公开(公告)号：DE69324959T2

公开(公告)日：1999-12-02

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：ES2131080T3

公开(公告)日：1999-07-16

申请号：ES93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：AT180357T

公开(公告)日：1999-06-15

申请号：AT93105142

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)

公开(公告)号：DE69324959D1

公开(公告)日：1999-06-24

申请号：DE69324959

申请日：1993-03-29

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT

IPC: H01L21/60 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532 ,  H01L23/485

Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.