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    CONTACT TECHNIQUE FOR ELECTRICAL CIRCUITRY
    21.
    发明专利
    CONTACT TECHNIQUE FOR ELECTRICAL CIRCUITRY 未知

    公开(公告)号：CA1142264A

    公开(公告)日：1983-03-01

    申请号：CA365924

    申请日：1980-12-02

    Applicant: IBM

    Inventor： AMES IRVING ,  ANACKER WILHELM ,  GREBE KURT R ,  KIRCHER CHARLES J

    IPC: H01L27/18 ,  H01L23/485 ,  H01L23/532 ,  H01L39/02 ,  H01L39/22

    Abstract: CONTACT TECHNIQUE FOR ELECTRICAL CIRCUITRY . In electrical circuitry, and particularly superconducting circuitry including Josephson tunnelling devices, it is often necessary to provide solder contacts to electrical lines, where the electrical lines would be destroyed if there were interdiffusion between the lines and the solder. To avoid this problem, a laterally extending metallic layer is used as a diffusion barrier between the solder land and the electrical line which can be a superconducting line. The diffusion barrier is comprised of a refractory metal which has a first portion electrically contacting the solder land and a second, laterally displaced portion electrically contacting the electrical line. An insulating protective layer on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the superconducting electrical line is comprised of an alloy of lead while the diffusion barrier is comprised of niobium, and the solder alloy is a low melting point alloy, typically comprised of indium, bismuth,

    24.
    发明专利
    未知

    公开(公告)号：DE68919007T2

    公开(公告)日：1995-05-04

    申请号：DE68919007

    申请日：1989-05-26

    Applicant: IBM

    Inventor： BICKFORD HARRY R ,  GREBE KURT R ,  PALMER MICHAEL J ,  KOVAC CAROLINE A

    IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

    Abstract: This invention employs a carrier (10) upon which a thin conductive film (12) has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask (14) is disposed on the conductive film, with the mask having openings which expose selected areas (16, 18) of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas (20, 22) of a circuit carrier (24), such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse. In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

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