公开(公告)号：GB2500965A

公开(公告)日：2013-10-09

申请号：GB201301546

申请日：2013-01-29

Applicant: IBM

Inventor： PARIDA PRITISH RANJAN ,  CHAINER TIMOTHY JOSEPH ,  IYENGAR MADHUSUDAN ,  MILNES DAVID PAUL ,  SIMONS ROBERT

IPC: G06F1/20 ,  F24F11/00 ,  F24F11/02 ,  G05D23/19 ,  H05K7/20

Abstract: A cooling system such as an intra-rack cooling system 500 of a data centre comprises: one or more nodes, such as servers 300, each node having at least one temperature sensor to monitor a temperature of the node components; an air-to-liquid heat exchanger 402 configured to accept a liquid coolant input, preferably via a first shut-off valve 504, to provide cooled air to the one or more nodes; and a temperature sensor to monitor a temperature of air Tai provided by the heat exchanger. The cooling system also comprises a direct liquid cooling apparatus to provide liquid coolant to components of the one or more nodes, preferably an inlet plenum 404, i.e. manifold, and an outlet plenum 406. The apparatus supplies cold input coolant 412, preferably via a second shut-off valve 506, to the one or more nodes and ejects warm coolant 410. A valve, ideally a three-way valve 502, is configured to control a proportion of the coolant flow directed to the heat exchanger and the one or more nodes based upon the monitored temperatures. A flow rate of coolant is also controlled based upon the monitored temperatures, preferably by varying the pump strength of a pump 401.

公开(公告)号：DE602005005859D1

公开(公告)日：2008-05-15

申请号：DE602005005859

申请日：2005-12-07

Applicant: IBM

Inventor： CAMPBELL LEVI ,  CHU RICHARD ,  ELLSWORTH MICHAEL ,  IYENGAR MADHUSUDAN ,  SCHMIDT ROGER ,  SIMONS ROBERT

IPC: H05K7/20 ,  F25D23/12 ,  H01L23/473

Abstract: A cooling approach is provided for one or more subsystems of an electronics rack. The cooling approach employs a coolant distribution unit and a thermal dissipation unit. The coolant distribution unit has a first heat exchanger, a first cooling loop and a second cooling loop. The first cooling loop passes facility coolant through the first heat exchanger, and the second cooling loop provides system coolant to an electronics subsystem, and expels heat in the first heat exchanger from the subsystem to the facility coolant. The thermal dissipation unit is associated with the electronics subsystem and includes a second heat exchanger, the second cooling loop, and a third cooling loop. The second cooling loop provides system coolant to the second heat exchanger, and the third cooling loop circulates conditioned coolant within the electronics subsystem and expels heat in the second heat exchanger from the electronics subsystem to the system coolant.