POLYIMIDE
    21.
    发明专利

    公开(公告)号:JPH0517575A

    公开(公告)日:1993-01-26

    申请号:JP16791591

    申请日:1991-07-09

    Abstract: PURPOSE:To provide an almost colorless polyimide produced by using a specified tetracarboxylic acid dianhydride and an ether diamine as the raw materials, excellent in thermal resistance, thermoresistant adhesion and processability and showing a remarkably high light ray transmittance. CONSTITUTION:With (A) 2,2-bis(3,4-dicarboxyphenyl)-hexafluoropropane dianhydride of formula I, (B) an ether diamine of formula II (X is direct bond, 1-10C divalent linear hydrocarbon group, hexafluorized isopropylidene group, etc., and amino group-bonded position is meta or para to the ether bond) is reacted in an organic solvent (e.g. N-dimethylformamide) at

    PRODUCTION OF POLYIMIDE
    22.
    发明专利

    公开(公告)号:JPH04233944A

    公开(公告)日:1992-08-21

    申请号:JP40862090

    申请日:1990-12-28

    Abstract: PURPOSE:To obtain the subject polyimide excellent in thermal stability and melt flow properties and capable of keeping at high temperatures for a long period without reducing its moldability and workability. CONSTITUTION:With (A) 1mol diamine [e.g. bis(4-(3-aminophenoxy) phenyl) methane] represented by formula I (X is direct bond, 1-10C divalent hydrocarbon, etc.; Y1 to Y4 are H, lower alkyl, etc.), (B) 0.9-1mol tetracarboxylic dianhydride (e.g. ethylenetetracarboxylic dianhydride) shown by formula II (R is >=2C aliphatic group, etc.), (C) 0.01-1mol dicarboxylic anhydride (e.g. phthalic anhydride) represented by formula III (Z is divalent group selected from monocyclic aromatic group, etc.) and (D) 0.001-1mol aromatic monoamine (e.g. aniline) represented by formula IV (Z' is univalent group selected from monocyclic aromatic group, etc.) are polymerized in an organic solvent (e.g. N,N- dimethylformamide) to obtain the objective polyimide shown by formula V.

    PRODUCTION OF POLYIMIDE HAVING GOOD THERMAL STABILITY

    公开(公告)号:JPH02178327A

    公开(公告)日:1990-07-11

    申请号:JP33465588

    申请日:1988-12-28

    Abstract: PURPOSE:To provide the subject polymer having good thermal stability and excellent moldability as well as the original excellent characteristics by condens ing a specific aromatic diamine with a tetracarboxylic acid dianhydride under a specified condition. CONSTITUTION:An aromatic diamine comprising bis{4-[3-(4-aminophenoxy) benzoyl]phenyl}ether of formula I is condensed with a tetracarboxylic acid dianhydride (e.g. pyromellitic acid dianhydride) of formula II (R is a tetravalent group selected from >=2C aliphatic groups, monocyclic aromatic groups, etc.) in a ratio of 0.9-1mol of the compound of formula I per mol of the compound of formula II in the presence of an aromatic monoamine (e.g. aniline) of formula: Z-NH2 (Z is a monovalent group selected from monocyclic aromatic groups, condensed polycyclic aromatic groups, etc.) in an amount of 0.001-1mol per mol of the compound of formula II to provide the objective polymer having units of formula III as the basic skeleton thereof.

    THERMOSETTING RESIN COMPOSITION
    25.
    发明专利

    公开(公告)号:JPH02173066A

    公开(公告)日:1990-07-04

    申请号:JP32763488

    申请日:1988-12-27

    Abstract: PURPOSE:To prepare a thermosetting resin compsn. excellent in impact strength and toughness by compounding a polyaminobismaleimide resin comprising N,N '-4,4'-diphenylmethanebismaleimide and an arom. amine resin with a potassium titanate fiber. CONSTITUTION:100 pts.wt. polyaminobismaleimide resin comprising 100wt.% N,N'-4,4'-diphenylmethanebismaleimide of formula I and 5-100wt.% arom. amine resin of formula II [wherein A is phenylene, alkyl-substd. phenylene, diphenylene, diphenyl ether or naphthylenyl; R is halogen, hydroxyl, 1-4C alkoxy or 1-5C alkyl; R may be the same or different from each other, and may form a ring; lis 1 or 2; m is 0-3; and n is 0-300] is compounded with 10-400 pts.wt. potassium titanate fiber to give a thermosetting resin compsn.

    PROTEIN FILM AND PRODUCTION THEREOF

    公开(公告)号:JPH02170833A

    公开(公告)日:1990-07-02

    申请号:JP32345388

    申请日:1988-12-23

    Abstract: PURPOSE:To obtain a protein film exhibiting high peelability and toughness, having distinct amino acid composition and sequence and suitable as an edible film, etc., by keeping an aqueous solution containing a microorganism-originated amylase, a hydrophilic gelatinizing agent and a crosslinking agent in the form of a flat plate and evaporating water from the solution. CONSTITUTION:The objective protein film is produced by keeping an aqueous solution containing a microorganism-originated amylase, a hydrophilic gelatinizing agent (preferably glycerol, etc.) and/or a crosslinking agent (preferably glutaraldehyde, a zirconium compound, etc.) on a flat plate such as glass plate (preferably at a film-thickness of 0.5-2.0mm) and evaporating water from the solution in a desiccator, etc., (preferably at 20-100 deg.C).

    POLYAMIDE-IMIDE RESIN COMPOSITION
    27.
    发明专利

    公开(公告)号:JPH0253855A

    公开(公告)日:1990-02-22

    申请号:JP20371688

    申请日:1988-08-18

    Abstract: PURPOSE:To obtain a polyamide-imide resin composition having excellent properties of characteristic polyimide and excellent processing properties and/or low water absorption by blending a polyamide-imide with a specific amount of a specific polyimide. CONSTITUTION:(A) 100 pts.wt. aromatic polyamide-imide containing a repeating unit shown by formula I (Ar is trifunctional aromatic group containing one or more benzene rings; Z is bifunctional organic group), preferably one containing repeating units shown by formula II and formula III is blended with (B) >=1 pt.wt. - =2C aliphatic group, alicyclic group or monocyclic aromatic group), mixed in a dry state and kneaded in a molten state to give a composition.

    THERMOSETTING RESIN COMPOSITION
    28.
    发明专利

    公开(公告)号:JPH0253826A

    公开(公告)日:1990-02-22

    申请号:JP20371788

    申请日:1988-08-18

    Abstract: PURPOSE:To obtain the subject composition suitable for adhesive film having excellent heat resistance, mechanical properties and moldability by mixing a polymer having specific repeating unit and specific N,N'-4,4'-diphenylmethane bismaleimide in specific ratio. CONSTITUTION:100 pts.wt. a polymer having repeating unit expressed by formula I (R1 is group expressed by formula II or formula III; X is bifunctional 1-10C hydrocarbon group, etc.; Z is group expressed by formula IV and/or formula V; Y is tetrafunctional aromatic group of non-fused ring bonded with >=2C aliphatic group or alicyclic group, etc.) is mixed with 5-100 pts.wt., preferably 10-80 pts.wt. N,N'-4,4'-diphenylmethane bismaleimide expressed by formula VI and polymerizing catalyst such as benzoyl peroxide, as necessary, preferably in a ratio of 0.1-5wt.% of total weight of the polymer to afford the aimed composition suitable for adhesive of electric or electronic devices, laminating board or molding material.

    AROMATIC POLYESTER IMIDE RESIN COMPOSITION

    公开(公告)号:JPH01319565A

    公开(公告)日:1989-12-25

    申请号:JP15224788

    申请日:1988-06-22

    Abstract: PURPOSE:To obtain aromatic polyether imide-based resin composition for molding having excellent processability and improved heat resistance, chemical resistance and mechanical strength by blending specific thermoplastic polyimide to aromatic polyether imide. CONSTITUTION:(A) 100 pts.wt. aromatic polyether imide is blended with (B) 1-100 pts.wt. thermoplastic polyimide having repeating unit expressed by formula II (R is tetrafunctional group selected from >=2C aliphatic group, cycloaliphatic group or monocyclic aromatic group, etc.), obtained by imidizing of polyamic acid resulted from reaction of ether diamine expressed by formula I and at least one tetracarboxylic dianhydride, by, for instance, preliminary blending of A and B in Henschel mixer, etc., made to powdery, then mixed in molten state at 280-420 deg.C, preferably 300-400 deg.C with twin-screw melt extruder, etc., to afford the aimed aromatic polyether imide resin composition.

    THERMOSETTING RESIN COMPOSITION
    30.
    发明专利

    公开(公告)号:JPH01289862A

    公开(公告)日:1989-11-21

    申请号:JP11836288

    申请日:1988-05-17

    Abstract: PURPOSE:To make it possible to form a thermosetting resin composition which can be molded into a film or the like before curing and is excellent in toughness, adhesiveness and heat resistance after curing by mixing a specified polyamic acid and/or a polyimide obtained by dehydrating it with a specified bismaleimide compound. CONSTITUTION:This thermosetting resin composition comprises 10pts.wt. polymer having repeating units of formula I (wherein R1 is a bivalent group of formula II or III, X is a group selected from among a direct bond, a 1-10C bivalent hydrocarbon group, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxide, Z is formula IV and/or formula V, Y is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a fused polycyclic aromatic group and a nonfused polycyclic aromatic group composed of aromatic groups bonded together directly or through bridging members) and 5-100pts.wt. bismaleimide compound of formula VI (wherein R2 is the same as formula II or III, and X is the same as that in formula III).

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