公开(公告)号：GB2264796A

公开(公告)日：1993-09-08

申请号：GB9204440

申请日：1992-03-02

Applicant: IBM

Inventor： MALAIKA SUSAN ,  BRADY MICHAEL JOHN ,  MEACOCK GEOFFREY

IPC: G06F9/46 ,  G06F11/14 ,  G06F17/30

Abstract: A method and system for distributed transaction processing between first and second transaction processing means in communication with each other employs a client program on the first transaction processing means which calls a server program on the second transaction processing means. A first type of server program call permits only the first transaction processing means to commit resources for both client and server, both programs effectively being part of a single transaction. A second type of program call permits the second transaction processing means to commit resources independently so that the server program runs as part of a separate transaction.

公开(公告)号：ES2131080T3

公开(公告)日：1999-07-16

申请号：ES93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：AT180357T

公开(公告)日：1999-06-15

申请号：AT93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：AT179270T

公开(公告)日：1999-05-15

申请号：AT95929818

申请日：1995-08-08

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：SG54473A1

公开(公告)日：1998-11-16

申请号：SG1997000626

申请日：1997-03-01

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FAVREAU NORMAND GILLES ,  GUINDON FRANCOIS ,  MOSKOWITZ PAUL ANDREW ,  MURPHY PHILIP

IPC: H01Q1/40 ,  G06K19/077 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01Q1/24 ,  H04B1/59

Abstract: A novel radio frequency transponder (tag) with a minimum of components and connects is thin and flexible because these components and connects can be unsupported by a substrate layer. This is accomplished by using a conducting leadframe structure not only as a connection medium but also as a circuit element, i.e., the transponder antenna. In various preferred embodiments, the leadframe is mechanically positioned and fixably attached to a circuit chip so that the leadframe (antenna) is self supporting. A protective coating can be added where the leadframe is attached to the circuit chip. Further a protective surrounding can envelops the entire leadframe antenna, circuit chip, and, if provided, the protective coating.

公开(公告)号：ZA957078B

公开(公告)日：1996-03-11

申请号：ZA957078

申请日：1995-08-23

Applicant: IBM

Inventor： MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM ,  BRADY MICHAEL JOHN

IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59 ,  G01V ,  G01S ,  H04B ,  H01L

Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

公开(公告)号：BR9400334A

公开(公告)日：1994-09-27

申请号：BR9400334

申请日：1994-01-26

Applicant: IBM

Inventor： ABOELFOTOH MOHAMED OSAMA ,  BRADY MICHAEL JOHN ,  KRUSIN-ELBAUM LIAN NMN

IPC: C22C1/00 ,  C22C9/00 ,  C23C14/06 ,  C23C14/16 ,  C23C14/58 ,  C23C30/00

Abstract: A cpd. which is highly resistant to oxidn. and has low resistivity at room temp. comprises stoichiometric Cu3Ge contg. 1-15 at.% Ga and/or Au. The most pref. content of Ga and/or Au in the Cu3Ge is 1-3 at.%. The resistivity of the cpd. at room temp. is 2.6-2.9 micron omega cm.

公开(公告)号：DE3175092D1

公开(公告)日：1986-09-18

申请号：DE3175092

申请日：1981-03-06

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  GREGOR LAWRENCE VINCENT ,  JOHNSON MARK

IPC: F16C32/00 ,  G02B6/35 ,  G02B26/02 ,  G02B26/08 ,  H02K44/02 ,  G02B6/24 ,  G02F1/00