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公开(公告)号：HU0104678A2
公开(公告)日：2002-03-28
申请号：HU0104678
申请日：1999-11-29
Applicant: IBM
Inventor： BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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公开(公告)号：CZ20011889A3
公开(公告)日：2002-02-13
申请号：CZ20011889
申请日：1999-11-29
Applicant: IBM
Inventor： BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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Patent Agency Ranking
公开(公告)号：CA2352168A1
公开(公告)日：2000-06-08
申请号：CA2352168
申请日：1999-11-29
Applicant: IBM
Inventor： CORDES MICHAEL JAMES , BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas (10, 12, 15) of red, green and blue, are serially formed in an overall pixel area (9), on a transparent substrate (2), and after each individual color sub pixel element formation, a layer of protective transparent material (11, 14, 16) is applied over the individual sub pixel element (10, 12, 15) and the pixel area before formatio n of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability , reliability, yield, cost, and throughput.
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公开(公告)号：GB2364439B
公开(公告)日：2004-09-15
申请号：GB0100661
申请日：2001-01-11
Applicant: IBM
Inventor： CORDES MICHAEL JAMES , CORDES STEVEN ALAN , GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE , SPEIDELL JAMES LOUIS
Abstract: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.
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公开(公告)号：GB2364439A
公开(公告)日：2002-01-23
申请号：GB0100661
申请日：2001-01-11
Applicant: IBM
Inventor： CORDES MICHAEL JAMES , CORDES STEVEN ALAN , GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE , SPEIDELL JAMES LOUIS
Abstract: A semiconductor device is fabricated by forming an integrated circuit 309 on a front side of a substrate 303 and forming an integrated thermoelectric cooler 310 on a back side of the substrate. A first thermal sink 314 of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N- type thermoelectric elements 328,330 are formed on contacts formed on the first thermal sink. P-type thermoelectric elements 358,360 are formed on contacts formed on a second thermal sink 339 of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.
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公开(公告)号：CA2352168C
公开(公告)日：2005-07-05
申请号：CA2352168
申请日：1999-11-29
Applicant: IBM
Inventor： CORDES STEVEN ALLEN , DOYLE JAMES PATRICK , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , BUDD RUSSELL ALAN
Abstract: Three component color sub-pixel element areas (10, 12, 15) of red, green and blue, are serially formed in an overall pixel area (9), on a transparent substrate (2), and after each individual color sub pixel element formation, a layer of protective transparent material (11, 14, 16) is applied over the individual sub pixel element (10, 12, 15) and th e pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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公开(公告)号：PL347975A1
公开(公告)日：2002-05-06
申请号：PL34797599
申请日：1999-11-29
Applicant: IBM
Inventor： BUDD RUSSELL ALAN , CHIU GEORGE LIANG-TAI , CORDES MICHAEL JAMES , CORDES STEVEN ALLEN , DOYLE JAMES PATRICK
Abstract: Three component color sub-pixel element areas of red,green and blue, are serially formed in an overall pixel area, on a transparent substrate, and after each individual color sub pixel element formation, a layer of protective transparent material is applied over the individual sub pixel element and the pixel area before formation of the next sub pixel element. The protective layers render the sub pixel elements unaffected by the processing of subsequent sub pixel members where such conditions as high temperature curing, hardening agents or hardening processes are involved, whereby advantages are achieved in manufacturability, reliability, yield, cost, and throughput.
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