公开(公告)号：US20140295623A1

公开(公告)日：2014-10-02

申请号：US13853255

申请日：2013-03-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H01L21/56

CPC classification number: H01L21/4846 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/562 ,  H01L2221/68345 ,  H01L2224/73204

Abstract: Disclosed is a method of packaging a chip and a substrate, including the steps of forming a substrate with a thickness ranging from 70 to 150 μm, which comprises a dielectric layer, a circuit metal layer stacked on the dielectric layer and bonding pads higher than the dielectric layer by 10 to 15 μm; forming a stabilizing structure around the substrate to provide a receiving space; disposing the chip on the receiving space and bonding the pins of the chip with the bonding pads; and filling up the receiving space under the chip with a filling material to a total thickness ranging from 300 to 850 μm. Without the plastic molding process, the present invention reduces the cost and the total thickness, and further prevents the substrate from warping by use of the stabilizing fixing structure.

Abstract translation: 公开了一种封装芯片和基板的方法，包括以下步骤：形成厚度范围为70-150μm的基板，该基板包括介电层，堆叠在电介质层上的电路金属层和高于 介电层10〜15μm; 在所述基板周围形成稳定结构以提供接收空间; 将芯片放置在接收空间上，并将芯片的引脚与焊盘接合; 并用填充材料填充芯片下方的接收空间，总厚度为300至850μm。 没有塑料成型工艺，本发明降低了成本和总厚度，并且通过使用稳定固定结构进一步防止了基板翘曲。

公开(公告)号：US20190269008A1

公开(公告)日：2019-08-29

申请号：US16408431

申请日：2019-05-09

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Chin-Kuan Liu ,  Chao-Lung Wang ,  Shuo-Hsun Chang ,  Yu-Te Lu ,  Chin-Hsi Chang

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/06 ,  H05K1/09

Abstract: A manufacturing method for a multi-layer circuit board is provided. According to the multi-layer circuit board manufactured by the manufacturing method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.

公开(公告)号：US09198296B1

公开(公告)日：2015-11-24

申请号：US14590235

申请日：2015-01-06

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  Fu-Song Chen

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/187 ,  H05K1/0213 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/183 ,  H05K1/185 ,  H05K2201/0376

Abstract: A double sided board with buried element and a method for manufacturing the same are disclosed. At least one buried element is fixed on a dielectric layer and embedded in an insulation layer. First and second electrical circuits are formed on upper and lower surfaces of the insulation layer, respectively. At least one through-hole is formed in the insulation layer and filled with a conductive layer to electrically connect the first and the second electrical circuits. The dielectric layer beneath the buried element and the insulation layer above the buried element are provided with at least one opening, respectively, which is filled with the conductive layer, thereby connecting the conductive layer and external circuits or electrical elements. Additionally, the first and second electrical circuits are covered with first and second solder masks, respectively, so as to avoid environmental effect and improve preciseness of the circuits.

Abstract translation: 公开了一种具有埋设元件的双面板及其制造方法。 至少一个埋入元件固定在电介质层上并嵌入绝缘层中。 第一和第二电路分别形成在绝缘层的上表面和下表面上。 在绝缘层中形成至少一个通孔，并填充有导电层以电连接第一和第二电路。 掩埋元件下面的绝缘层和掩埋元件上方的绝缘层分别设置有至少一个开口，其中填充有导电层，由此连接导电层和外部电路或电气元件。 此外，第一和第二电路分别被第一和第二焊接掩模覆盖，以避免环境影响并提高电路的精度。

公开(公告)号：US09095085B2

公开(公告)日：2015-07-28

申请号：US13853325

申请日：2013-03-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4647 ,  H05K3/4038 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield.

Abstract translation: 公开了一种制造堆叠多层结构的方法，包括以下步骤：在基板上形成具有凸块的第一电路层，冲压铝板以形成与凸块相对应的凹部，在包括玻璃纤维层的塑料膜中形成开口 对铝合金板，塑料薄膜和基板进行压制，去除铝板，进行抛光以使所得表面平坦化，形成连接到第一电路层的第二电路层，最后移除基板以形成叠层多层 结构体。 由于塑料膜中的玻璃纤维层在研磨后不露出，所以介电层的厚度均匀，电路层的可靠性得以提高，从而提高产率。

公开(公告)号：US08875390B2

公开(公告)日：2014-11-04

申请号：US13663274

申请日：2012-10-29

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H01K3/00

CPC classification number: H05K3/4682 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/4916

Abstract: A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem.

Abstract translation: 一种叠层电路板的制造方法，其特征在于，包括使所述基板金属化以形成所述基底层的顺序步骤，形成所述第一电路金属层，形成至少一个绝缘层和交替插入的至少一个第二电路金属层，去除所述基板， 公开了形成支撑框架并形成阻焊剂的方法。 层叠电路板的厚度小于150μm。 在去除衬底之后，通过图案转印工艺在基层的边缘上形成不与第一电路金属层重叠的支撑框架。 由至少一个金属层形成的基底层没有被完全去除。 支撑框架对整个层叠电路板提供增强的物理支撑，而不影响第二电路金属层中的电路的电连接，从而解决翘曲问题。

公开(公告)号：US20140290057A1

公开(公告)日：2014-10-02

申请号：US13853325

申请日：2013-03-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K3/46

CPC classification number: H05K3/4647 ,  H05K3/4038 ,  H05K2203/025 ,  H05K2203/063 ,  Y10T29/49155

Abstract: Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield.

Abstract translation: 公开了一种制造堆叠多层结构的方法，包括以下步骤：在基板上形成具有凸块的第一电路层，冲压铝板以形成与凸块相对应的凹部，在包括玻璃纤维层的塑料膜中形成开口 对铝合金板，塑料薄膜和基板进行压制，去除铝板，进行抛光以使所得表面平坦化，形成连接到第一电路层的第二电路层，最后移除基板以形成叠层多层 结构体。 由于塑料膜中的玻璃纤维层在研磨后不露出，所以介电层的厚度均匀，电路层的可靠性得以提高，从而提高产率。

公开(公告)号：US08766102B2

公开(公告)日：2014-07-01

申请号：US13663303

申请日：2012-10-29

Applicant: Kinsus Interconnect Technology Corp.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K1/03 ,  H05K7/02

CPC classification number: H05K1/056 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09054 ,  H05K2203/0323 ,  H05K2203/0384 ,  H05K2203/063 ,  H01L2924/00

Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.

Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。

公开(公告)号：US20140116757A1

公开(公告)日：2014-05-01

申请号：US13663303

申请日：2012-10-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K1/05

CPC classification number: H05K1/056 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/09054 ,  H05K2203/0323 ,  H05K2203/0384 ,  H05K2203/063 ,  H01L2924/00

Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.

Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。

公开(公告)号：US20140115889A1

公开(公告)日：2014-05-01

申请号：US13663274

申请日：2012-10-29

Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.

Inventor： Ting-Hao Lin ,  Yu-Te Lu ,  De-Hao Lu

IPC: H05K3/10

CPC classification number: H05K3/4682 ,  H05K1/0271 ,  H05K2201/09136 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/0376 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/4916

Abstract: A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem.

Abstract translation: 一种叠层电路板的制造方法，其特征在于，包括使所述基板金属化以形成所述基底层的顺序步骤，形成所述第一电路金属层，形成至少一个绝缘层和交替插入的至少一个第二电路金属层，去除所述基板， 公开了形成支撑框架并形成阻焊剂的方法。 层叠电路板的厚度小于150μm。 在去除衬底之后，通过图案转印工艺在基层的边缘上形成不与第一电路金属层重叠的支撑框架。 由至少一个金属层形成的基底层没有被完全去除。 支撑框架对整个层叠电路板提供增强的物理支撑，而不影响第二电路金属层中的电路的电连接，从而解决翘曲问题。