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公开(公告)号：CA2427426C
公开(公告)日：2008-02-19
申请号：CA2427426
申请日：2001-11-23
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE
Abstract: A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement and a second thermoelement electrically coupled to the first thermoelement. An array of first tips are in close physical proximity to, but not necessarily in physical contact with, the first thermoelement at a first set of discrete points. An array of second tips are in close physical proximity to, but not necessarily in physical contact with, the second thermoelement at a second set of discrete points. The arrays of first and second tips are constructed from metal, thus reducing parasitic resistances.
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公开(公告)号：CA2427426A1
公开(公告)日：2002-06-13
申请号：CA2427426
申请日：2001-11-23
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE
Abstract: A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement and a second thermoelement electrically coupled to the first thermoelement. An array of first tips are in close physical proximity to, but not necessarily in physical contact with, the first thermoelement at a first set of discrete points. An array of second tips are in close physical proximity to, but not necessarily in physical contact with, the second thermoelement at a second set of discrete points. The arrays of first and second tips are constructed from metal, thus reducing parasitic resistances.
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23.发明专利
公开(公告)号：SG67582A1
公开(公告)日：1999-09-21
申请号：SG1998005006
申请日：1998-11-27
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: A thermoelectric element (1) is coupled to a hot sink (6) and a cold sink (4) through respective switches (7,8) which are closed to establish thermal coupling of hot sink and cold sink with the thermoelectric element. A controller (9) selectively actuates the switches which has microelectro mechanical device, so as to establish a potential difference across the thermoelectric element. The duty cycle of the voltage occurs the thermoelectric element correlates with that of the two switches. The duty cycle of the switch (7) for selective switching is lesser than that of the switch (8). An independent claim is included for operating method of thermoelectric cooling apparatus.
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公开(公告)号：GB2364439B
公开(公告)日：2004-09-15
申请号：GB0100661
申请日：2001-01-11
Applicant: IBM
Inventor： CORDES MICHAEL JAMES , CORDES STEVEN ALAN , GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE , SPEIDELL JAMES LOUIS
Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.
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公开(公告)号：GB2364439A
公开(公告)日：2002-01-23
申请号：GB0100661
申请日：2001-01-11
Applicant: IBM
Inventor： CORDES MICHAEL JAMES , CORDES STEVEN ALAN , GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE , SPEIDELL JAMES LOUIS
Abstract: A semiconductor device is fabricated by forming an integrated circuit 309 on a front side of a substrate 303 and forming an integrated thermoelectric cooler 310 on a back side of the substrate. A first thermal sink 314 of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N- type thermoelectric elements 328,330 are formed on contacts formed on the first thermal sink. P-type thermoelectric elements 358,360 are formed on contacts formed on a second thermal sink 339 of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.
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Patent Agency Ranking
公开(公告)号：HU0100405A2
公开(公告)日：2001-06-28
申请号：HU0100405
申请日：1998-11-12
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: Apparatus and method for sub-ambient cooling using thermoelectric element dynamics in conjunction with pulsed electrical power and selectively enabled thermal coupling to the cold sink. In one form, Peltier devices are dynamically enabled using pulses of electrical power while the thermal path between the cold side of the Peltier device and the cold sink is selectively switched in relative synchronism between conductive states responsive to the dynamics of the Peltier device temperatures. Switched coupling of the thermal connection between the cold sink and the Peltier device materially improves efficiency by decoupling Joule heating and conductive heat transfer losses otherwise conveyed from the Peltier device. Preferable implementations utilizes MEMS to accomplish the selective thermal switching, whereby sub-ambient cooling capacity is increased by parallel operation of multiple Peltier devices and MEMS switches.
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公开(公告)号：DE60318724D1
公开(公告)日：2008-03-06
申请号：DE60318724
申请日：2003-07-10
Applicant: IBM
Inventor： BURNS JEFFREY L , DRAKE ALAN J , GHOSHAL UTTAM SHYAMALINDU , NOWKA KEVIN J
Abstract: A system and integrated circuit (die) including a clock generator that includes an on-chip inductor and uses the inherent capacitance of the load to generate a sinusoidal clock signal. The inductor is connected between a current source and an inverting switch. The output of the switch is a substantially sinusoidal signal that connected directly to at least a portion of the clock driven circuits without intermediate buffering. In the preferred embodiment, the clock generator is a dual phase design that includes a pair of cross-coupled MOSFET's, a pair of solid state on-chip inductors, and a current source. Each of the on-chip inductors is connected between the current source and the drain of one of the MOSFET's. The outputs of the clock generator are provided directly to the clock inputs of at least a portion of the clock driven circuits on the die. In this embodiment, the frequency of the clock generator output signal is predominantly determined by the inductance of the inductive elements and the capacitance of the clock driven circuitry. This design eliminates the need for incorporating distinct capacitor elements in the clock generator itself and produces a clock generator in which a significant portion of the power oscillates between the generator's inductive elements and the capacitive elements of the load thereby reducing the power required to be supplied by the current source.
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28.发明专利
公开(公告)号：MY119737A
公开(公告)日：2005-07-29
申请号：MYPI9804835
申请日：1998-10-23
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: APPARATUS AND METHOD FOR SUB-AMBIENT COOLING USING THERMOELECTRIC ELEMENT DYNAMICS IN CONJUNCTION WITH PULSED ELECTRICAL POWER AND MULTIPLE SELECTIVELY ENABLED THERMAL SWITCHES (7,8,23,24). IN ONE FORM, PELTIER DEVICES (1) ARE DYNAMICALLY ENABLED USING PULSES OF ELECTRICAL POWER WHILE THE THERMAL PATHS, BETWEEN THE COLD AND HOT SIDES (12,11) OF THE DEVICE (1) ARE SELECTIVELY SWITCHED CONDUCTION STATE RESPONSIVE TO THE TEMPERATURE DYNAMICS WITHIN THE PELTIER DEVICE (1). SWITCHED COUPLING OF THE THERMAL CONNECTIONS IN RELATIVE SYNCHRONISM TO THE PELTIER DEVICE ELECTRICAL AND THERMAL DYNAMICS MATERIALLY IMPROVES EFFICIENCY BY DECOUPLING JOULE HEATING AND CONDUCTIVE HEAT TRANSFER LOSSES OTHERWISE AFFECTING THE NET HEAT TRANSFER. PREFERABLE IMPLEMENTATIONS UTILIZES MEMS TO ACCOMPLISH THE SELECTIVE SWITCHING, WHEREBY SUB-AMBIENT COOLING CAPACITY IS INCREASED BY PARALLEL OPERATION OF MULTIPLE PELTIER DEVICES (21) AND MEMS SWITCHES (23,24).
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公开(公告)号：AU2003250200A8
公开(公告)日：2004-03-11
申请号：AU2003250200
申请日：2003-07-10
Applicant: IBM
Inventor： BURNS JEFFREY L , GHOSHAL UTTAM SHYAMALINDU , DRAKE ALAN J , NOWKA KEVIN J
Abstract: A system and integrated circuit (die) including a clock generator that includes an on-chip inductor and uses the inherent capacitance of the load to generate a sinusoidal clock signal. The inductor is connected between a current source and an inverting switch. The output of the switch is a substantially sinusoidal signal that connected directly to at least a portion of the clock driven circuits without intermediate buffering. In the preferred embodiment, the clock generator is a dual phase design that includes a pair of cross-coupled MOSFET's, a pair of solid state on-chip inductors, and a current source. Each of the on-chip inductors is connected between the current source and the drain of one of the MOSFET's. The outputs of the clock generator are provided directly to the clock inputs of at least a portion of the clock driven circuits on the die. In this embodiment, the frequency of the clock generator output signal is predominantly determined by the inductance of the inductive elements and the capacitance of the clock driven circuitry. This design eliminates the need for incorporating distinct capacitor elements in the clock generator itself and produces a clock generator in which a significant portion of the power oscillates between the generator's inductive elements and the capacitive elements of the load thereby reducing the power required to be supplied by the current source.
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公开(公告)号：CA2426562A1
公开(公告)日：2002-06-20
申请号：CA2426562
申请日：2001-12-11
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
IPC: H01L23/38 , H01L23/522 , H01L35/00 , H01L23/66
Abstract: An apparatus for cooling selected elements within an integrated circuit, suc h as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrat ed circuit element, a thermoelectric cooler thermally coupled to the cold plate ; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circu it element is dissipated into the atmosphere surrounding the integrated circuit . In another form, the hot plate is embedded in the integrated circuit substra te to locally cool elements of the integrated circuit while dumping the heat in to the substrate.
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