Abstract:
PROBLEM TO BE SOLVED: To provide a composition that may form a cured film with high flatness and is suitably used to form a liquid crystal display element and a protective film for solid state image sensors excellent in developability and heat-resistance, to provide a composition having excellent storage stability, to provide a method of forming a protective film using the composition, and to provide a protective film formed from the following composition. SOLUTION: The resin composition for forming a radiation sensitive protective film comprises [A] (a1) an unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (a2) an epoxy group-containing unsaturated compound, and (a3) a copolymer consisting of another unsaturated compound, [B] a monofunctional polymerizable unsaturated compound having carboxyl groups with molecular weight of ≥180, [C] a multifunctional polymerizable unsaturated compound, and [D] a photoinitiator. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having a sufficient process margin, capable of suppressing contamination of a kiln, a photomask, etc., due to sublimation of a photoinitiator component, and having adhesion, transparency and heat resistance required for a protective film material, and resolution and compression property required for a spacer material. SOLUTION: The photosensitive resin composition contains [A] a copolymer of (a1) an ethylenically unsaturated carboxylic acid and/or an ethylenically unsaturated carboxylic acid anhydride and (a2) another ethylenically unsaturated compound, [B] a polymerizable compound having an ethylenically unsaturated bond, and [C] a photopolymerization initiator comprising a compound represented by formula (1). COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin composition which can acquire a sufficient spacer configuration even in low the exposure with high sensitivity and high resolution and also can form a spacer for a liquid crystal display element excellent in elastic recovery, rubbing resistance, adhesiveness with a transparent substrate, heat resistance, resistance to release liquid, etc. SOLUTION: The radiation sensitive resin composition comprises a polymer which is obtained by reacting a copolymer of (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride with (a2) a two or more hydroxyl groups-containing unsaturated compound expressed by formula (1) (wherein R 1 represents hydrogen atom or methyl group; p is an integer of 0-3 and q is an integer of 1-12) and (a3) another unsaturated compound with a methacryloyloxyalkyl isocyanate. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having no problem with safety, excellent in sensitivity, resolution and storage stability, having good development margin, capable of forming an interlayer insulation film having excellent solvent resistance, heat resistance, light transmittance and adhesion, and capable of forming microlenses having excellent solvent resistance, heat resistance, light transmittance and adhesion, and also having a good melt shape. SOLUTION: The radiation sensitive resin composition contains [A] an alkali-soluble copolymer obtained by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, (a2) an unsaturated compound having an oxetane ring structure and (a3) an olefinically unsaturated compound other than the above components, [B] a 1,2-quinonediazido compound and [C] an antimony-free thermosensitive acid generating compound. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition solution for spacer formation giving an even film uniform in thickness and suitable for a slit die coater method in which a reduced-pressure drying step is carried out in a short time. SOLUTION: The photosensitive resin composition comprises (A) a copolymer of at least one selected from the group consisting of ethylenically unsaturated carboxylic acids and ethylenically unsaturated carboxylic acid anhydrides, an epoxy group-containing ethylenically unsaturated compound, and another ethylenically unsaturated compound different from those, (B) a polymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein a solid concentration X (wt.%) and a viscosity Y (mPa s) at 25°C satisfy relationships of LogY≤0.04X-0.08 (1), LogY≥0.04X-0.50 (2), LogY≥0.30 (3) and LogY≤1.08 (4). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition which can form highly flat cured films, is suitably be used for forming optical device-protecting films having high transparency, surface hardness and various kinds of excellent resistance such as heat and pressure resistance, acid resistance, alkali resistance, spattering resistance, and etching resistance, and has excellent storage stability, to provide a method for forming a protecting film from the composition, and to provide a protecting film formed from the composition. SOLUTION: This composition comprises a copolymer comprising (a1) polymerization units originated from a polymerizable unsaturated compound having an oxiranyl group or oxetanyl group, (a2) polymerization units originated from a polymerizable unsaturated compound having a specific structure and represented by 1-diethylpropyl methacrylate, and (a3) polymerization units different from the polymerization units (a1) and (a2). The protecting film is formed from the composition. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition excellent in contrast, capable of forming a fine resist pattern with a high degree of accuracy and excellent also in transparency to a radiation, sensitivity and resolution. SOLUTION: The radiation-sensitive resin composition comprises (A) a resin comprising an acid-dissociable group-containing norbornene compound typified by 5-[(1-methylcyclohexyl)oxycarbonyl]norbornene or 5-(2-methyl-1- adamantyloxycarbonyl)norbornene and maleic anhydride, (B) a radiation-sensitive acid generator and (C) a compound typified by a di-t-butyl 1,3- adamantanedicarboxylate or 2,5-dimethyl-2,5-di(1-adamantylcarbonyloxy)hexane. Preferably the resin (A) further comprises a polar group-containing alicyclic ester of (meth)acrylic acid typified by 3-hydroxy-1-adamantyl (meth)acrylate. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a novel norbornene-based compound having high transpar ency to radiation and excellent in sensitivity, resolution, pattern shape or the like and also having small variation in line width to temperature change when heated after exposure and is usable as a raw material or the like of a resin component in a chemical amplification type resist, provide a polymer of the compound, and also provide a radiation-sensitive resin composition containing a copolymer of the compound and a maleic anhydride. SOLUTION: The norbornene compound is represented by 5-[(2-norbornyl) methoxycarbonyl]norbornene, 5-[1-(2-methyl-2-norbornyl) ethoxycarbonyl]norbornene, 8-[(2-norbornyl) methoxycarbonyl]tetracyclo[4.4.1.12,5.17,10]dodecane or the like. The polymer is represented by the polymer of the norbornene-based compound or the like. The radiation-sensitive resin composition contains the copolymer of the norbornene-based compound or the like and the meleic anhydride and a radiation-sensitive acid generating agent.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in basic physical properties as a resist, e.g. sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a low molecular compound obtained by preparing a compound having one or more amino groups with at least one hydrogen atom bonding to a nitrogen atom and substituting a t-butoxycarbonyl group for one or more of such hydrogen atoms bonding to a nitrogen atom, (B) a radiation sensitive acid generating agent and (C) an alkali-insoluble or slightly alkali-soluble acid dissociable group- containing resin having an alicyclic structure in the principal chain and/or a side chain and a carboxylic acid anhydride structure in a side chain and convertible to an alkali-soluble resin when the acid dissociable group is dissociated.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent particularly in pattern shape as a chemical amplification type resist and excellent also in balance of characteristics including dry etching resistance, sensitivity and resolution. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid dissociable group-containing resin which is made alkali-soluble when the acid dissociable group is dissociated, (B) a radiation sensitive acid generating agent and (C) an abietic acid derivative of formula 1 [where R1-R4 are each H, hydroxyl, a 1-4C linear or branched alkyl or a 1-4C linear or branched alkoxyl and R5 is H, an optionally substituted 1-20C alkyl or -CH2COO6 (R6 is a 1-18C alkyl)].