公开(公告)号：DE19833928B4

公开(公告)日：2005-05-25

申请号：DE19833928

申请日：1998-07-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOUDEAU DETLEF ,  FISCHBACH REINHARD

IPC: G06K9/00 ,  G07C9/00 ,  H05K1/18 ,  A61B5/117

Abstract: The invention relates to a sensor device for detecting biometric characteristics, especially finger prints, wherein electronic components (12, 14) are disposed on the flexible conductor strip (8) where they are electrically connected to the strip conductors (7).

公开(公告)号：DE50002549D1

公开(公告)日：2003-07-17

申请号：DE50002549

申请日：2000-08-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANK MANFRED ,  KROENINGER WERNER ,  KOEPNICK RENATE ,  HUMMEL RICHARD ,  FISCHBACH REINHARD ,  OPOLKA HEINZ

IPC: G01B7/28 ,  A61B5/1172 ,  C10M107/38 ,  C10M107/50 ,  C10M173/00 ,  G06K9/00 ,  H01L23/29 ,  H01L23/31

Abstract: To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

公开(公告)号：AT242899T

公开(公告)日：2003-06-15

申请号：AT00958203

申请日：2000-08-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRANK MANFRED ,  KROENINGER WERNER ,  KOEPNICK RENATE ,  HUMMEL RICHARD ,  FISCHBACH REINHARD ,  OPOLKA HEINZ

IPC: G01B7/28 ,  A61B5/1172 ,  C10M107/38 ,  C10M107/50 ,  C10M173/00 ,  G06K9/00 ,  H01L23/29 ,  H01L23/31

Abstract: To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

公开(公告)号：AT222010T

公开(公告)日：2002-08-15

申请号：AT99936259

申请日：1999-05-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHBACH REINHARD ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  A61B5/1172 ,  G06F3/041 ,  G06K9/00 ,  G06K9/20 ,  G06K9/62 ,  G06K11/06 ,  G06T1/00 ,  G06K11/16

Abstract: The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

公开(公告)号：AU5460901A

公开(公告)日：2001-10-15

申请号：AU5460901

申请日：2001-03-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHBACH REINHARD ,  FRIES MANFRED ,  ZAESKE MANFRED

IPC: H01L23/28 ,  H01L21/56

Abstract: A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

公开(公告)号：BR9912812A

公开(公告)日：2001-05-02

申请号：BR9912812

申请日：1999-07-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  MUENCH THOMAS ,  FISCHBACH REINHARD

IPC: G01B7/34 ,  A61B5/1172 ,  G01B7/28 ,  G01B21/00 ,  G06K9/00 ,  G06T1/00 ,  G07C9/00 ,  H01L23/12

Abstract: In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.