Abstract:
The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.
Abstract:
The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.
Abstract:
The present invention is directed to the preparation of photoresist polymers via living free radical polymerization techniques. Sterically bulky ester monomers are utilized as the polymerization components. Use of chain transfer agents is included in polymerization processing conditions. Cleavage of polymer terminal end groups that include a heteroatom are described.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition nearly free from development defect and to provide a polymer used therefor.SOLUTION: The radiation sensitive resin composition contains a polymer (A)having a carbonyl group on at least one terminal of a molecular chain, having weight average molecular weight in terms of polystyrene by gel permeation chromatography of ≥11,000 and decomposed by action of an acid and increasing solubility in an alkali developer and a radiation-sensitive acid generator (B).
Abstract:
PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition of which a first resist pattern is insolubilized to form an insolubilized resist pattern having sufficient stability to subsequent exposure, a developer and a second positive radiation-sensitive resin composition. SOLUTION: The positive radiation-sensitive resin composition contains a resin containing 5-65 mol% of a specific repeating unit and having an acid-dissociable group, and is used in step (1) of a resist pattern forming method including the steps of: (1) forming a first resist pattern; (2) applying a resist pattern insolubilizing resin composition on the first resist pattern to convert the first resist pattern to an insolubilized resist pattern; (3) forming a second resist layer on the insolubilized resist pattern and selectively exposing it; and (4) forming a second resist pattern. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high transparency to a radiation, excellent basic properties as a resist such as sensitivity, resolution, dry etching resistance and pattern shape, particularly excellent solubility in a resist solvent, and reducing the roughness of a side wall of a pattern after development. SOLUTION: The radiation-sensitive resin composition contains: an acid-dissociating group-containing resin which is alkali-insoluble or slightly alkali-soluble but becomes readily alkali-soluble by the action of an acid; and a radiation-sensitive acid generator. The acid-dissociating group-containing resin is obtained by polymerizing (i) a compound represented by formula (1) or (ii) a mixture of a compound represented by the formula (1) and one or more compounds selected from a radical polymerization initiator and a ditelluride compound represented by formula (2). COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition as a chemically amplifying resist which is sensitive to active radiation, for example, far UV rays represented by KrF excimer laser or ArF excimer laser and which can form a resist pattern with excellent uniformity in film thickness, excellent adhesion property with a substrate, accuracy, sensitivity, resolution and so on. SOLUTION: The radiation sensitive resin composition contains: (A) an alkali insoluble or alkali hardly soluble resin containing an acid-dissociable group which changes into alkali soluble when the acid dissociable group is dissociated; (B) a radiation sensitive acid producing agent; and (C) a compound expressed by general formula (1) as a solvent. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide an acid diffusion controlling agent with which a photoresist composition excellent in LWR (line width roughness) performance, EL (exposure latitude) performance and pattern features can be prepared.SOLUTION: The acid diffusion controlling agent comprises a nitrogen-containing compound which includes a group having -SO- or -SO- in a carbon-carbon bond of a monovalent hydrocarbon group having 2 to 30 carbon atoms. The nitrogen-containing compound is preferably a compound expressed by formula (1) shown below. In formula (1), Rand Rrepresent a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms, and Rand Rmay be bonded to each other together with a nitrogen atom bonded thereto to form a ring structure; X represents a single bond, a carbonyl group, an ether group, an imino group, a divalent hydrocarbon group having 1 to 20 carbon atoms, or a group composed of a combination of these groups; Y represents a group having -SO- or -SO- in a carbon-carbon bond of a monovalent hydrocarbon group having 2 to 30 carbon atoms, and a part of or the entire hydrogen atoms in the group represented by Y may be substituted.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition as a material for a resist film with which a resist pattern having a small LWR (line width roughness) and a wide DOF (depth of focus) can be formed. SOLUTION: The radiation-sensitive resin composition contains a polymer (A) having a repeating unit expressed by formula (1) by not less than 40 mol%, and an acid generator (B). In formula (1), R 1 represents a hydrogen atom or the like; R 2 represents an alkyl group; R 3 represents a carbon atom; and Z represents an alicyclic skeleton. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation:要解决的问题:提供一种作为抗蚀剂膜的材料的辐射敏感性树脂组合物,可以形成具有小LWR(线宽粗糙度)和宽DOF(深度聚焦)的抗蚀剂图案。 解决方案:辐射敏感性树脂组合物含有由式(1)表示的重复单元不低于40mol%的聚合物(A)和酸产生剂(B)。 在式(1)中,R“1”表示氢原子等; R 2 SP>表示烷基; R 3 SP>表示碳原子; Z表示脂环骨架。 版权所有(C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, which is free from problems of a radiation-sensitive acid generator, having a perfluoroalkyl sulfonyl structure such as PFOS (perfluoro-n-octane sulfonic acid), which has characteristics of excellent resolution performance, no vaporization of an acid generated by exposure, and an appropriately short diffusion length, and which gives a small LWR (line width roughness) as an index of fluctuation in the line width of a resist pattern, and can give a resist pattern having a small film reduction. SOLUTION: The radiation-sensitive resin composition comprises (A) a radiation-sensitive acid generator, having a partial fluoroalkyl structure and (B) a resin having a specified cyclic carbonate structure. COPYRIGHT: (C)2011,JPO&INPIT