1/02 , C09K3/14
CPC classification number: H01L21/30625 , C09G1/02 , C09K3/1463 , C23F3/00 , H01L21/02024 , H01L21/31053 , H01L21/3212
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3.A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING A GLYCOSIDE 有权
Title translation: CMP组合苷公开(公告)号:EP2753670A4
公开(公告)日:2015-02-25
申请号:EP12830462
申请日:2012-09-04
Applicant: BASF SE
Inventor: LI YUZHUO , LAUTER MICHAEL , LANGE ROLAND , GAO NING
IPC: C09G1/02
CPC classification number: C09G1/02 , C09G1/00 , C09K13/00 , C23F1/00 , H01L21/30625 , H01L21/31053
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公开(公告)号:EP2684213A4
公开(公告)日:2014-11-26
申请号:EP12757663
申请日:2012-02-28
Applicant: BASF SE
Inventor: LI YUZHUO , WANG CHANGXUE , SHEN DANIEL KWO-HUNG , GAO NING
IPC: H01L21/306 , C09G1/02 , H01L21/768
CPC classification number: H01L21/30625 , C09G1/02 , H01L21/31053 , H01L21/3212 , H01L21/76898
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5.A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING TWO TYPES OF CORROSION INHIBITORS 有权
Title translation: 成分用于化学机械抛光(CMP)带双缓蚀剂的类型公开(公告)号:EP2688966A4
公开(公告)日:2014-11-12
申请号:EP12760432
申请日:2012-03-19
Applicant: BASF SE
Inventor: NOLLER BASTIAN , LAUTER MICHAEL , SUGIHARTO ALBERT BUDIMAN , LI YUZHUO , RUSHING KENNETH , FRANZ DIANA , BÖHN ROLAND , GAO NING
IPC: C09G1/02 , H01L21/321
CPC classification number: H01L21/3212 , C09G1/02 , C09G1/04 , C09K3/1463 , H01L21/30625
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