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公开(公告)号：US10341783B2
公开(公告)日：2019-07-02
申请号：US15376012
申请日：2016-12-12
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
Abstract: A Micro Electro Mechanical System (MEMS) microphone is provided. The MEMS microphone includes: a substrate including an audio hole and having an oxide layer at a predetermined segment along an upper surface edge; a vibration electrode that is supported by a support layer that is formed along an upper surface edge in a state that is separated to the inside of the center from the oxide layer at an upper portion corresponding to the audio hole; a fixed electrode that is formed at an upper portion of the oxide layer and in which one side of the support layer is bonded to one side of a low surface; and a back plate that is formed at an upper portion of the fixed electrode and in which the other side of the support layer is bonded to one side of a low surface.
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公开(公告)号：US09866968B2
公开(公告)日：2018-01-09
申请号：US15163406
申请日：2016-05-24
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
CPC classification number: H04R9/08 , H04R19/005 , H04R19/04 , H04R31/00
Abstract: A microphone includes a plurality of vibration membrane electrodes, and a plurality of fixing membrane electrodes that respectively faces the plurality of vibration membrane electrodes and forms a plurality of unit capacitors along with the facing vibration membrane electrodes, wherein the plurality of unit capacitors generates a plurality of unit output signals according to inputs of a power source and a sound source, and outputs a signal combining the plurality of unit output signals as an output signal corresponding to the sound source.
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公开(公告)号：US09828241B2
公开(公告)日：2017-11-28
申请号：US15197418
申请日：2016-06-29
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
CPC classification number: B81C1/00269 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2203/04 , B81C2201/013 , B81C2201/0159 , B81C2203/0118 , B81C2203/031 , B81C2203/035 , B81C2203/036
Abstract: A manufacturing method of a MEMS sensor includes forming a first substrate, wherein the first substrate includes a lower electrode provided at one surface thereof, forming a second substrate, wherein the second substrate includes a first concave-convex portion provided at one surface thereof, first-bonding one surface of the first substrate and one surface of the second substrate to face each other, forming a third substrate, wherein the third substrate includes an upper electrode provided at one surface thereof, second-bonding another surface of the second substrate and one surface of the third substrate to face each other, and forming an electrode line on another surface of the third substrate to be connected to the lower electrode and the upper electrode.
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24.发明授权公开(公告)号：US09807531B2
公开(公告)日：2017-10-31
申请号：US14852574
申请日：2015-09-13
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim , Yong Sung Lee
CPC classification number: H04R31/00 , H04R17/02 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A microphone and a method of manufacturing the microphone are provided. The method includes; preparing a substrate and forming a vibrating membrane having an oxide film and a plurality of slots onto the substrate. A sacrificial layer and a fixed membrane is formed over the vibrating membrane and air intake apertures are formed through the fixed membrane. A first pad is connected to the fixed membrane, a second pad is connected to the vibrating membrane, and a phase delay unit is bonded to the bonding pad. A penetration aperture may be formed by etching the rear side of the substrate and bonding the phase delay unit on the bonding pad. A sound passage, is formed by connecting passage patterns, and sound apertures with the sound passages by sequentially stacking phase delay layers on the bonding pad and simultaneously forming the passage patterns in the phase delay layers.
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公开(公告)号：US09736605B2
公开(公告)日：2017-08-15
申请号：US14852310
申请日：2015-09-11
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
CPC classification number: H04R31/00 , B81B3/00 , H04R1/342 , H04R1/38 , H04R19/005 , H04R19/04 , H04R29/004 , H04R2499/11 , H04R2499/13
Abstract: Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.
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Patent Agency Ranking
公开(公告)号：US09693149B2
公开(公告)日：2017-06-27
申请号：US14551014
申请日：2014-11-23
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
Abstract: A microphone and method for manufacturing the microphone are provided. The microphone includes a substrate with a penetration aperture, a vibration unit disposed on the substrate to cover the penetration aperture, and a fixed electrode disposed over, and spaced from, the vibration unit. Further, the vibration unit includes a first portion and a second portion disposed on the penetration aperture, and a third portion disposed on the substrate. In addition, the first portion and the third portion are spaced from each other, and the second portion is connected between the first portion and the third portion, and includes a first piezoelectric portion and a second piezoelectric portion.
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公开(公告)号：US20170170802A1
公开(公告)日：2017-06-15
申请号：US15152866
申请日：2016-05-12
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H03H9/02244 , B81B3/0021 , B81B2201/0271 , B81B2203/0118 , B81B2203/0136 , B81B2207/015 , G01C19/5719 , G01P15/097 , H03H9/02275 , H03H9/02393 , H03H9/02409 , H03H9/2447 , H03H2009/02165 , H03H2009/02291
Abstract: A MEMS resonator includes a main substrate forming a receiving part at a center of the main substrate; a mass body having one end part and a center part elastically supported by both sides of the main substrate; a driving unit configured at one side of the receiving part on the main substrate and producing a driving torque by a voltage applied to both sides of the one end part of the mass body to move a position of the mass body with respect to the main substrate; and a tuning part including a pair of tuning units provided symmetrically with respect to the second elastic member, and having a beam member changing a length of the second elastic member by an actuating operation of each tuning unit to control a frequency.
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公开(公告)号：US20170013339A1
公开(公告)日：2017-01-12
申请号：US14937215
申请日：2015-11-10
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Hyunsoo Kim , Ilseon Yoo
CPC classification number: H04R1/04 , H04R19/005 , H04R2201/003 , H04R2499/13
Abstract: A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.
Abstract translation: 麦克风传感器提供设置在盖上的接收空间和控制模块，并且在接收空间中定位有声音传感模块。 麦克风传感器包括盖，其具有形成在下部的接收凹槽和声音信号在耦合到盖的下部的控制模块内通过的空气入口。 此外，声音传感模块耦合到控制模块并且定位在接收槽处。
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公开(公告)号：US09368373B2
公开(公告)日：2016-06-14
申请号：US14319324
申请日：2014-06-30
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hiwon Lee , Soon-myung Kwon , Hyunsoo Kim
IPC: H01L21/50 , H01L21/308 , H01L21/306 , H01L21/18
CPC classification number: H01L21/50 , H01L21/185 , H01L21/30604 , H01L21/308
Abstract: A method of joining semiconductor substrates includes: forming an alignment key on a first semiconductor substrate; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a first metal layer and a second metal layer on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined.
Abstract translation: 一种接合半导体衬底的方法包括：在第一半导体衬底上形成对准键; 形成第一突起和第二突起，以及位于第二半导体衬底上的第一突起和第二突起之间的对准凹槽; 在所述第一突起和所述第二突起上分别形成第一金属层和第二金属层; 并且当所述第一半导体衬底和所述第二半导体衬底接合时，所述第一半导体衬底和所述第二半导体衬底接合所述对准键位于所述对准凹槽处。
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公开(公告)号：US09312227B2
公开(公告)日：2016-04-12
申请号：US14445653
申请日：2014-07-29
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hiwon Lee , Soon-myung Kwon , Hyunsoo Kim
IPC: H01L23/544 , H01L23/00 , H01L21/311 , H01L21/027
CPC classification number: H01L23/544 , H01L21/0272 , H01L21/31133 , H01L21/31144 , H01L24/83 , H01L2223/54426 , H01L2224/83139 , H01L2224/83201 , H01L2224/83902
Abstract: A method of joining semiconductor substrates, which may include: forming an alignment key on a first semiconductor substrate; forming an insulating layer on the first semiconductor substrate and the alignment key; forming a first metal layer pattern and a second metal layer pattern on the insulating layer; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a third metal layer pattern and a fourth metal layer pattern on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined, is provided.
Abstract translation: 一种连接半导体衬底的方法，其可以包括：在第一半导体衬底上形成对准键; 在所述第一半导体衬底和所述对准键上形成绝缘层; 在所述绝缘层上形成第一金属层图案和第二金属层图案; 形成第一突起和第二突起，以及位于第二半导体衬底上的第一突起和第二突起之间的对准凹槽; 在所述第一突起和所述第二突起上分别形成第三金属层图案和第四金属层图案; 并且提供在第一半导体衬底和第二半导体衬底接合时将对准键定位在对准凹槽处的第一半导体衬底和第二半导体衬底。
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