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    23.
    发明专利
    未知

    公开(公告)号：DE102007057626A1

    公开(公告)日：2008-07-03

    申请号：DE102007057626

    申请日：2007-11-30

    Applicant: CORNING INC

    Inventor： ARSERIO GREGORY JOHN ,  SYLVIA BRIAN DANIEL ,  SABIA ROBERT

    IPC: G02B1/00 ,  B24B13/00 ,  C03C3/06 ,  C03C3/076 ,  C03C19/00 ,  G03F7/20

    Abstract: The invention is directed to polished glass substrates suitable for extreme ultraviolet lithography. The elements are silica-titania glass elements having a coefficient of thermal expansion of 0±30x10 -9 /° C. or less, and containing 5-10 wt. % titania. The polished elements have a mid-spatial frequency peak-to-valley roughness of 2.0 ml/cm 2 /min. Generally the flow rates are in the range of 2.0-10 ml/cm 2 /min. Glass substrates suitable for extreme ultraviolet lithography element have a coefficient of thermal expansion of 0±30x10 -9 /° C. or less. A particular glass suitable for EUVL use is silica-titania glass containing 5-10 wt. % titania.

    25.
    发明专利
    未知

    公开(公告)号：DE10296958T5

    公开(公告)日：2004-04-29

    申请号：DE10296958

    申请日：2002-05-31

    Applicant: CORNING INC CORNING

    Inventor： RETHERFORD REBECCA ,  SABIA ROBERT ,  SOKIRA VINCENT P

    IPC: B24B57/02 ,  B24B1/00 ,  B24B13/00 ,  B24B37/04 ,  C09G1/02 ,  B24B7/22

    Abstract: The invention relates to optical fluoride crystals, and particularly to optical fluoride crystals such as calcium fluoride, which have high transmission levels to below 200 nm light, such as produced by excimer lasers. In particular the invention relates to making optical fluoride crystals with improved transmission surfaces. The invention relates to the elimination of mid-spatial frequency roughness 1-1000 mum spatial wavelengths and high-spatial frequency

    METHOD USING MULTI-COMPONENT COLLOIDAL ABRASIVES FOR CMP PROCESSING OF SEMICONDUCTOR AND OPTICAL MATERIALS
    26.
    发明申请
    METHOD USING MULTI-COMPONENT COLLOIDAL ABRASIVES FOR CMP PROCESSING OF SEMICONDUCTOR AND OPTICAL MATERIALS 审中-公开
    使用多组分胶体磨料进行半导体和光学材料的CMP处理的方法

    公开(公告)号：WO2004053456A3

    公开(公告)日：2005-01-13

    申请号：PCT/US0337844

    申请日：2003-11-25

    Applicant: CORNING INC

    Inventor： BELLMAN ROBERT A ,  SABIA ROBERT ,  UKRAINCZYK LJERKA ,  WHALEN JOSEPH M

    IPC: C09G1/02 ,  C09K3/14 ,  H01L21/3105 ,  H01L21/302 ,  H01L21/461

    CPC classification number: C09K3/1472 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/31053

    Abstract: A method is provided for using abrasive colloidal particles having multi-component composition comprising mixed 1) metal or metalloid oxides, 2) oxyfluorides, or 3) oxynitrides, each grouping (1, 2, or 3) individually alone or in combination thereof, in a chemical-mechanical manufacturing process for planarizing or polishing metal, semiconductor, dielectric, glass, polymer, optical, and ceramic materials. The particles exhibit a modified surface chemistry performance and have an isoelectric point (pHIEP) greater than the pH of the dispersed particles in solution, and with a stabilized particle dispersion at pH values of interest for CMP operations. The composition of the multi-component particles may be adjusted as desired, in regard to their chemical or physical properties such as surface chemistry, hardness, solubility, or degree of compatibility with the workpiece material being planarized or polished. Also provided is a chemical-mechanical planarization slurry mixture incorporating such multi-component particles and with a solution chemistry that enhances the CMP effects by in-part adjusting the pH of the solution away from the pHIEP of the media to maximize dispersion.

    Abstract translation: 提供了一种使用具有多组分组合物的磨料胶体颗粒的方法，其包括混合1）金属或准金属氧化物，2）氟氧化物或3）氮氧化物，每个单独或组合使用（1,2或3）单独或组合在 用于平面化或抛光金属，半导体，电介质，玻璃，聚合物，光学和陶瓷材料的化学机械制造方法。 颗粒表现出改性的表面化学性能，并具有大于溶液中分散颗粒的pH的等电点（pHIEP），并且在CMP操作的pH值下具有稳定的颗粒分散体。 关于它们的化学或物理性质如表面化学性质，硬度，溶解度，或与被平坦化或抛光的工件材料的相容程度，可以根据需要调节多组分颗粒的组成。 还提供了一种化学机械平面化浆料混合物，其结合了这种多组分颗粒和溶液化学，其通过部分地将溶液的pH从介质的pHIEP调节以使分散最大化来增强CMP效果。

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